JPS6116611Y2 - - Google Patents
Info
- Publication number
- JPS6116611Y2 JPS6116611Y2 JP5153079U JP5153079U JPS6116611Y2 JP S6116611 Y2 JPS6116611 Y2 JP S6116611Y2 JP 5153079 U JP5153079 U JP 5153079U JP 5153079 U JP5153079 U JP 5153079U JP S6116611 Y2 JPS6116611 Y2 JP S6116611Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heating element
- heating resistor
- layer
- temperature sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 36
- 238000010438 heat treatment Methods 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 description 7
- 239000003973 paint Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Surface Heating Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5153079U JPS6116611Y2 (enrdf_load_stackoverflow) | 1979-04-17 | 1979-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5153079U JPS6116611Y2 (enrdf_load_stackoverflow) | 1979-04-17 | 1979-04-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55151091U JPS55151091U (enrdf_load_stackoverflow) | 1980-10-31 |
| JPS6116611Y2 true JPS6116611Y2 (enrdf_load_stackoverflow) | 1986-05-22 |
Family
ID=28941047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5153079U Expired JPS6116611Y2 (enrdf_load_stackoverflow) | 1979-04-17 | 1979-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116611Y2 (enrdf_load_stackoverflow) |
-
1979
- 1979-04-17 JP JP5153079U patent/JPS6116611Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55151091U (enrdf_load_stackoverflow) | 1980-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4448617B2 (ja) | 半導体装置及びその製造方法、回路基板並びに電子機器 | |
| JP2832868B2 (ja) | 硬質可撓性プリント回路基板の製造方法及びプリント回路基板製造時における中間製品 | |
| ATE167319T1 (de) | Basis folie für chip karte | |
| JPS6116611Y2 (enrdf_load_stackoverflow) | ||
| JPH05258842A (ja) | 面状発熱体およびその製造方法 | |
| JPS5670655A (en) | Manufacture of electronic circuit mounting device | |
| JPS61188957A (ja) | 回路モジユ−ルの製造方法 | |
| JP3116998B2 (ja) | Ｉｃカードの製造方法 | |
| US6423470B1 (en) | Printed circuit substrate with controlled placement covercoat layer | |
| JPH06139824A (ja) | 異方導電フィルム | |
| JP4288517B2 (ja) | 半導体装置の製造方法 | |
| JPS622593A (ja) | 平滑型回路モジユ−ルの形成方法 | |
| JPS629728Y2 (enrdf_load_stackoverflow) | ||
| JPS6127182Y2 (enrdf_load_stackoverflow) | ||
| JPH0243718A (ja) | コンデンサの外装方法 | |
| JPS5918682Y2 (ja) | 電子部品封止用プリプレグシ−ト | |
| CN116264167A (zh) | 通过使用反应性带制造半导体器件模块的方法和半导体器件模块 | |
| JPS635242Y2 (enrdf_load_stackoverflow) | ||
| JPS6065552A (ja) | Ｉｃカードおよびその製造方法 | |
| JPS6353955A (ja) | プリント配線基板の封止枠の形成方法 | |
| JPS6031636U (ja) | 液晶温度計 | |
| JPS6164024A (ja) | キ−ボ−ドスイツチ | |
| JPH039435Y2 (enrdf_load_stackoverflow) | ||
| JPS6255716B2 (enrdf_load_stackoverflow) | ||
| JPS5819632A (ja) | 電気敷物 |