JPS6117139B2 - - Google Patents
Info
- Publication number
- JPS6117139B2 JPS6117139B2 JP55117391A JP11739180A JPS6117139B2 JP S6117139 B2 JPS6117139 B2 JP S6117139B2 JP 55117391 A JP55117391 A JP 55117391A JP 11739180 A JP11739180 A JP 11739180A JP S6117139 B2 JPS6117139 B2 JP S6117139B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- lead
- tape guide
- bonding
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000008188 pellet Substances 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55117391A JPS5740946A (en) | 1980-08-26 | 1980-08-26 | Manufacturing equipment for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55117391A JPS5740946A (en) | 1980-08-26 | 1980-08-26 | Manufacturing equipment for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5740946A JPS5740946A (en) | 1982-03-06 |
| JPS6117139B2 true JPS6117139B2 (enrdf_load_html_response) | 1986-05-06 |
Family
ID=14710486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55117391A Granted JPS5740946A (en) | 1980-08-26 | 1980-08-26 | Manufacturing equipment for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5740946A (enrdf_load_html_response) |
-
1980
- 1980-08-26 JP JP55117391A patent/JPS5740946A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5740946A (en) | 1982-03-06 |
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