JPS6383253U - - Google Patents

Info

Publication number
JPS6383253U
JPS6383253U JP1986176178U JP17617886U JPS6383253U JP S6383253 U JPS6383253 U JP S6383253U JP 1986176178 U JP1986176178 U JP 1986176178U JP 17617886 U JP17617886 U JP 17617886U JP S6383253 U JPS6383253 U JP S6383253U
Authority
JP
Japan
Prior art keywords
wafer
polishing
eccentric
sided
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986176178U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986176178U priority Critical patent/JPS6383253U/ja
Publication of JPS6383253U publication Critical patent/JPS6383253U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す図、第2図は実
施例による研摩液の流れを示す図、第3図は従来
の偏芯両面ポリツシング装置を示す図、第4図は
従来の研摩液の流れを示す図である。図において
、1はウエハ、2はキヤリアプレート、3は上面
研摩板、4は下面研摩板、5は研摩液、6は研摩
液供給口、7はダミーポケツトである。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a diagram showing the flow of polishing liquid according to the embodiment, Fig. 3 is a diagram showing a conventional eccentric double-sided polishing device, and Fig. 4 is a diagram showing a conventional eccentric double-sided polishing device. It is a figure showing the flow of liquid. In the figure, 1 is a wafer, 2 is a carrier plate, 3 is an upper polishing plate, 4 is a lower polishing plate, 5 is a polishing liquid, 6 is a polishing liquid supply port, and 7 is a dummy pocket.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キヤリアプレートによつて保持されたウエハを
偏芯された上下の研摩板によつて挾み、該研摩板
を回転させることにより、該ウエハの研摩を行な
う偏芯両面ポリツシング装置において、該キヤリ
アプレートに研摩液をウエハの上下面に分流する
形状を有するダミーポケツトを設けることを特徴
とする偏芯両面ポリツシング装置。
In an eccentric double-sided polishing device, a wafer held by a carrier plate is sandwiched between eccentric upper and lower polishing plates, and the wafer is polished by rotating the polishing plates. An eccentric double-sided polishing device characterized by providing a dummy pocket having a shape that divides polishing liquid into the upper and lower surfaces of a wafer.
JP1986176178U 1986-11-17 1986-11-17 Pending JPS6383253U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986176178U JPS6383253U (en) 1986-11-17 1986-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986176178U JPS6383253U (en) 1986-11-17 1986-11-17

Publications (1)

Publication Number Publication Date
JPS6383253U true JPS6383253U (en) 1988-06-01

Family

ID=31116176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986176178U Pending JPS6383253U (en) 1986-11-17 1986-11-17

Country Status (1)

Country Link
JP (1) JPS6383253U (en)

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