JPS61166142A - Wiring for integrated circuit - Google Patents

Wiring for integrated circuit

Info

Publication number
JPS61166142A
JPS61166142A JP785985A JP785985A JPS61166142A JP S61166142 A JPS61166142 A JP S61166142A JP 785985 A JP785985 A JP 785985A JP 785985 A JP785985 A JP 785985A JP S61166142 A JPS61166142 A JP S61166142A
Authority
JP
Japan
Prior art keywords
wiring
segments
boundary line
decided
clearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP785985A
Other languages
Japanese (ja)
Inventor
Shogo Hayashi
省吾 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP785985A priority Critical patent/JPS61166142A/en
Publication of JPS61166142A publication Critical patent/JPS61166142A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To enable to rapidly decide a wiring ranging from its one end to its other end without spending a wasteful labor hour by a method wherein a clearance with the prescribed interval to the segments for the wiring route decided at first is set on the inner side of the wiring region and a new wiring region boundary line is formed. CONSTITUTION:Before the first wiring route is decided, a boundary line 2 with a clearance to the frame of a wiring region 1 is formed on the periphery of the inner side of the wiring region 1. After that, after segments, which are used as the wiring ranging from a starting end Si to a terminal Ti, are decided according to the prescribed procedures, segments bi1, Bi2...bil parallel to the segments decided are formed in the residual wiring region in such a way as to have a clearance width to the segments decided for setting a clearance for the following wiring to be formed adjacent to the wiring decided at first. A boundary line 3 to show the residual wiring region is anew formed from both of the segments bi1...bil formed according to these procedures and the boundary line 2 formed at first. This boundary line 3 gives a direction needed for deciding the following wiring route.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 この発明はIC,LSI等の半導体チップにおける集積
回路の配線方法に関し、特に計算機を利用した自動配線
を高速化するための配線方法に関する。
DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a wiring method for integrated circuits in semiconductor chips such as ICs and LSIs, and more particularly to a wiring method for speeding up automatic wiring using a computer.

〈発明の概要〉 この発明は、半導体チップ内の一部領域に複数本の配線
を互いに交差することなく一層に形成するだめ、配線の
順序側けがなさ汎た複数の配線に対して、配線の順序イ
」けに従って第1番目の配線のための始端及び終端間か
ら順次領域境界線に添って配線経路として結線し、各始
端及び終端間のる。
<Summary of the Invention> The present invention has the advantage of forming a plurality of wires in a single layer in a part of a semiconductor chip without intersecting each other. According to the order, the wiring is sequentially connected as a wiring route along the area boundary line from between the starting end and the ending end for the first wiring, and the wiring is connected between each starting end and the ending end.

〈従来の技術〉 集積回路用の半導体チップに配線を形成する作業におい
て計算機を利用して自動配線する手法が開発されている
。このよう々従来から行われる自動配線手法としては、
迷路法或いはラインサーチ法などがある、上記いずれの
手法も配線のための始端に対して、まず配線経路を決定
するために配線の終端を日差して配線領域内を進行し、
既に決定した他の配線との交差等による障害が生じた時
点で現在進行してきた経路は不適切であったとして」二
記始端に戻り、再び異なる経路で終端に向って作業が進
められ、始端から障害なく終端に達することができるま
で作業を経返して配線を決定している。
<Prior Art> In the work of forming wiring on a semiconductor chip for an integrated circuit, a method of automatically wiring using a computer has been developed. These traditional automatic wiring methods include:
In any of the above methods, such as the maze method or the line search method, firstly, in order to determine the wiring route, the terminal end of the wiring is exposed to sunlight, and the wiring is progressed within the wiring area.
The route that was currently being progressed was deemed to be inappropriate at the time when an obstacle occurred due to intersection with other wiring that had already been determined, and the work was returned to the starting point and proceeded to the ending point again using a different route. The wiring is determined by repeating the work until the end can be reached without any problems.

〈発明が解決しようとする問題点〉 このように従来の手法では途中に障害があっても予め知
ることができず、障害に出会うまで配線作業を進めた後
再度起点に戻って作業をやり直さねばならないという問
題があり、見つけたい経路以外の線分をも探索すること
になって処理時間が長期に及び、集積回路の設計に支障
をきたしていた。
<Problem that the invention seeks to solve> In this way, with conventional methods, it is not possible to know in advance if there is a problem on the way, and the wiring work must proceed until the problem is encountered, then return to the starting point and start the work again. The problem is that line segments other than the desired route must be searched, resulting in a long processing time and hindering the design of integrated circuits.

〈問題点を解決す不ための手段〉 上記のような従来の配線方法の欠点を除去するため、本
発明は、複数本の配線が含捷れるある配線領域について
、複数本の配線は互いに交差し々いように予め配線順序
が決定され、その決定に従って配線経路を描く際、先に
決定された配線経路によって形成された配線領域の境界
に添わせて次の配線経路を決定する。上記の決定された
配線経路により形成された配線領域としては、予め配線
相互間のクリアランスも含めて形成する。
<Means for Solving the Problems> In order to eliminate the drawbacks of the conventional wiring method as described above, the present invention provides a method for eliminating the problem in which the plurality of wires intersect with each other in a certain wiring area where a plurality of wires intersect. The wiring order is determined in advance, and when drawing a wiring route according to this determination, the next wiring route is determined along the boundary of the wiring area formed by the previously determined wiring route. The wiring area formed by the above-determined wiring route is formed in advance, including clearances between the wirings.

〈作用〉 」−記配線手法により、げ、llrM序付けられた各配
線について、既に決められた配線経路に厚いて形成され
る配線領域の境界に添って配線のための線分探索がなさ
れる。従って無駄な探索を実行することがなく々す、剛
線処理の高速化を図ることができる。 ・ 〈実施例〉 第1図(a)に示す配線領域1ば、集積回路半導体チッ
プにおける一部分で、該配線領域1にはその周囲の≧1
′−導体基板に設けられた半導体回路を相互に接続する
ための配線が、以下に説明する手順で互いに交差するこ
と々〈一層に形成される。配線領域1としては通常複数
本(0本)の配線が含まれることになるが、配線の1対
の端はいずれも配線領域を囲む枠−Fに在る。
〈Operation〉 - According to the wiring method described above, a line segment search for wiring is performed for each wire ranked ``G, llrM'' along the boundary of a thick wiring area formed on the already determined wiring route. . Therefore, it is possible to speed up rigid line processing without executing unnecessary searches. - <Example> The wiring area 1 shown in FIG. 1(a) is a part of an integrated circuit semiconductor chip, and the wiring area 1 has a
- Wiring lines for interconnecting semiconductor circuits provided on a conductive substrate are formed in a single layer by crossing each other in the following procedure. The wiring region 1 usually includes a plurality of wires (zero wires), and each pair of ends of the wires are located in a frame -F surrounding the wiring region.

0本の各配線は配線領域の枠上に座標が与えられた1対
の点を結ぶ線分によって表現することができ、配線領域
1という予め決められた領域内でこれら1対の座標間を
結ぶ線分は、それらの座標を与えると共に、互いに線分
が交差してはならない条件を設定することによって第1
番目から第n番目までの配線の順序付けがなされる。
Each 0 wire can be expressed by a line segment connecting a pair of points whose coordinates are given on the frame of the wiring area, and between these pair of coordinates within a predetermined area called wiring area 1. Connecting line segments are first determined by giving their coordinates and setting a condition that line segments must not intersect with each other.
The wiring from the th to the nth is ordered.

処で配線相互間は単に交差しないだけではなく、剛線間
に製造技術上の制約等に基くクリアランスが設定される
However, not only do the wires not intersect with each other, but also clearances are set between the rigid wires based on manufacturing technology constraints.

次に線分同士のクリアランスを保ちつつ配線を決定する
手順について説明する。
Next, a procedure for determining wiring while maintaining clearance between line segments will be described.

配線領域1の枠上に在る1番目の配線のための2点を第
1図(1〕)の如く始端S1、終端TIとする。
The two points for the first wiring on the frame of the wiring area 1 are defined as the starting end S1 and the ending end TI, as shown in FIG. 1 (1).

■ 捷ず最初の配線経路を決定する前に、配線領域1の
枠に対して、領域内側周囲に上記クリアランスをもった
境界線2を形成する。
(2) Before determining the first wiring route, a boundary line 2 with the above-mentioned clearance is formed around the inside of the wiring area 1 with respect to the frame of the wiring area 1.

■ 菫番目の配線経路を決定するため、まず始端Siか
ら配線領域内部に向って境界線2に達するまで線分a 
が形成される。上記線分a H1を含めて以下配線のた
めの線分は、いずれも水平垂直の関係になるように延ば
され、それらは通常は配線領域1の枠線に平行或いは垂
直をなす。
■ To determine the violet-th wiring route, first draw a line segment a from the starting edge Si toward the inside of the wiring area until reaching boundary line 2.
is formed. The line segments for wiring below, including the line segment aH1, are all extended horizontally and vertically, and are usually parallel or perpendicular to the frame line of the wiring area 1.

終端Tiからも同様に境界線2に達する線分a1pを形
成する。
Similarly, a line segment a1p reaching the boundary line 2 is formed from the terminal end Ti.

」−記線分a11の境界2に達した点から、予め決めら
れた境界に添って次の線分a、2.a13・・・が形成
される。始端S1から延ばした線分ai、。
” - From the point reaching boundary 2 of marked line segment a11, move along the predetermined boundary to the next line segment a, 2 . a13... is formed. A line segment ai extended from the starting point S1.

al。・・・が、終端Tiからの線分a14に到達した
点で1番目の配線を完了する。
al. ... completes the first wiring at the point when it reaches the line segment a14 from the terminal Ti.

ここで」−記予め決められた境界とは、第1番目の配線
にとっては境界線2となるが、1番目の配線については
(i−1)番目の配線を決定となる。
Here, the predetermined boundary indicated by "-" is the boundary line 2 for the first wiring, but for the first wiring, the (i-1)th wiring is determined.

■ 上記手順によって始端S1から終端Tiに達する配
線となる線分が決定された後、次の近接する配線に対す
るクリアランスを設定するため、決定された線分につい
て残りの配線領域内にクリアランスの幅をもたせて第1
図(C)の如く平行な線分bi+ 、 bi2・ bI
eを形成する。
■ After the line segment that will be the wiring from the start end S1 to the end Ti is determined by the above procedure, in order to set the clearance for the next adjacent wiring, the width of the clearance is set in the remaining wiring area for the determined line segment. First of all
Parallel line segments bi+, bi2・bI as shown in figure (C)
form e.

■ 上記手順によって形成した平行々線分bi+bIe
と先に形成した境界線2とから、残りの配線領域につい
て第1図(d)の如く新しく境界線3を形成する。この
境界線が次の配線経路を決定するだめの方向を与える。
■ Parallel line segment bi+bIe formed by the above procedure
From the previously formed boundary line 2, a new boundary line 3 is formed for the remaining wiring area as shown in FIG. 1(d). This boundary line provides the direction for determining the next wiring route.

−1−記手順■から■を始端及び終端の1−19寸で実
行して配線領域1内にn本の配線を形成する。
-1- Execute steps ① to ② at the 1-19th dimension of the starting end and the ending end to form n wires in the wiring area 1.

ここで上記手順を実行する場合に、特に手順■の段階で
次のような問題が生じ得る。
When the above procedure is executed here, the following problem may occur, especially at step (2).

例えば(j−1)番目の配線を完了して新たな配線領域
の境界線4が第2図(a)に示すように形成されたとす
る。次に始端Sから終端Tに達する3番目の配線を、上
述の手順■に従って実行すると、配線結果は第2図(1
〕)の太線で示す線分5となる。
For example, assume that the (j-1)th wiring is completed and a boundary line 4 of a new wiring area is formed as shown in FIG. 2(a). Next, when the third wiring from the starting end S to the ending end T is executed according to the above procedure ■, the wiring result is shown in Figure 2 (1
] ) is line segment 5 shown by a thick line.

このような線分5に手順■の処理を実行すると、第2図
(c)の如く線分1〕、1〜b1.1  のうち対向す
る線分間の間隔が充分でない領域については線分b と
1) 或いは線分bj、とbj9の如く交差するJ5 
   18 点が生じる。このように交差した平行線分に挾捷れた平
行線分は交差を検出して線分から省く処理を施こし、第
2図(d)に示す境界線6を形成する。
When the process of step (2) is executed on such line segment 5, as shown in FIG. and 1) Or line segment bj, intersects J5 like bj9
18 points are generated. The parallel line segments that are intersected by the parallel line segments that intersect in this way are subjected to a process of detecting the intersection and omitting the line segments, thereby forming the boundary line 6 shown in FIG. 2(d).

上記交差点の検出方法としては、両端の座標で与えられ
る各線分1)j1〜11について、水平方向の線分に対
しては垂直方向の線分のより離れた位置にあるものから
近いものに向って順次交差の有無を検出する。本実施例
では、線分bj1に対してb o→l〕 −〉b −>
b 、続いて線分bj11に対Jl     18  
  36     ]1して1〕 →b →l〕・−)
1〕、線分b】2に対して12    J4    3
6    18bjlI01)J9−)l)]7→1〕
J5順に座標データに基いて交差を検出する。線分b 
と線分b1.の交差が検出されてその間の線分b15,
1)16 、I)37 、1)18が痛かれ、第2図(
d)に示す境界線6が形成される。
The method for detecting the intersection is to detect each line segment 1) j1 to 11 given by the coordinates of both ends, and for the horizontal line segment, move from the vertical line segment farther away to the closer one. The presence or absence of intersection is detected sequentially. In this example, for line segment bj1, b o→l〕 −〉b −>
b, followed by line segment bj11 versus Jl 18
36 ] 1 then 1] →b →l]・-)
1], line segment b] 12 J4 3 for 2
6 18bjlI01)J9-)l)]7→1]
Intersections are detected based on the coordinate data in J5 order. line segment b
and line segment b1. The intersection of is detected and the line segment b15,
1) 16, I) 37, 1) 18 hurt, Figure 2 (
A boundary line 6 shown in d) is formed.

〈発明の効果〉 以上本発明によれば、線分間のクリアランスを保ちなが
ら、一端から他端に達する配線を無駄な手間を川けると
と々く速やかに決定することができ、集積回路の半導体
チップ上のパターン設計を著−首<高速化することがで
き、自動配線の効果を”         (8) より一層高めることができる。
<Effects of the Invention> According to the present invention, it is possible to quickly determine the wiring from one end to the other end while maintaining the clearance between the lines, and to avoid wasted time and effort. It is possible to significantly speed up pattern design on a chip, and further enhance the effectiveness of automatic wiring.

【図面の簡単な説明】[Brief explanation of drawings]

一第1図(a)乃至(d)は本発明による一実施例を説
明するだめの配線領域の模型図、第2図(a)乃至(d
)は本発明による一実施例の他の場合を説明するための
配線領域の模型図である。 1:配線領域  2:境界線  ai+〜”i# ”配
線のための線分  b、1〜bj# :境界線のだの線
分  Sl:始端  Tl:終端 代理人 弁理士  福 士 愛 彦(他2名)第1図(
C) 第2図(C7) 第2図(C) 第2図(d)
Figures 1(a) to (d) are schematic diagrams of a wiring area for explaining an embodiment of the present invention, and Figures 2(a) to (d)
) is a model diagram of a wiring area for explaining another case of an embodiment according to the present invention. 1: Wiring area 2: Boundary line ai+~"i#" Line segment for wiring b, 1~bj#: Line segment of boundary line Sl: Starting end Tl: Terminal agent Patent attorney Aihiko Fukushi (et al.) 2 people) Figure 1 (
C) Figure 2 (C7) Figure 2 (C) Figure 2 (d)

Claims (1)

【特許請求の範囲】 1、a、半導体チップ内の一部領域を横切ってなる複数
本の配線を形成する方法において、 b、配線領域の境界上の対応する2点の位置情報に基い
て、配線相互間で交差が生じないように各配線に順序付
けし、 c、領域境界線上の対応する2点間を境界に添った線分
で連結して配線経路を形成し、 d、上記配線経路のための線分に対して領域内側に所定
間隔のクリアランスを設定して新たな領域境界線を形成
してなることを特徴とする集積回路の配線方法。
[Claims] 1. a. A method of forming a plurality of wires crossing a partial region within a semiconductor chip, b. Based on positional information of two corresponding points on the boundary of the wiring region, Order each wire so that no intersection occurs between the wires, c. Connect two corresponding points on the area boundary line with a line segment along the boundary to form a wiring route, and d. 1. A wiring method for an integrated circuit, comprising: forming a new area boundary line by setting a clearance at a predetermined interval inside the area with respect to a line segment for the area.
JP785985A 1985-01-18 1985-01-18 Wiring for integrated circuit Pending JPS61166142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP785985A JPS61166142A (en) 1985-01-18 1985-01-18 Wiring for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP785985A JPS61166142A (en) 1985-01-18 1985-01-18 Wiring for integrated circuit

Publications (1)

Publication Number Publication Date
JPS61166142A true JPS61166142A (en) 1986-07-26

Family

ID=11677372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP785985A Pending JPS61166142A (en) 1985-01-18 1985-01-18 Wiring for integrated circuit

Country Status (1)

Country Link
JP (1) JPS61166142A (en)

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