JPS5791253U - - Google Patents
Info
- Publication number
- JPS5791253U JPS5791253U JP1980167626U JP16762680U JPS5791253U JP S5791253 U JPS5791253 U JP S5791253U JP 1980167626 U JP1980167626 U JP 1980167626U JP 16762680 U JP16762680 U JP 16762680U JP S5791253 U JPS5791253 U JP S5791253U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980167626U JPS6116699Y2 (enrdf_load_stackoverflow) | 1980-11-25 | 1980-11-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980167626U JPS6116699Y2 (enrdf_load_stackoverflow) | 1980-11-25 | 1980-11-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5791253U true JPS5791253U (enrdf_load_stackoverflow) | 1982-06-04 |
JPS6116699Y2 JPS6116699Y2 (enrdf_load_stackoverflow) | 1986-05-22 |
Family
ID=29526252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980167626U Expired JPS6116699Y2 (enrdf_load_stackoverflow) | 1980-11-25 | 1980-11-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6116699Y2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6354758A (ja) * | 1986-05-30 | 1988-03-09 | デイジタル イクイプメント コ−ポレ−シヨン | 一体形ヒ−トパイプモジュ−ル |
-
1980
- 1980-11-25 JP JP1980167626U patent/JPS6116699Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6354758A (ja) * | 1986-05-30 | 1988-03-09 | デイジタル イクイプメント コ−ポレ−シヨン | 一体形ヒ−トパイプモジュ−ル |
Also Published As
Publication number | Publication date |
---|---|
JPS6116699Y2 (enrdf_load_stackoverflow) | 1986-05-22 |