A7 五、發明說明（1 ) [發明領域] 本發明係有關於一種積艘電路封裝技術，特別是有關 於一種積想電路封裝基板被動元件纽裝方法，其可用以將 一被動元件（passive component)紐裝在一積體電路封裝結 構中的基板（substrate)上。發明背景： 積體電路封裝技術係用以將一個或數個半導體晶片包 容於一封裝膠體之中，藉以使得此些半導體晶片便於處理 及易於安裝至印刷電路板上。球柵陣列（BaU Grid Array， BGA)積體電路封裝技術即為一種半導體業界所習用之封 裝技術。於球栅陣列式封裝結構中，除了晶片之外，亦同 時在基板上組裝有一些被動元件，例如電阻器及電容器。 訂 線 第1Α至1Β圖顯示一種習知之積體電路封裝基板被動 元件組裝方法β如第1Α圖所示，此積體電路封裝結構為 一球柵陣列式封裝結構，其包含一基板1〇、一積體電路晶 片20、一被動元件30、一封裝膠體4〇、以及複數個銲球 50。由於此球柵陣列式封裝結構為半導體業界所習用之結 構’因此於此將不對其作進一步詳細之說明。第圖顯 示第1Α囷所示之積體電路封裝結構中之被動元件3〇的組 裝方式的放大圖《如第1Β圖所示，基板1〇包括一核心部 分l〇a及一元件安裝表面1〇b，且元件安裝表面i〇b設置 有一對鮮塾11、12;其中第一銲墊π用以銲接至被動元 件30之第一端31’而第二銲墊12則用以銲接至被動元件 30之第二端32。 然而上述之被動元件3〇於組裝至基板1〇上後，會有 本紙張尺度適用t g[國家標準㈣S)A4 k格咖X 297公« )---- I 15957 經濟部智慧財產局員工消費合作钍印製 A7 ------------------ 五、發明說明（2 ) 一縫隙13存在於被動元件3〇之底面與基板1〇之上表面之 間。此縫隙13之存在易導致以下之數項問題。 第一個問題為，在後續之植上銲球5〇的製程中，其高 溫環境會導致被動元件30上的一部分銲錫熔化；且此熔化 之銲錫會接著藉由毛細管效應而流入至縫隙13之中，因此 極易致使被動元件30之二端31、32形成橋接短路現象。 若發生此種橋接短路現象，則會導致積體電路晶片2〇無法 正常運作。 第二個問題為，在後續之封裝膠鱧製程中，由於受到 高溫環境及流動樹脂之包覆，此缝隙13之存在易於導致所 謂之氣爆現象（popcorn effect)，致使整個積體電路封裝結 構受到損害》 第三個問題為’在後績之封裝膠體製程中，由於被動 元件30會在高溫環境下受到流動樹脂之衝擊，因此易產生 脫位現象。這是由於被動元件30係僅靠著其二端31、32 上之鲜錫而固接於基板10上，因此牢固力顯然不足。若脫 位現象嚴重’則亦可能於被動元件30處產生斷路現象，導 致積體電路晶片20無法正常運作。 [發明概述] 鑒於以上所述習知技術之缺點，本發明之目的便是在 於提供一種被動元件組裝方法’其可讓組裝好之被動元件 與基板之間不會有縫隙產生，藉此而防止習知技術所可能 導致之橋接短路現象、氣爆現象、及脫位現象，使得最後 完成之積體電路封裝結構具有更佳之品質及可靠度. 11 裝·-----fi訂--------•線 {請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 2 L5957 』42934 Λ7 B7 經濟部智慧財產局員工消t合作社印製 五、發明說明（3 ) 根據以上所述之目的’本發明提出了一種新穎之積趙 電路封裝基板被動元件組裝方法。 本發明之方法的特點在於利用一電絕緣物質，例如為 環氧樹脂，來填充被動元件與基板之間本來會存在之縫 隙。此填充步驟可於銲接好被動元件後才進行；或是先塗 佈好電絕緣物質後，才將被動元件銲接至基板上。 若為銲接好被動元件後才進行電絕緣物質之填充，則 本發明之方法包含以下步騨：（1)於該基板上之預選位置上 設置一對銲墊；（2)將該被動元件銲接至該對銲墊上；於此 有一縫隙形成於該被動元件與該基板之間；（3)將一可固化 之流動性電絕緣物質施加至該被動元件之周邊上；該流動 性電絕緣物接著將藉由毛細管效應而自行填滿該該被動元 件與該基板之間的縫隙；以及（4)固化該被動元件與該基板 之間的縫陈令所填滿之流動性電絕緣物質。 若為先塗佈好電絕緣物質後才將被動元件銲接至基板上， 則本發明之方法包含以下步驟：（1)於該基板上之預選位置 上設置一對銲墊；（2)將一電絕緣物質塗佈至位於該對銲墊 之間的基板區域上，其厚度需至少為等於該被動元件與該 基板之間本來會存在之縫隙距離；以及（3)將該被動元件之 二端分別銲接至該對銲墊上。 由於本發明不會使得被動元件與基板之間存在缝隙’ 因此可解決習知技術的缺點，包括橋接短路現象、氣爆現 象、及脫位現象。本發明因此較習知技術具有更進步之實 用性。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 3 15957 (請先閱讀背面之注意事項再填寫本頁) 裝-------A7 V. Description of the Invention (1) [Field of the Invention] The present invention relates to a packaging technology of a shipbuilding circuit, and in particular, to a method for assembling passive components of a circuit packaging substrate, which can be used to pass a passive component (passive component). ) Is mounted on a substrate in an integrated circuit packaging structure. BACKGROUND OF THE INVENTION: Integrated circuit packaging technology is used to contain one or more semiconductor wafers in a packaging gel, so that these semiconductor wafers are easy to handle and easy to mount on a printed circuit board. Ball grid array (BaU Grid Array, BGA) integrated circuit packaging technology is a packaging technology used in the semiconductor industry. In the ball grid array package structure, in addition to the chip, some passive components such as resistors and capacitors are also assembled on the substrate. Figures 1A to 1B of the wiring show a conventional passive circuit assembly method for integrated circuit package substrates. As shown in Figure 1A, the integrated circuit package structure is a ball grid array package structure, which includes a substrate 10, An integrated circuit chip 20, a passive component 30, a packaging gel 40, and a plurality of solder balls 50. Since this ball grid array package structure is a structure commonly used in the semiconductor industry ', it will not be described in further detail here. The figure shows an enlarged view of the assembly method of the passive component 30 in the integrated circuit packaging structure shown in FIG. 1A. As shown in FIG. 1B, the substrate 10 includes a core portion 10a and a component mounting surface 1. 〇b, and the component mounting surface i〇b is provided with a pair of fresh 塾 11, 12; wherein the first pad π is used for welding to the first end 31 'of the passive component 30 and the second pad 12 is used for welding to the passive The second end 32 of the element 30. However, after the above-mentioned passive component 30 is assembled on the substrate 10, there will be tg (national standard ㈣S) A4 k grid coffee X 297 public «---- ---- ---- 1515 Consumption by the Intellectual Property Bureau of the Ministry of Economic Affairs Cooperatively print A7 ------------------ 5. Description of the invention (2) A gap 13 exists between the bottom surface of the passive component 30 and the top surface of the substrate 10 . The existence of this gap 13 easily leads to the following problems. The first problem is that in the subsequent process of implanting the solder ball 50, the high temperature environment will cause a part of the solder on the passive component 30 to melt; and the molten solder will then flow into the gap 13 through the capillary effect. Therefore, it is very easy to cause the two terminals 31 and 32 of the passive element 30 to form a bridge short circuit phenomenon. If such a bridge short circuit occurs, the integrated circuit chip 20 cannot operate normally. The second problem is that in the subsequent encapsulation process, the existence of this gap 13 is likely to cause the so-called popcorn effect due to being covered by a high temperature environment and flowing resin, resulting in the entire integrated circuit packaging structure. Damaged "The third problem is' In the process of encapsulation of the late performance, since the passive component 30 is subject to the impact of the flowing resin in a high temperature environment, it is prone to dislocation. This is because the passive element 30 is fixed to the substrate 10 only by the fresh tin on the two ends 31 and 32 of the passive element 30, so the fastening force is obviously insufficient. If the dislocation is serious, a disconnection may also occur at the passive component 30, resulting in that the integrated circuit chip 20 cannot operate normally. [Summary of the Invention] In view of the shortcomings of the conventional technology described above, the object of the present invention is to provide a method for assembling passive components, which can prevent gaps between the assembled passive components and the substrate, thereby preventing The bridging short circuit phenomenon, gas explosion phenomenon, and dislocation phenomenon that may be caused by the known technology make the final integrated circuit package structure have better quality and reliability. 11 装 · ----- fiOrder ---- ---- • Line {Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 2 L5957 』42934 Λ7 B7 Employees of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the Consumer Cooperative Co., Ltd. 5. Description of the invention (3) According to the purpose described above, the present invention proposes a novel method for assembling passive components of a circuit board packaging substrate. The method of the present invention is characterized by using an electrically insulating material, such as epoxy resin, to fill the gap that would otherwise exist between the passive element and the substrate. This filling step can be performed after the passive components have been soldered, or the passive components have been soldered to the substrate after being coated with an electrically insulating material. If the electrically insulating material is filled after the passive component is soldered, the method of the present invention includes the following steps: (1) a pair of solder pads are provided at a preselected position on the substrate; (2) the passive component is soldered To the pair of solder pads; a gap is formed between the passive element and the substrate; (3) a curable fluid electrical insulating substance is applied to the periphery of the passive element; the fluid electrical insulator is then The gap between the passive element and the substrate will be filled by the capillary effect by itself; and (4) the fluid electrical insulating material filled with the gap between the passive element and the substrate is cured. If the passive component is soldered to the substrate after the electrical insulating substance is coated first, the method of the present invention includes the following steps: (1) a pair of solder pads are provided at a preselected position on the substrate; (2) a The electrically insulating substance is applied to the substrate area between the pair of pads, and its thickness must be at least equal to the gap distance that would exist between the passive component and the substrate; and (3) the two ends of the passive component Solder to the pair of pads separately. Since the present invention does not cause a gap between the passive element and the substrate, it can solve the shortcomings of the conventional technology, including bridging short circuit phenomenon, gas explosion phenomenon, and dislocation phenomenon. The present invention is therefore more practical than conventional techniques. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 3 15957 (Please read the precautions on the back before filling this page)
一SJ ---------& ! 經濟部智慧財產局員工消費合作社印製 A7 -- B/ _ -_----- 五、發明說明（4 ) [圖式簡述] 為讓本發明之上述和其它目的、特徵、和優點能更明 顯易懂，下文將舉本發明之較佳實施例，並配合所附圖式， 詳細說明本發明之實質技術内容。所附圏式之内容簡述如 下： 第1A圖（習知技術）為一習知之球栅陣列式積體電路 封裝結構之剖面示意圖； 第1B圖（習知技術）顯示第1A圖所示之積體電路封裝 結構中之被動元件的組裝方式的放大圖； 第2圖為一剖面示意圖’其顯示本發明之被動元件组 裝方法之第一實施例； 第3圖為一剖面示意圖，其顯示本發明之被動元件組 裝方法之第二實施例； 第4A至4B圖為二剖面示意圖’其顯示本發明之被動 元件組裝方法之第三實施例； ------ 1 第：^圈為二剖面示意圖，其顯示本發明之被動 元件組裝方法之第四實施例。 [圊式之標號] 基板（substrate) l〇a 基板10之核心部分 l〇b 基板10之元件安裝表面 11 第一銲墊First SJ --------- &! Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7-B / _ -_----- V. Description of Invention (4) [Schematic Description] In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the following describes preferred embodiments of the present invention and the accompanying drawings to describe the essential technical content of the present invention in detail. The contents of the attached formula are briefly described as follows: Fig. 1A (conventional technology) is a schematic cross-sectional view of a conventional ball grid array integrated circuit package structure; Fig. 1B (conventional technology) shows the structure shown in Fig. 1A An enlarged view of the assembly method of the passive components in the integrated circuit packaging structure; FIG. 2 is a schematic cross-sectional view 'which shows the first embodiment of the passive component assembling method of the present invention; and Fig. 3 is a schematic cross-sectional view which shows The second embodiment of the passive component assembling method of the present invention; Figures 4A to 4B are two cross-sectional schematic diagrams' which show the third embodiment of the passive component assembling method of the present invention; Two schematic sectional views showing a fourth embodiment of the passive component assembling method of the present invention. [Type symbol] Substrate l〇a Core part of substrate 10 lb Component mounting surface of substrate 10 11 First pad
Ua 銲錫 12 第二銲墊 -----1 -------裝--------訂-----！ _ _線 (請先閱讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準（CNS〉A4規格（21〇 X 297公釐） 4· 15957 4 4293 4 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（5 ) 13 縫隙 20 積體電路晶片 30 被動元件（passive component) 31 被動元件30之第一端 32 被動元件30之第二端 40 封裝膠體 50 銲球 100 基板 100a 基板100之核心部分 100b 基板100之元件安裝表面 101 銲錫 110 被動元件 121 第一銲墊 122 第二銲墊 130 缝隙 140 可固化之流動性電絕緣物質（環氧擀脂） 150 點膠針 200 基板 200a 基板200之核心部分 200b 基板200之元件安裝表面 201 銲錫 210 被動元件 221 第一銲墊 222 第二銲墊 -I IIIIIIIIIJ ---I III— . - I - I 1 ---I (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 5 15957 經濟部智慧財產局員工消費合作社印製 A7 _B7_ 五、發明說明（6 ) 230 缝隙 240 可固化之流動性電絕緣物質（環氧樹脂） 2 5 0 模板（stencil mask) 260 刮片（Made) 300 基板 300a 基板300之核心部分 300b 基板300之元件安裝表面 301 銲錫 310 被動元件 321 第一銲墊 322 第二銲墊 340 電絕緣物質（環氧樹脂） 350 點膠針 400 基板 400a 基板400之核心部分 400b 基板400之元件安裝表面 401 銲錫 410 被動元件 421 第一銲墊 422 第二銲墊 440 電絕緣物質（環氧樹脂） 450 模板（stencil mask) [發明實施例詳細說明] » » 以下將分別配合第2圖、第3圖、第4A至4B圖、及 本紙張义度適用尹國國家標iH'NS)A4規格（210 X 297公釐) 6 15957 ---------I--I --丨丨 — 丨 — —訂·--- ----- <請先閱讀背面之注意事項再填寫本頁) 44293 4 A7 " _____ B7____ 五、發明說明（7 ) 第5A至5B圖’詳細揭露本發明之被動元件組裝方法的四 種不同的實施方式》Ua solder 12 Second solder pad ----- 1 ------- install -------- order -----! _ _Line (please read the notes on the back before filling this page) This paper size applies to Chinese national standard (CNS> A4 specification (21 × X 297 mm) 4 · 15957 4 4293 4 A7 B7 Intellectual Property Bureau, Ministry of Economic Affairs Printed by the employee consumer cooperative V. Description of the invention (5) 13 Gap 20 Integrated circuit chip 30 Passive component 31 First end of the passive component 30 32 Second end of the passive component 30 Encapsulation gel 50 Solder ball 100 Substrate 100a Core part of substrate 100 100b Component mounting surface of substrate 100 101 Solder 110 Passive component 121 First pad 122 Second pad 130 Gap 140 Curable fluid electrical insulation material (epoxy roll grease) 150 Dispensing pin 200 Substrate 200a Core part 200b Substrate 200 Component mounting surface 201 Substrate 210 Solder 210 Passive component 221 First pad 222 Second pad -I IIIIIIIIIJ --- I III--.-I-I 1 --- I (Please (Please read the notes on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 5 15957 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7_ 5 Description of the Invention (6) 230 Gap 240 Curable flowable electrical insulating material (epoxy resin) 2 50 0 stencil mask 260 Made 300 Substrate 300a Core part 300 of the substrate 300b Component mounting surface of the substrate 300 301 Solder 310 Passive component 321 First solder pad 322 Second solder pad 340 Electrical insulating material (epoxy resin) 350 Dispensing needle 400 Substrate 400a Core part of the substrate 400b Component mounting surface of the substrate 400 401 Solder 410 Passive component 421 A solder pad 422, a second solder pad 440, an electrically insulating material (epoxy resin), 450 a stencil mask, and a stencil mask. [Detailed description of the embodiment of the invention] »» The following will be matched with Figure 2, Figure 3, Figures 4A to 4B, And the meaning of this paper applies Yin national standard iH'NS) A4 specification (210 X 297 mm) 6 15957 --------- I--I-丨 丨-丨--order ------ < Please read the precautions on the back before filling out this page) 44293 4 A7 " _____ B7____ V. Description of the invention (7) Figures 5A to 5B 'details the details of the passive component assembly method of the present invention. Four different implementations ''
1 一實施例Γ第2 SM 以下將配合所附圖式中之第2圖來詳細揭露說明本發 明之第一實施例。 如圖所示’此實施例係用以將一被動元件110組裝至 一基板100上。此基板1〇〇包括一核心部分10〇3及一元件 安裝表面100b’且元件安裝表面i〇〇b設置有一對銲整 121、122。被動元件Π0之二端係分別藉由銲錫1〇丨而銲 接至銲墊121、122»如本說明書前面之發明背景中所述， 於此有一縫隙130會形成於被動元件11〇與基板ι〇〇之 間。 為解決缝隙130所可能導致之問題，本發明的解決方 法為將一可固化之流動性電絕緣物質140，例如為環氧樹 脂（epoxy resin)’利用一點膠針150以點膠方式（dispensing) 而施加至被動元件110之周邊上：接著此流動性電絕緣物 140便會藉由毛細管效應（capinary effect)而自行流入缝隙 130之中，直至填滿縫隙130為止。於缝隙130完全被流 動性電絕緣物140填滿之後，便可接著進行一烘烤步驟 (baking)，用以將流動性電絕緣物140固化定型。此即完 成本發明之被動元件組裝方法。 由於本發明不會使得被動元件110與基板100之間有 縫隙存在，因此不會導致株接短路現象及氣爆現象。此外， 由於固化定型後之環氧樹脂可將被動元件110緊密地粘接 f靖先閱讀背面之注意事項再填寫本頁)1 An embodiment Γ 2 SM The first embodiment of the present invention will be described in detail below in conjunction with the second figure in the drawings. As shown in the figure ', this embodiment is used to assemble a passive component 110 on a substrate 100. The substrate 100 includes a core portion 1003 and a component mounting surface 100b ', and the component mounting surface 100b is provided with a pair of welds 121, 122. The two ends of the passive element Π0 are respectively soldered to the pads 121 and 122 by solder 10o. As described in the background of the invention earlier in this specification, a gap 130 is formed in the passive element 11 and the substrate. 〇between. In order to solve the problem that may be caused by the gap 130, the solution of the present invention is to disperse a curable fluid electrical insulating material 140, such as epoxy resin. ) And applied to the periphery of the passive element 110: Then, the fluid electrical insulator 140 flows into the gap 130 by the capillary effect by itself, until the gap 130 is filled. After the gap 130 is completely filled with the fluid electrical insulator 140, a baking step may be performed to cure and shape the fluid electrical insulator 140. This completes the passive component assembly method of the present invention. Since the present invention does not cause a gap to exist between the passive element 110 and the substrate 100, it does not cause a short circuit phenomenon and a gas explosion phenomenon. In addition, the passive component 110 can be adhered tightly due to the cured epoxy resin. (Please read the precautions on the back before filling in this page.)
^ il — Ιί -----I 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用_國國家標準（CNS)A4規格（210 X 297公爱） 7 15957 A7 --__B7_ 五、發明說明（8 ) 至基板丨〇〇’因此可幫助被動元件110更為牢固於基板100 上，使得組裝完成後之被動元件110不易在後續之封裝膠. 體製程中，因受到流動樹脂之衝擊而導致脫位。 第二f施例（第3圖） 以下將配合所附圖式中之第3圖來詳細揭露說明本發 明之第二實施例。 如圊所示’此實施例係用以將一被動元件210組裝至 一基板200上。此基板200包括一核心部分200a及一元件 安裝表面200b，且元件安裝表面200b設置有一對銲塾 221、222。被動元件210之二端係分別藉由銲錫201而銲 接至銲墊221、222。如本說明書前面之發明背景中所述， 於此有一縫隙230會形成於被動元件210與基板200之 間。 為解決縫隙230所可能導致之問題，本發明的解決方 法為將一可固化之流動性電絕緣物質240，例如為環氧樹 脂’利用一模板（stencil mask)250及一刮片（blade)260以真 空模板印刷製程（vacuum stencil-printing process)而施加 至被動元件2 10之周邊上；接著此流動性電絕緣物240便 會藉由毛細管效應而自行流入缝隙230之中，直至填滿縫 隙230為止。於縫隙230完全被流動性電絕緣物240填滿 之後’便可進行一烘烤步驟，用以將流動性電絕緣物24〇 111化定型。此即完成本發明之被動元件組裝方法。 II----II I I --------訂--- ------ (請先閱讀背面之注意事項再填寫本頁) 由於本發明不會使得被動元件210與基板200之間有 縫阳:存在’因此不會導致橋接短路現象及氣爆現象3此外，^ il — Ιί ----- I The paper size printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is applicable to the _ national standard (CNS) A4 specification (210 X 297 public love) 7 15957 A7 --__ B7_ V. Description of the invention (8) To the substrate 丨 〇〇 'can therefore help the passive component 110 to be more firmly fixed to the substrate 100, so that the passive component 110 after assembly is not easy to be used in subsequent encapsulation. During the system process, it is caused by the impact of the flowing resin. Dislocation. Second f Embodiment (Fig. 3) The second embodiment of the present invention will be described in detail in conjunction with Fig. 3 in the drawings. As shown in FIG. ′, This embodiment is used to assemble a passive component 210 on a substrate 200. The substrate 200 includes a core portion 200a and a component mounting surface 200b, and the component mounting surface 200b is provided with a pair of solder pads 221, 222. The two ends of the passive component 210 are soldered to the pads 221 and 222 by solder 201, respectively. As described in the background of the invention earlier in this specification, a gap 230 is formed between the passive element 210 and the substrate 200 here. In order to solve the problem that may be caused by the gap 230, the solution of the present invention is to use a curable fluid electrical insulating material 240, such as epoxy resin, using a stencil mask 250 and a blade 260. A vacuum stencil-printing process is applied to the periphery of the passive element 2 10; then, the fluid electrical insulator 240 flows into the gap 230 by the capillary effect by itself, until the gap 230 is filled. until. After the gap 230 is completely filled with the fluid electrical insulator 240 ', a baking step can be performed to shape and shape the fluid electrical insulator 240-111. This completes the passive component assembly method of the present invention. II ---- II II -------- Order --- ------ (Please read the precautions on the back before filling this page) Because the present invention will not make the passive component 210 and the substrate 200 There is a seam between them: there is' so it will not cause bridging short circuit phenomenon and gas explosion phenomenon3 In addition,
·，44293 4 經 濟 部 智 慧 財 產 局 員 工 消 f 合 作 社 印 製 A7 B7 五、發明說明Γ ) 由於固化定型後之環氧樹脂可將被動元件210緊密地粘接 至基板200,因此可幫助被動元件210更為牢固於基板20Ό 上’使得組裝完成後之被動元件210不易在後續之封裝膠 體製程中，因受到流動樹脂之衝擊而導致脫位。 第三實施例（第4A至4B圖） 以下將配合所附圖式中之第4A至4B圖來詳細揭露說 明本發明之第三實施例·》 請參閱第4A圓，首先提供一基板300 ,其包括一核心 部分300a及一元件安裝表面300b，且元件安裝表面300b 設置有一對銲墊321、322。為防止前述之縫隙問題發生， 此實施例的解決方法為將一電絕緣物質340，例如為環氧 樹脂’利用一點膠針350以點膠方式塗佈至位於銲墊321、 3 22之間的基板區域上β 清接著參閱第4Β圖’上述之塗佈步驟_所塗佈之電 絕緣物質340的厚度需至少為等於被動元件310於組裝至 基板300上時，被動元件310與基板3 00之間本來會存在 之缝隙距離《完成塗佈之後，接著便可將被動元件31〇的 二端分別銲接至銲墊321、322 ^由於基板300上位於銲塾 32〗、322之間的區域已預塗佈上電絕緣物質340，因此被 動元件310组裝至基板300上後，二者之間不會有縫隙之 存在。 由於本發明不會使得被動元件310與基板3〇〇之間有 縫隙存在’因此不會導致橋接短路現象及氣爆現象。此外， 由於塗佈上之環氧樹脂可將被動元件3 10緊密地粘接至基 本紙張尺度適用t國國家標準（CNS)A4規格<210 X 297公S ) (請先閲讀背面之注意事項再填寫本頁)·, 44293 4 Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the cooperative A7 B7 5. Description of the invention Γ) Since the cured epoxy resin can tightly bond the passive component 210 to the substrate 200, it can help the passive component 210 It is more rigid on the substrate 20 ', making the passive component 210 after assembly difficult to be dislocated due to the impact of the flowing resin in the subsequent encapsulation process. Third Embodiment (Figures 4A to 4B) The third embodiment of the present invention will be described in detail with reference to Figures 4A to 4B in the accompanying drawings. Please refer to the circle 4A, first, a substrate 300 is provided. It includes a core portion 300a and a component mounting surface 300b, and the component mounting surface 300b is provided with a pair of solder pads 321, 322. In order to prevent the aforementioned gap problem, the solution of this embodiment is to apply an electrically insulating substance 340, such as epoxy resin, by using a glue pin 350 to a position between the pads 321 and 32. Β on the substrate area, and then refer to FIG. 4B. The above-mentioned coating step_ The thickness of the electrically insulating material 340 to be applied must be at least equal to that of the passive component 310 when the passive component 310 is assembled on the substrate 300. The gap distance that would have existed after the coating is completed, and then the two ends of the passive component 31 can be soldered to the pads 321 and 322, respectively. The electrically insulating material 340 is pre-coated, so that after the passive component 310 is assembled on the substrate 300, there will be no gap between the two. Since the present invention does not allow a gap to exist between the passive element 310 and the substrate 300, it does not cause a bridge short circuit phenomenon and a gas explosion phenomenon. In addition, because the epoxy resin is applied, the passive components 3 and 10 can be tightly bonded to the basic paper size. The national standard (CNS) A4 specification < 210 X 297 male S) (Please read the precautions on the back first (Fill in this page again)
JSJ -線- 經濟部智慧財產局員工消費合作杜印製 A7 ____B7__ 五、發明說明（1G ) 板300,因此可幫助被動元件310更為牢固於基板3 00上， 使得組裝完成後之被動元件310不易在後續之封裝膠體製 程中，因受到流動樹脂之衝擊而導致脫位。 笫四管施例（第5A至5B圖、 以下將配合所附圖式中之第5A至5B圖來詳細揭露說 明本發明之第四實施例。 請參閱第5A圖，首先提供一基板4〇〇，其包括一核心 部分400a及一元件安裝表面400b，且元件安裝表面400b 設置有一對銲墊421、422。為防止前述之缝隙問題發生， 此實施例的解決方法為利用一模板450來進行一模板印刷 製程（stencil printing) ’藉以將一電絕緣物質440，例如為 環氧樹脂’塗佈至位於銲墊421、422之間的基板區域上。 請接著參閱第5B圖，上述之塗佈步驟中所塗佈之電 絕緣物質440的厚度需至少為等於被動元件410於組裝至 基板400上時’被動元件410與基板400之間本來會存在 之縫隙距離。完成塗佈之後，接著便可將被動元件410的 二端分別銲接至銲墊421、422。由於基板400上位於銲塾 421、422之間的區域已預塗佈上電絕緣物質440，因此被 動元件410組裝至基板400上後，二者之間不會有縫隙之 存在。 由於本發明不會使得被動元件410與基板400之間有 縫隙存在，因此不會導致橋接短路現象及氣爆現象。此外， 由於塗佈上之環氧樹脂可將被動元件410緊密地粘接至基 板400’因此可幫助被動元件410更為牢固於基板4 00上， -----II —-----裝 -------訂·---------線 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（21Gx 297公爱） 10 15957 A7 B7 五、發明說明（11 ) 使得組裝完成後之被動元件410不易在後績之封裝膠體製 程中，因受到流動樹脂之衝擊而導致脫位。 · [結論] 綜而言之，本發明提供了 一種新穎之積體電路封裝基 板被動元件組裝方法，其特點在於利用一電絕緣物質，例 如為環氧樹脂’來填充被動元件與基板之間本來會存在之 缝隙’使得組裝完成後之被動元件與基板之間不會存在有 缝隙’因此可解決習知技術的缺點，包括橋接短路現象、 氣爆現象、及脫位現象。本發明因此較習知技術具有更進 步之實用性》 以上所述僅為本發明之較佳實施例而已，並非用以限 定本發明之實質技術内容的範圍。本發明之實質技術内容 係廣義地定義於下述之申請專利範圍中。任何他人所完成 之技術實體，若是與下述之申請專利範圍所定義者為完全 相同、或是為一種等效之變更，均將被視為涵蓋於此專利 範圍之中。 -I I I II -^.11 — — — _ I ---I--I 1 {靖先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 11 15957JSJ-Line-Consumer Cooperation of Intellectual Property Bureau of the Ministry of Economic Affairs Du printed A7 ____B7__ V. Description of Invention (1G) board 300, which can help the passive component 310 be more firmly fixed on the substrate 300, making the passive component 310 after assembly completed It is not easy to be dislocated due to the impact of the flowing resin during the subsequent encapsulation process.笫 Four-tube embodiment (Figures 5A to 5B, the fourth embodiment of the present invention will be described in detail below in conjunction with Figures 5A to 5B in the attached drawings. Please refer to Figure 5A. First, a substrate 4 is provided. 〇, which includes a core portion 400a and a component mounting surface 400b, and the component mounting surface 400b is provided with a pair of solder pads 421, 422. In order to prevent the aforementioned gap problem, the solution of this embodiment is to use a template 450 to perform A stencil printing process 'by which an electrically insulating substance 440, such as an epoxy resin,' is applied to the substrate region between the pads 421, 422. Please refer to FIG. 5B for the above coating The thickness of the electrically insulating substance 440 applied in the step needs to be at least equal to the gap distance that would exist between the passive element 410 and the substrate 400 when the passive element 410 is assembled on the substrate 400. After the coating is completed, you can then The two ends of the passive element 410 are respectively soldered to the bonding pads 421 and 422. Since the area between the solder pads 421 and 422 on the substrate 400 has been pre-coated with an electrically insulating substance 440, the passive element 410 is assembled to After the substrate 400 is placed, there will be no gap between the two. Since the present invention does not make the gap between the passive element 410 and the substrate 400 exist, it will not cause bridging short circuit phenomenon and gas explosion phenomenon. In addition, due to the coating The epoxy resin on the cloth can tightly bond the passive component 410 to the substrate 400 ', thus helping the passive component 410 to be more firmly fixed to the substrate 400, ----- II ------- install --- ---- Order · --------- Line (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (21Gx 297 public love) 10 15957 A7 B7 V. Description of the invention (11) The passive component 410 after assembly is difficult to be dislocated due to the impact of the flowing resin in the encapsulation system of the subsequent performance. [Conclusion] In summary, the present invention provides a The novel integrated circuit package substrate passive component assembly method is characterized by using an electrically insulating material, such as epoxy resin, to fill the gap that would exist between the passive component and the substrate, so that the passive component and the substrate after assembly are completed. There will be no Gap 'can therefore solve the shortcomings of conventional technology, including bridging short circuit phenomenon, gas explosion phenomenon, and dislocation phenomenon. Therefore, the present invention has more advanced practicability than conventional technology. The above description is only a preferred embodiment of the present invention It is not intended to limit the scope of the essential technical content of the present invention. The essential technical content of the present invention is broadly defined in the scope of patent applications described below. Any technical entity completed by others is in accordance with the scope of patent applications described below The definitions that are identical or equivalent are considered to be covered by this patent. -III II-^. 11 — — — _ I --- I--I 1 {Jing first read the precautions on the back before filling out this page) Printed on paper standards of the Ministry of Economic Affairs, Intellectual Property Bureau, Employees' Cooperatives, Chinese national standards (CNS) A4 specifications (210 X 297 public love) 11 15957