JPS6116079Y2 - - Google Patents

Info

Publication number
JPS6116079Y2
JPS6116079Y2 JP1980097785U JP9778580U JPS6116079Y2 JP S6116079 Y2 JPS6116079 Y2 JP S6116079Y2 JP 1980097785 U JP1980097785 U JP 1980097785U JP 9778580 U JP9778580 U JP 9778580U JP S6116079 Y2 JPS6116079 Y2 JP S6116079Y2
Authority
JP
Japan
Prior art keywords
needle
blade cutter
thin material
cutting
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980097785U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5723926U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980097785U priority Critical patent/JPS6116079Y2/ja
Publication of JPS5723926U publication Critical patent/JPS5723926U/ja
Application granted granted Critical
Publication of JPS6116079Y2 publication Critical patent/JPS6116079Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Accessories And Tools For Shearing Machines (AREA)
  • Die Bonding (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Shearing Machines (AREA)
JP1980097785U 1980-07-10 1980-07-10 Expired JPS6116079Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980097785U JPS6116079Y2 (enExample) 1980-07-10 1980-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980097785U JPS6116079Y2 (enExample) 1980-07-10 1980-07-10

Publications (2)

Publication Number Publication Date
JPS5723926U JPS5723926U (enExample) 1982-02-06
JPS6116079Y2 true JPS6116079Y2 (enExample) 1986-05-17

Family

ID=29459543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980097785U Expired JPS6116079Y2 (enExample) 1980-07-10 1980-07-10

Country Status (1)

Country Link
JP (1) JPS6116079Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2666391B2 (ja) * 1988-07-14 1997-10-22 日本電気株式会社 遅延線路
DE102006051349A1 (de) * 2006-10-31 2008-05-08 Sms Demag Ag Verfahren und Vorrichtung zum Teilen von Metallband

Also Published As

Publication number Publication date
JPS5723926U (enExample) 1982-02-06

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