JPS6116699Y2 - - Google Patents
Info
- Publication number
- JPS6116699Y2 JPS6116699Y2 JP1980167626U JP16762680U JPS6116699Y2 JP S6116699 Y2 JPS6116699 Y2 JP S6116699Y2 JP 1980167626 U JP1980167626 U JP 1980167626U JP 16762680 U JP16762680 U JP 16762680U JP S6116699 Y2 JPS6116699 Y2 JP S6116699Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- outer edge
- liquid
- air
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 17
- 239000003566 sealing material Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980167626U JPS6116699Y2 (enrdf_load_stackoverflow) | 1980-11-25 | 1980-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980167626U JPS6116699Y2 (enrdf_load_stackoverflow) | 1980-11-25 | 1980-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5791253U JPS5791253U (enrdf_load_stackoverflow) | 1982-06-04 |
| JPS6116699Y2 true JPS6116699Y2 (enrdf_load_stackoverflow) | 1986-05-22 |
Family
ID=29526252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980167626U Expired JPS6116699Y2 (enrdf_load_stackoverflow) | 1980-11-25 | 1980-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116699Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0251836B1 (en) * | 1986-05-30 | 1991-07-17 | Digital Equipment Corporation | Integral heat pipe module |
-
1980
- 1980-11-25 JP JP1980167626U patent/JPS6116699Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5791253U (enrdf_load_stackoverflow) | 1982-06-04 |
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