JPS61159742A - アウタ−リ−ドボンデイング装置 - Google Patents

アウタ−リ−ドボンデイング装置

Info

Publication number
JPS61159742A
JPS61159742A JP1085A JP1085A JPS61159742A JP S61159742 A JPS61159742 A JP S61159742A JP 1085 A JP1085 A JP 1085A JP 1085 A JP1085 A JP 1085A JP S61159742 A JPS61159742 A JP S61159742A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
lead
punch
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0314227B2 (enrdf_load_stackoverflow
Inventor
Motohiko Kato
元彦 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP1085A priority Critical patent/JPS61159742A/ja
Publication of JPS61159742A publication Critical patent/JPS61159742A/ja
Publication of JPH0314227B2 publication Critical patent/JPH0314227B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1085A 1985-01-04 1985-01-04 アウタ−リ−ドボンデイング装置 Granted JPS61159742A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1085A JPS61159742A (ja) 1985-01-04 1985-01-04 アウタ−リ−ドボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1085A JPS61159742A (ja) 1985-01-04 1985-01-04 アウタ−リ−ドボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61159742A true JPS61159742A (ja) 1986-07-19
JPH0314227B2 JPH0314227B2 (enrdf_load_stackoverflow) 1991-02-26

Family

ID=11462483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1085A Granted JPS61159742A (ja) 1985-01-04 1985-01-04 アウタ−リ−ドボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61159742A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0314227B2 (enrdf_load_stackoverflow) 1991-02-26

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