JPS61152029A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法

Info

Publication number
JPS61152029A
JPS61152029A JP59272828A JP27282884A JPS61152029A JP S61152029 A JPS61152029 A JP S61152029A JP 59272828 A JP59272828 A JP 59272828A JP 27282884 A JP27282884 A JP 27282884A JP S61152029 A JPS61152029 A JP S61152029A
Authority
JP
Japan
Prior art keywords
wire
bonding
lead
wires
energizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59272828A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0564462B2 (enExample
Inventor
Michio Okamoto
道夫 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59272828A priority Critical patent/JPS61152029A/ja
Publication of JPS61152029A publication Critical patent/JPS61152029A/ja
Publication of JPH0564462B2 publication Critical patent/JPH0564462B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07533—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP59272828A 1984-12-26 1984-12-26 ワイヤボンディング方法 Granted JPS61152029A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59272828A JPS61152029A (ja) 1984-12-26 1984-12-26 ワイヤボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59272828A JPS61152029A (ja) 1984-12-26 1984-12-26 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JPS61152029A true JPS61152029A (ja) 1986-07-10
JPH0564462B2 JPH0564462B2 (enExample) 1993-09-14

Family

ID=17519329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59272828A Granted JPS61152029A (ja) 1984-12-26 1984-12-26 ワイヤボンディング方法

Country Status (1)

Country Link
JP (1) JPS61152029A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142647A (en) * 1980-04-05 1981-11-07 Shinkawa Ltd Wire bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142647A (en) * 1980-04-05 1981-11-07 Shinkawa Ltd Wire bonding method

Also Published As

Publication number Publication date
JPH0564462B2 (enExample) 1993-09-14

Similar Documents

Publication Publication Date Title
EP0540189B1 (en) Control system
US8267303B2 (en) Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds
US5839640A (en) Multiple-tool wire bonder
US5494207A (en) Wire bonder transducer arrangement and method
US5044543A (en) Wire bonding method and apparatus
EP0502674A2 (en) High yield clampless wire-bonding method
US5607096A (en) Apparatus and method for ultrasonic bonding lead frames and bonding wires in semiconductor packaging applications
US6182882B1 (en) Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
JPH0550136B2 (enExample)
JPS61152029A (ja) ワイヤボンディング方法
US5360155A (en) Wire bonding apparatus
JPH02299247A (ja) ボンデイング方法
US10692835B2 (en) Ball bond attachment for a semiconductor die
JP2954093B2 (ja) ワイヤボンディング装置
JP3313568B2 (ja) ワイヤボンディング装置およびその制御方法
JP2555120B2 (ja) ワイヤボンディング方法
JP2761922B2 (ja) ワイヤボンディング方法および装置
JPH03203340A (ja) ワイヤボンディング方法および装置
JP2001129469A (ja) ペースト塗布方法
GB2270868A (en) Wire bonding control system.
JPS6122641A (ja) 超音波加工装置
JPH1056034A (ja) ボンディング装置
JPS62123728A (ja) ワイヤボンデイング方法および装置
JPS6050933A (ja) ワイヤボンディング装置
JPS63233542A (ja) ワイヤボンデイング装置