JP4598095B2 - Polishing equipment - Google Patents

Description

  The present invention relates to a polishing apparatus that polishes a workpiece with abrasive grains contained in a processing liquid.

Conventionally, various polishing apparatuses for polishing a workpiece with abrasive grains contained in a processing liquid have been proposed. For example, the polishing apparatus described in Patent Document 1 includes a rotating disk-shaped surface plate and a jig for holding a workpiece. In this polishing apparatus, a workpiece to be held by a jig is placed on a surface plate, a processing liquid stored in a tank is supplied onto the surface plate, and the surface plate is rotated. The machining liquid contains abrasive grains, and the workpiece surface of the workpiece is polished by the abrasive grains that have entered between the surface plate and the workpiece.
JP-A-5-84657

  Here, in order to polish the work surface of the work piece flatly, it is necessary to uniformly disperse the abrasive grains on the surface plate so that the work surface contacts the abrasive grains uniformly. However, in the polishing apparatus of Patent Document 1, since the processing liquid is supplied onto the rotating surface plate, the processing liquid flows toward the peripheral edge of the surface plate by centrifugal force. Therefore, in order to uniformly disperse the abrasive grains on the surface plate, it is necessary to continuously supply the machining liquid during the polishing process. As a result, there is a problem that a large amount of machining liquid is required and the machining cost of the workpiece increases.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a polishing apparatus that can reduce the amount of processing liquid used for polishing a workpiece and reduce the processing cost.

  A polishing apparatus according to the present invention is made to solve the above-described problem, and is a polishing apparatus that polishes a workpiece with abrasive grains contained in a processing liquid, and the workpiece is disposed. A surface plate that is supplied with machining fluid and is driven to rotate, and an opening at one end that is disposed at the peripheral portion of the surface plate, and an opening at the other end that is disposed at the center of the surface plate, through which the machining fluid passes. And.

  According to this configuration, when the surface plate rotates, the machining liquid on the surface plate flows toward the peripheral edge of the surface plate by centrifugal force. When the working fluid reaches the peripheral portion of the surface plate, the working fluid is introduced into the conduit from an opening at one end of the conduit disposed on the peripheral portion. Then, the machining fluid introduced into the conduit passes through the conduit and is discharged from the opening at the other end disposed at the center of the surface plate, and is supplied onto the surface plate. Thus, the machining fluid circulates on the surface plate and in the conduit, and is continuously supplied onto the surface plate from the center of the surface plate during rotation of the surface plate. Thereby, the processing liquid supplied on the surface plate continuously flows between the surface plate and the workpiece. The workpiece placed on the surface plate slides on the surface plate by the rotation of the surface plate, and is polished by abrasive grains in the machining liquid interposed between the surface plate and the workpiece. As a result, the workpiece can be polished with only a predetermined amount of machining liquid supplied onto the surface plate, and the amount of machining liquid to be used can be reduced as compared with the conventional example, and the machining cost can be reduced.

  In the said grinding | polishing apparatus, it is preferable to further provide the annular wall provided so that the peripheral part of the said surface plate might be surrounded. According to this configuration, since the surface plate is surrounded by the annular wall, the machining fluid supplied on the surface plate is stored on the surface plate. When the surface plate is driven to rotate, the machining fluid on the surface plate flows toward the peripheral edge of the surface plate by centrifugal force, but the flow of the machining fluid is blocked by the annular wall surrounding the surface plate. Then, the clogged working fluid stays on the peripheral portion of the surface plate, and the water surface of the working fluid on the surface plate becomes a mortar shape in which the bottom portion is disposed on the center portion of the surface plate. Therefore, the liquid level position of the machining liquid at the peripheral part of the surface plate becomes higher than the liquid level position of the machining liquid at the center part of the surface plate, and there is a difference in level between the two liquid levels. Siphon action occurs. As a result, the machining fluid that has flowed to the peripheral portion of the surface plate by centrifugal force during rotation of the surface plate is introduced into the conduit from the opening at one end of the conduit disposed at the peripheral portion of the surface plate, and flows in the conduit. . Then, the machining fluid is discharged from the opening at the other end of the conduit disposed at the center of the surface plate, and is supplied again onto the surface plate. As a result, since the machining liquid can be circulated without using a special device by utilizing a so-called siphon action, the configuration of the entire polishing apparatus can be simplified.

  Moreover, in the polishing apparatus provided with the annular wall as described above, it is preferable that the side of the surface plate on which the opening of the one end of the conduit is arranged is higher than the opposite side. By carrying out like this, the peripheral part of a surface plate is arrange | positioned in the position higher than the center part of a surface plate in the position where the opening of the end of a conduit | pipe is arrange | positioned. Therefore, in addition to the level difference of the machining liquid level caused by centrifugal force as described above, the level between the machining liquid level at the peripheral edge of the surface plate and the level of the machining liquid at the center of the surface plate The height difference of becomes larger. As a result, the so-called siphon action can be increased, and the working fluid can be circulated more effectively.

  Moreover, in the polishing apparatus provided with the annular wall as described above, a suction device for removing air from the conduit may be further provided. When the siphon effect is used as described above, if air enters the conduit, the continuous processing fluid in the conduit may be cut off, and the processing fluid in the conduit may not flow. In this case, by providing such an aspirator, the working fluid can be flowed by extracting the air in the conduit and continuing the cut working fluid.

  As is clear from the above description, according to the polishing apparatus of the present invention, the amount of processing liquid used for polishing the workpiece can be reduced and the processing cost can be reduced.

  Hereinafter, an embodiment of a polishing apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a side sectional view of a main part of a polishing apparatus according to this embodiment. FIG. 2 is a plan view of the polishing apparatus of FIG.

  The polishing apparatus according to the present embodiment polishes a workpiece with abrasive grains contained in the processing liquid. As shown in FIGS. 1 and 2, a disc-shaped fixed surface on which the workpiece is arranged is provided. A plate 1, a holder 3 that holds the workpiece T on the surface plate 1, and a conduit 5 through which a working fluid flows. On the upper surface of the surface plate 1, an annular wall 7 surrounding the surface plate 1 is provided upward along the peripheral edge thereof. The processing liquid is supplied onto the surface plate 1 as will be described later, but the processing liquid can be stored on the surface plate 1 by the annular wall 7. Further, a plurality of concentric (five in the figure) annular grooves 9a, 9b, 9c, 9d, 9e are formed on the upper surface of the surface plate 1 with the center of the surface plate 1 as the center. The outermost groove 9 e of the annular grooves 9 a to 9 e is formed along the peripheral edge of the surface plate 1 inside the annular wall 7. This outermost groove 9e is hereinafter referred to as a liquid reservoir 9e. As shown in FIG. 1, the upper surface of the surface plate 1 is formed such that the portion 1a surrounded by the innermost groove 9a is lower than the outer portion of the groove 9a.

  As shown in detail in FIG. 3, a center portion of the surface plate 1 includes a through hole 11 that penetrates the surface plate 1, and a bearing portion 13 that is continuous with the through hole 11 and has an inner diameter larger than the diameter of the through hole 11. Is formed. A support shaft member 15 of a conduit 5 to be described later is fitted to the bearing portion 13 so as to rotatably support the surface plate 1.

  As shown in FIG. 3, a peripheral wall 17 surrounding the bearing portion 13 is provided downward on the lower surface of the surface plate 1, and a ring-like shape is provided between the peripheral wall 17 and the support shaft member 15 of the conduit 5. The packing 19 is interposed so that no gap is generated between them. As a result, the machining fluid flowing through the inside of the conduit 5 described later is prevented from leaking between the peripheral wall 17 and the support portion of the conduit 5.

  Further, as shown in FIG. 1, an annular gear 21 formed in an annular shape around the center of the surface plate 1 is provided on the lower surface of the surface plate 11. The annular gear 21 is connected to a driving device 23 such as a motor to rotate the surface plate 1.

  As shown in FIGS. 1 and 2, the conduit 5 is open at both ends, the opening 5a at one end is disposed at the peripheral edge of the surface plate 1, and the opening 5b (see FIG. 3) at the other end is It is arranged at the center of the surface plate 1. More specifically, the conduit 5 has an opening 5a at one end disposed in the liquid reservoir 9e, extends along the liquid reservoir 9e, and then wraps around the annular wall 7 so as to get over the annular wall 7. The lower part of the surface plate 1 extends toward the center of the surface plate 1. An opening 5a at one end of the conduit 5 disposed in the liquid reservoir 9e is directed in a direction opposite to the rotation direction R of the surface plate 1 described later. And, at the end of the conduit 5 extending to the center of the surface plate 1, a cylindrical support shaft member 15 extending in the vertical direction communicates the internal space of the conduit 5 and the internal space of the support shaft member 15. It is provided integrally. As shown in FIG. 3, the support shaft member 15 includes a lower shaft portion 15a and an upper shaft portion 15b integrated with the lower shaft portion 15a and having an outer diameter larger than the outer diameter of the lower shaft portion 15a. Yes. The lower end of the lower shaft portion 15a is fixed to the support base 25, whereby the opening at the lower end of the lower shaft portion 15a is closed. The upper shaft portion 15b is fitted to the bearing portion 13 at the center portion of the surface plate 1, and supports the surface plate 1 so as to be rotatable. Further, the opening at the upper end of the upper shaft portion 15 b is continuous with the through hole 11 in the center portion of the surface plate 1. The support shaft member 15 is a part of the conduit 5, and the opening at the other end of the conduit disposed at the center of the surface plate in the present invention corresponds to the opening at the upper end of the upper shaft portion 15b.

  Further, as shown in FIG. 1, a suction unit 27 for removing air in the conduit 5 is provided at the top portion of the conduit 5 extending so as to get over the annular wall 7. As shown in detail in FIG. 4, the aspirator 27 is attached to a cylindrical cylinder member 29, a piston member 31 inserted into the cylinder member 29, and the cylinder member 29, and the piston member 31 is attached upward. And a coil spring 33 for energizing. The cylinder member 29 has an opening 29a at the lower end and an enlarged diameter portion 29b having a diameter larger than the diameter of the opening 29a. The lower end portion of the cylinder member 29 is attached to the conduit 5, and the opening 29 a is continuous with the hole 5 c formed in the conduit 5. An annular member 35 is attached to the upper portion of the cylinder member 29 to lock a locking ring 31a formed at the lower end portion of the piston member 31 to be described later and restrict the upward movement of the piston member 31. The annular member 35 is composed of two left and right parts. After the piston member 31 is inserted into the cylinder member 29, the two parts are attached to the cylinder member 29 from the left and right, and are joined by welding or the like. .

  The piston member 31 has a through hole 31b in the axial direction, and has an enlarged diameter portion 31c that is continuous with the through hole 31b and has a diameter larger than the diameter of the through hole 31b. A lid plate 37 is attached to the upper end opening of the piston member 31, but a hole 37 a is provided in the center of the lid plate 37 so that the internal space and the external space of the piston member 31 communicate with each other. Yes. A locking ring 31a that protrudes outward is formed at the lower end of the piston member 31. The locking ring 31a is locked by the annular member 35, and the upward movement of the piston member 31 is restricted. ing. Further, the locking ring 31 slides in the vertical direction in close contact with the inner peripheral surface of the enlarged diameter portion 29 b of the cylinder member 29, and the gap between the locking ring 31 and the enlarged diameter portion 29 b of the cylinder member 29 is airtight. I have to.

  In the suction device 27, the hole 5c of the conduit 5, the internal space of the cylinder member 29, and the internal space of the piston member 31 are continuous, and the interior of the conduit 5 communicates with the external space. . In addition, the lower valve body 38 is accommodated in the cylinder member 29, and the lower valve body 38 moves downward by its own weight because the lower portion of the enlarged diameter portion 29b is formed in a mortar shape. The opening 29a can be closed. Moreover, the upper valve body 39 is accommodated in the enlarged diameter part 31c of the piston member 31, and the upper valve body 39 moves downward by its own weight because the lower end part of the enlarged diameter part 31c is formed in a mortar shape. The through hole 31b of the piston member 31 can be closed.

  As will be described later, the machining fluid flows and circulates in the conduit 5, but if air exists in the conduit 5, the continuous machining fluid in the conduit 5 is cut off by the air, and the machining is performed. Liquid does not flow. Further, even if air is mixed in the machining fluid in the conduit during circulation, the continuous machining fluid may be similarly cut off, and the flow of the machining fluid may be stopped. Since the conduit 5 of this embodiment extends over the annular wall 7, the air that has entered the conduit 5 gathers at the top portion to which the aspirator 27 is attached. Therefore, by removing air from the conduit 5 by the suction device 27, the cut working fluid can be connected and the working fluid can be made to flow. Specifically, the suction device 27 configured as described above discharges the air in the conduit 5 as follows.

  First, the piston member 31 is pushed downward against the urging force of the coil spring 33. Then, the opening 29a of the cylinder member 29 is closed by the lower valve body 38, and the space between the locking ring 31a of the piston member 31 and the enlarged diameter portion 29b of the cylinder member 29 is airtight. The air pressure in the diameter portion 29b and in the through hole 31b of the piston member 31 is increased. As a result, the air in the enlarged diameter portion 29b of the cylinder member 29 and the air in the through hole 31b of the piston member 31 pushes up the upper valve body 39, via the enlarged diameter portion 31c of the piston member 31 and the hole 37a of the lid plate 37. It is discharged outside the aspirator 27.

  When the piston member 31 is stopped from being pushed downward, the piston member 31 is pushed back upward by the biasing force of the coil spring 33. Then, the through hole 31b of the piston member 31 is closed by the upper valve body 39 and the space between the locking ring 31a of the piston member 31 and the enlarged diameter portion 29b of the cylinder member 29 is airtight. The air pressure in the through hole 31b and the enlarged diameter portion 29b of the cylinder member 29 is lowered. As a result, the air in the opening 29 a below the cylinder member 29 and the air in the conduit 5 that has flowed in from the conduit 5 pushes up the lower valve body 38 and flows into the enlarged diameter portion 29 b of the cylinder member 29.

  In this way, the air in the conduit 5 is discharged, but if the air still remains in the conduit 5 by the above operation, the above operation is repeated.

  Subsequently, the holder 3 will be described. As shown in FIGS. 1 and 2, the holder 3 includes a correction ring 41, a positioning ring 43, a cloth-like pad 45, and a pressing body 47 arranged inside the correction ring 41. In FIG. 2, the cloth pad 45 and the pressing body 47 are not shown for convenience of explanation. Moreover, in this embodiment, although the three holders 3 are provided, one or more may be sufficient. The correction ring 41 is disposed on the upper surface of the surface plate 1, and an outer peripheral surface thereof is in contact with an inner peripheral surface of the annular wall 7 and is in contact with a holding bearing 49 disposed on the surface plate 1. The holding bearing 49 is not fixed to the surface plate 1 but is rotatably held at a predetermined position by a holding mechanism (not shown). Therefore, when the surface plate 1 is rotationally driven in the direction of arrow R shown in FIG. 2, the correction ring 41 tries to move in the rotational direction, but this movement is blocked by the holding bearing 49. On the other hand, the correction ring 41 is given a rotational force by the frictional resistance between its outer peripheral surface and the inner peripheral surface of the annular wall 7, and thus rotates in the direction of arrow S at that position. In this way, the correction ring 41 does not revolve with respect to the center of the surface plate 1 but rotates on the surface plate 1.

  As shown in FIG. 5, the lower end portion of the correction ring 41 includes a plurality of flat portions 51 that come into contact with the surface plate 1 and a plurality of cutout portions 53. The flat portion 51 is in contact with the upper surface of the surface plate 1 by its own weight, and when the surface plate 1 rotates, the flat portion 51 slides on the surface plate 1 while the correction ring 41 rotates. Therefore, the surface of the surface plate 1 is ground so that it is flat, and the workpiece T is always polished by the flat surface on the surface plate 1.

  As described above, the portion 1a surrounded by the innermost groove 9a on the upper surface of the surface plate 1 is formed to be lower than the outer portion of the groove 9a (see FIG. 1). This is for avoiding a problem that occurs when the correction ring 41 contacts the portion 1 a surrounded by the groove 9 a of the surface plate 1. That is, as shown in FIGS. 1 and 2, the flat portion 51 of the correction ring 41 is in contact with a portion outside the groove 9 a of the surface plate 1. Therefore, when this contact portion is ground by the correction ring 41 as described above, the position of the correction ring 41 moves downward accordingly. Then, when the height of the portion 1a surrounded by the groove 9a of the surface plate 1 and the outer portion thereof is the same, the lower end portion of the correction ring is changed to the portion 1a surrounded by the groove 9a of the surface plate 1. May come into contact. As a result, there arises a problem that the correction ring 41 does not rotate smoothly. On the other hand, by reducing the height of the portion 1a surrounded by the groove 9a of the surface plate 1 in advance, even if the outer portion is ground, the portion 1a surrounded by the groove 9a, the correction ring 41, Are not in contact with each other and the correction ring 41 can rotate smoothly.

  As shown in FIG. 1, the lower surface of the correction ring 41 is in contact with the upper surface of the surface plate 1, but the annular groove 9 e (liquid reservoir) is formed along the peripheral edge of the surface plate 1 as described above. By forming, the outer edge 41a of the lower surface of the correction ring 41 is not in contact with the edge 1b where the inner peripheral surface of the annular wall 7 and the surface plate 1 intersect. This prevents wear of the outer edge 41a of the correction ring 41 due to contact with the edge 1b.

  As shown in FIGS. 1 and 2, the positioning ring 43 is arranged on the surface plate 1, and the workpiece T is arranged and held in the central hole.

  As shown in FIG. 1, the pressing body 47 is configured to press the workpiece T against the surface plate 1 by its own weight with a cloth pad 45 interposed between the pressing body 47 and the workpiece T. The cloth-like pad 45 is formed of a flexible material such as felt so that the upper surface of the workpiece T is not damaged.

  The working fluid used in the polishing apparatus according to the present embodiment is a liquid containing a high-hardness fine abrasive material, such as water, rapeseed oil, olive oil, machine oil, paraffin oil, Examples thereof include gold sand, alumina powder, silicon carbide powder, diamond powder and the like.

  Although not shown, in the polishing apparatus according to the present embodiment, the side where the opening 5a at one end of the conduit 5 is disposed (the right side in FIG. 1 and hereinafter referred to as the conduit 5 side) is the opposite side. The entire apparatus is installed in an inclined state so as to be arranged at a higher position (left side in FIG. 1). For example, it is installed so that a height difference of about several millimeters is made between the left and right ends of the surface plate 1.

  Next, the usage method and operation of the polishing apparatus according to this embodiment will be described. As shown in FIGS. 1 and 2, first, the workpiece T is placed on the surface plate 1, and the workpiece T is held by the holder 3. Specifically, the correction ring 41 is disposed on the surface plate 1 such that the outer peripheral surface is in contact with the inner peripheral surface of the annular wall 7 of the surface plate 1 and the holding bearing 49. Then, the positioning ring 43 is disposed inside the correction ring 41, and the workpiece T is disposed in the central hole of the positioning ring 43 and placed on the surface plate 1. Next, the cloth-like pad 45 is placed on the upper surface of the workpiece T, and the pressing body 47 is placed thereon. Thereby, the workpiece T arranged on the surface plate 1 is held by the holder 3.

  Then, a predetermined amount of machining liquid is supplied onto the surface plate 1 so that the entire upper surface of the surface plate 1 is covered with the machining liquid. Then, the processing liquid flows into the conduit 5 through the through hole 11 at the center of the surface plate 1 and the inside of the support shaft member 15, and the liquid reservoir portion of the surface plate 1 also from the opening 5 a at one end of the conduit 5. The machining fluid in 9e flows. At this time, since air exists in the conduit 5, the piston member 31 of the suction device 27 is moved up and down to discharge air from the conduit 5. As a result, the machining fluid flowing from the through hole 11 of the surface plate 1 and the machining fluid flowing from the opening 5a at one end of the conduit 5 are in a continuous state in the conduit 5, and the conduit 5 is filled with the machining fluid. .

  In this state, the surface plate 1 is rotated in the direction of arrow R in FIG. Then, the workpiece T rotates in the arrow S direction in FIG. 2 together with the correction ring 41 while sliding on the surface plate 1. Then, the processing liquid on the surface plate 1 flows toward the peripheral edge of the surface plate 1 by centrifugal force. At this time, the machining fluid flowing into the peripheral edge of the surface plate 1 is blocked by the annular wall 7 surrounding the surface plate 1. Then, the clogged working fluid stays on the peripheral portion of the surface plate 1, and the water surface of the working fluid on the surface plate 1 is centered on the surface plate 1 as illustrated by the two-dotted line L in FIG. It has a mortar shape with the bottom on top. Thereby, the liquid level P of the processing liquid in the peripheral part of the surface plate 1 becomes higher than the liquid level Q of the processing liquid in the central part, and a difference in level occurs in the liquid level of the processing liquid. Further, since the surface plate 1 is higher on the conduit 5 side (the right side in FIG. 1) than the central portion, the peripheral portion of the surface plate 1 is fixed at the position where the opening 5a at one end of the conduit 5 is disposed. It is arranged at a position higher than the central part of the board 1. Therefore, in addition to the level difference of the machining liquid level caused by the centrifugal force as described above, the liquid level position of the machining liquid at the peripheral part of the surface plate 1 and the liquid level position of the machining liquid at the center part of the surface plate 1 The height difference between becomes larger.

  Then, since the so-called siphon action occurs due to the difference in level of the liquid surface, the working fluid that has flowed to the peripheral edge of the surface plate 1 by the centrifugal force during the rotation of the surface plate 1 is arranged at the peripheral edge of the surface plate 1. It is introduced into the conduit 5 from the opening 5 a at one end of the conduit 5. The machining fluid introduced into the conduit 5 flows through the conduit 5, is discharged from the opening 5 b at the other end disposed at the center of the surface plate 1, and is supplied onto the surface plate 1. The machining fluid supplied to the center portion of the surface plate 1 is made to flow again toward the peripheral portion of the surface plate 1 by centrifugal force. Thus, a predetermined amount of the machining fluid supplied onto the surface plate 1 circulates on the surface plate 1 and the conduit 5 while the surface plate 1 is rotating, and from the center of the surface plate 1 onto the surface plate 1. Continuously supplied. Thereby, the machining fluid supplied onto the surface plate 1 continuously flows between the surface plate 1 and the workpiece T. The workpiece T arranged on the surface plate 1 slides on the surface plate 1 by the rotation of the surface plate 1, and is caused by abrasive grains in the machining fluid interposed between the surface plate 1 and the workpiece T. Polished.

  Further, the machining liquid that has flowed into the peripheral edge of the surface plate 1 by centrifugal force is overflowed from the liquid reservoir 9e. Therefore, the overflowing machining fluid flows into the plurality of notches 53 of the correction ring 41. The working fluid in the notch 53 moves with the notch 53 as the correction ring 41 rotates, and flows out from the notch 53 while moving toward the center of the surface plate 1.

  As described above, according to the polishing apparatus of the present embodiment, the machining liquid that has flowed to the peripheral edge of the surface plate 1 by centrifugal force is introduced from the opening 5 a at one end of the conduit 5, and the machining fluid introduced into the conduit 5 is removed. The platen is discharged from the opening 5b at the other end arranged at the center of the platen 1 and supplied again onto the platen 1. Therefore, since a predetermined amount of machining liquid supplied onto the surface plate 1 can be circulated and used, the amount of machining liquid used can be reduced compared to the conventional example, and the machining cost can be reduced. In addition, since the machining fluid can be circulated without using a special device by utilizing a so-called siphon action, the configuration of the entire polishing apparatus can be simplified.

  Moreover, since the machining fluid overflowing from the liquid reservoir 9e can be conveyed toward the center of the surface plate 1 by the notch 53 of the correction ring 41, the machining fluid that has flowed to the peripheral portion of the surface plate 1 is It can be dispersed again on the surface plate 1. Therefore, in addition to supplying the machining fluid to the center portion of the surface plate 1 using the conduit 5 and dispersing the machining fluid on the surface plate 1, the machining fluid is also dispersed by the notch 53 of the correction ring 41. be able to. Therefore, the machining liquid can be more effectively dispersed, and the abrasive grains in the machining liquid can be evenly distributed on the surface plate 1 to further improve the polishing accuracy of the workpiece T.

  As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible unless it deviates from the meaning. In the said embodiment, as shown in FIGS. 1-3, the conduit | pipe 5 arrange | positions the opening 5a of one end in the peripheral part of the surface plate 1, turns around under the surface plate 1, and makes opening 5b of the other end. Although it arrange | positions in the center part of a surface plate, it is not limited to this. For example, after the opening at one end of the conduit is arranged at the peripheral portion of the surface plate 1, the upper portion of the surface plate 1 is extended toward the central portion, and the opening at the other end of the conduit is disposed above the central portion of the surface plate 1. Also good. In this case, in the above-described embodiment, the through hole 11 in the center of the surface plate 1 shown in FIG. 3 is not necessary, and only the support shaft member 15 of the conduit 5 for rotatably supporting the surface plate 1 is necessary. In this case, the opening at the other end of the conduit is disposed so as to be immersed in the machining liquid supplied onto the surface plate 1.

  Further, the polishing apparatus according to the above embodiment is installed in a state where the entire apparatus is inclined. For example, by the centrifugal force as described above, the liquid surface position of the processing liquid in the peripheral portion of the surface plate 1 and the center If there is a difference in level with the liquid level position of the processing liquid in the section, the entire apparatus may be installed in a horizontal state without tilting.

  In addition, the suction device 27 may be appropriately provided as necessary, and when not necessary, the hole 5c of the conduit 5 is closed. In this case, for example, the working fluid in the conduit 5 is sucked from the through-hole 11 of the surface plate 1, or conversely, air is introduced from the inside of the conduit 5 by means such as a pump for introducing the working fluid from the through-hole 11 of the surface plate 1. Can be discharged.

It is side surface principal part sectional drawing of the grinding | polishing apparatus which concerns on this embodiment. FIG. 2 is a plan view of the polishing apparatus in FIG. 1. It is an expanded principal part sectional view of the A section in FIG. It is an expanded sectional view of the B section in FIG. It is a figure which shows the cross section and back surface of the correction ring.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface plate 3 Holder 5 Conduit 7 Annular wall 5a Opening of one end of conduit 5b Opening of other end of conduit 27 Suction device 41 Correction ring 43 Positioning ring 45 Cloth pad 47 Press body T Workpiece

Claims (1)

A polishing apparatus for polishing a workpiece with abrasive grains contained in a processing liquid,
A surface plate on which a workpiece is arranged and a machining fluid is supplied and driven to rotate,
Opening at both ends, an opening at one end is disposed at the peripheral edge of the surface plate, an opening at the other end is disposed at the central portion of the surface plate, and a conduit through which the machining fluid passes,
An annular wall provided to surround the periphery of the surface plate;
A liquid reservoir comprising a groove formed along the peripheral edge of the surface plate inside the annular wall;
With
The surface plate has a through-hole formed at the center,
The conduit has an opening at one end of the conduit disposed in the liquid reservoir, and one end of the conduit extends along the liquid reservoir and then wraps around the annular wall so as to get over the annular wall. , Extending below the surface plate toward the center of the surface plate, the opening of the other end communicates with the through hole,
The polishing apparatus further comprising a suction device provided at a top portion of the conduit for extracting air from the conduit .

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