JPS61166748U - - Google Patents
Info
- Publication number
- JPS61166748U JPS61166748U JP1985049670U JP4967085U JPS61166748U JP S61166748 U JPS61166748 U JP S61166748U JP 1985049670 U JP1985049670 U JP 1985049670U JP 4967085 U JP4967085 U JP 4967085U JP S61166748 U JPS61166748 U JP S61166748U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing plate
- cylindrical wall
- polishing device
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図、第２図、第３図は本考案の研磨装置を
説明するための断面図である。第４図は従来の研
磨装置の一例を示す正面図である。
図において、１は本体、２は研磨皿、３は研磨
クロス、４は液カバー、５は液カバー、６は液受
け、７は上部カバー、８は研磨ホルダ、９は半導
体基板、１０は保持棒、１１はアーム、１２は研
磨液タンク、１３はコツク、１４は導管、１５は
受液桶、をそれぞれ示す。
FIGS. 1, 2, and 3 are cross-sectional views for explaining the polishing apparatus of the present invention. FIG. 4 is a front view showing an example of a conventional polishing apparatus. In the figure, 1 is the main body, 2 is a polishing plate, 3 is a polishing cloth, 4 is a liquid cover, 5 is a liquid cover, 6 is a liquid receiver, 7 is an upper cover, 8 is a polishing holder, 9 is a semiconductor substrate, and 10 is a holder. 11 is an arm, 12 is a polishing liquid tank, 13 is a pot, 14 is a conduit, and 15 is a liquid receiving bucket.
Claims (1)
研磨皿と被研磨物の相対速度によつて加工を行う
研磨装置において、研磨皿の外側に円筒状の壁を
設け該円筒状壁の上部に内側方向への張出し部分
を有することを特徴とする研磨装置。 In a polishing device that holds an object to be polished facing a rotating polishing plate and performs processing using the relative speed of the polishing plate and the object, a cylindrical wall is provided on the outside of the polishing plate, and the cylindrical wall is A polishing device characterized by having an inwardly projecting portion at an upper portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985049670U JPS61166748U (en) | 1985-04-03 | 1985-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985049670U JPS61166748U (en) | 1985-04-03 | 1985-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61166748U true JPS61166748U (en) | 1986-10-16 |
Family
ID=30567079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985049670U Pending JPS61166748U (en) | 1985-04-03 | 1985-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166748U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312795A (en) * | 2015-07-01 | 2017-01-11 | 不二越机械工业株式会社 | Polishing apparatus |
-
1985
- 1985-04-03 JP JP1985049670U patent/JPS61166748U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312795A (en) * | 2015-07-01 | 2017-01-11 | 不二越机械工业株式会社 | Polishing apparatus |
| JP2017013183A (en) * | 2015-07-01 | 2017-01-19 | 不二越機械工業株式会社 | Polishing device |
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