JPS6150652U - - Google Patents
Info
- Publication number
- JPS6150652U JPS6150652U JP1984133692U JP13369284U JPS6150652U JP S6150652 U JPS6150652 U JP S6150652U JP 1984133692 U JP1984133692 U JP 1984133692U JP 13369284 U JP13369284 U JP 13369284U JP S6150652 U JPS6150652 U JP S6150652U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- liquid
- polishing plate
- bucket
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 9
- 239000004744 fabric Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の研摩装置を示す斜視図である
。第２図は本考案の研摩装置による研摩時の研摩
液の状態を示す断面図である。第３図は従来の研
摩装置を示す正面図である。
図において、１は研摩皿、２は研摩クロス、３
は研摩ホルダ、４は半導体基板、５は保持棒、６
はアーム、７はおもり、８は桶、９は受液器、１
０は導管、１１はノズル、１２は研摩液、１３は
本体、１４は研摩液タンク、１５は管、１６はノ
ズル、１７は研摩液をそれぞれ示す。
FIG. 1 is a perspective view showing the polishing apparatus of the present invention. FIG. 2 is a sectional view showing the state of the polishing liquid during polishing by the polishing apparatus of the present invention. FIG. 3 is a front view of a conventional polishing device. In the figure, 1 is a polishing plate, 2 is a polishing cloth, and 3
is a polishing holder, 4 is a semiconductor substrate, 5 is a holding rod, 6
is the arm, 7 is the weight, 8 is the bucket, 9 is the liquid receiver, 1
0 is a conduit, 11 is a nozzle, 12 is a polishing liquid, 13 is a main body, 14 is a polishing liquid tank, 15 is a pipe, 16 is a nozzle, and 17 is a polishing liquid.
Claims (1)
供給しながら研摩皿と被研摩物を相対運動させて
加工を行なう研摩装置において、研摩皿と一体に
組立てられた桶と、桶の内壁近くに回転方向に対
面した開口部を有し、桶外から支持された受液器
と該受液器に連結され研摩皿表面へ研摩液を導く
管とノズルを有することを特徴とする研摩装置。 In a polishing device that holds an object to be polished facing a polishing plate and performs processing by moving the polishing plate and the object relative to each other while supplying polishing liquid, there is a bucket assembled integrally with the polishing plate, and a bucket. Polishing characterized by having an opening facing the rotational direction near the inner wall, a liquid receiver supported from outside the tub, and a pipe and nozzle connected to the liquid receiver to guide the polishing liquid to the surface of the polishing plate. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984133692U JPS6150652U (en) | 1984-09-03 | 1984-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984133692U JPS6150652U (en) | 1984-09-03 | 1984-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6150652U true JPS6150652U (en) | 1986-04-05 |
Family
ID=30692230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984133692U Pending JPS6150652U (en) | 1984-09-03 | 1984-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6150652U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009214233A (en) * | 2008-03-11 | 2009-09-24 | Ikuhiro Ikeda | Polishing device |
-
1984
- 1984-09-03 JP JP1984133692U patent/JPS6150652U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009214233A (en) * | 2008-03-11 | 2009-09-24 | Ikuhiro Ikeda | Polishing device |
| JP4598095B2 (en) * | 2008-03-11 | 2010-12-15 | 育弘 池田 | Polishing equipment |
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