JPS61152034A - Wafer prober - Google Patents

Abstract

PURPOSE:To detect it for the contact resistance of the probe pins and the bonding pad to augment before any trouble happens and to prevent the trouble from generating by a method wherein a mechanism to polish the points of the probe points and a mechanism to measure the contact resistance of the points of the probe pins and the mechanism are provided. CONSTITUTION:A polishing plate 3 to polish the points of probe pins 2 and a contact plate 4 to measure the contact resistance of the probe pins 2 and the contact plate 4 are installed on a stage 1. When an inspection of wafer 7 is carried out using an IC tester 5, the polishing plate 3 is made to simultaneously shift periodically just under the probe pin 2 by making the stage 1 ascend and the point of the probe pin 2 is brought into a contact to the polishing plate 4 while the polishing plate 4 is made to move vertically to the vertical direction to clean the point of the probe pin. After that, the aluminum plate 4 is made to shift just under the probe pin, the stage 1 is made to ascend in the same manner, the probe pin 2 is brought into contact to the contact plate 4 and the contact resistance is measured by the IC tester 5. When the contact resistance is a certain resistivity set in advance or less, the inspection of wafer 7 is continued, but when the contact resistance is more than the certain resistivity, the inspection is stopped. By this way, an augmentation of the contact resistance due to contamination on the point of the probe pin can be detected. Moreover, it can be prevented that non-defective chips are misrecognized as the defective by defective probe pins and a reduction in the manufacturing yield of chip is brought.

Description

[Detailed description of the invention] [Technical packaging] The present invention is based on 31! ! This invention relates to an IC wafer glover that has the function of manually or automatically transporting the wafer and setting probe pins on the IC wafer when measuring and inspecting the IC wafer.

[Background technology]

In a conventional IC wafer 10-bar device, a semiconductor wafer is fixed on a flat surface (stage) K, and is moved one chip at a time, so that a bonding pad on each chip is brought into contact with a probe pin. Stages are usually X, Y
, Z, and is provided on a triaxial tape μ whose movement tube is controlled by a combinator. By moving this stage in the X and Y directions, the wafer moves in the plane direction, and by moving in the vertical direction, the bonding pads of each chip and probe pins come into contact. At this time, by using an IC tester, the electrical characteristics of the chip can be detected and the quality of the chip can be determined. However, fine deposits remained on the tip of the Queha Propa O probe pin), and the bonding pad (11!
If the contact condition between the probe pin and the bonding pad deteriorates, the chip may be good, but the contact between the probe pin and the bonding pad may be poor (
High contact resistance) may result in the product being judged as defective.

Once the contact resistance becomes high, most of the chips subsequently tested during automatic testing will be determined to be defective, resulting in an extremely low yield. As described above, with the conventional wafer proper device, it has been impossible to detect and prevent the occurrence of leather which increases the contact resistance of the probe pins.

[Purpose of the invention] An object of the present invention is to provide a wafer blower device that detects and prevents an increase in contact resistance between a probe pin and a bonding pad. [Disclosure of the Invention]

The gist of the present invention is a wafer de-roper device that has a mechanism for polishing probe pins and a mechanism for measuring contact resistance at the tip of the probe pin, and has five sections for polishing the probe pins and diagnosing contact resistance. .

FIG. 1 shows the stage section of the wafer proper device. Stage (1) is numerically controlled as in the conventional example.

By moving this stage in the x and y (horizontal) directions, the wafer (8) moves, and by moving it up and down in the 2 (vertical) directions, each chip (8) formed on the wafer (8) is moved.
The method for conducting the test 6) is the same as the conventional method. A polishing plate (3) and a contact plate (4) for the probe pin (2) are installed on the stage (1). IC tester wafer (7)
When inspecting (inspecting each chip), at the same time, periodically move the polishing plate (4) directly below the probe pin (2) and move it up and down in the vertical direction to place the tip of the probe pin (2) on it for cleaning. do. Then probe pin (2
) Move the aluminum plate (4) directly below and place the stage (
1) Bring the probe pin (2) and the contact plate (4) into contact with each other by raising the probe pin (t), and measure the contact resistance using the IC tester (5). The contact plate (4) is made of a conductive metal plate such as aluminum or copper, and the polishing plate (3) is made of a cefmic plate, a grindstone, or the like. If this contact resistance is below a certain predetermined value, the wafer inspection is continued, but if it is above a certain value, the inspection is stopped. These operations are IC0a*
It is inserted into the program so that it can be performed at any time.

[Effects of the Invention] As described above, according to the present invention, it is possible to detect an increase in contact resistance due to dirt on the tip of a probe pin, and a defective probe pin can cause a good chip to be mistakenly recognized as defective, resulting in a decrease in yield. This makes it possible to prevent this.

[Brief explanation of the drawing]

1 to 3 are views showing one embodiment of the present invention, in which FIGS. 1 and 2 are plan views, and FIG. 3 is a side view. (1)...Stage (2 doors...Probe pin (3)
)... Polishing plate (4)... Contact plate (5)... IC
Tester (6)...Chip (7)...Ponding pad (8)...Wafer.

Claims (1)

[Claims] (1) A wafer prober device having a mechanism for polishing the probe pin and a mechanism for measuring the contact resistance at the tip of the probe pin, and capable of polishing the probe pin and diagnosing the contact resistance.