JPS61152029A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法

Info

Publication number
JPS61152029A
JPS61152029A JP59272828A JP27282884A JPS61152029A JP S61152029 A JPS61152029 A JP S61152029A JP 59272828 A JP59272828 A JP 59272828A JP 27282884 A JP27282884 A JP 27282884A JP S61152029 A JPS61152029 A JP S61152029A
Authority
JP
Japan
Prior art keywords
wire
bonding
lead
wires
energizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59272828A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0564462B2 (enExample
Inventor
Michio Okamoto
道夫 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59272828A priority Critical patent/JPS61152029A/ja
Publication of JPS61152029A publication Critical patent/JPS61152029A/ja
Publication of JPH0564462B2 publication Critical patent/JPH0564462B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP59272828A 1984-12-26 1984-12-26 ワイヤボンディング方法 Granted JPS61152029A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59272828A JPS61152029A (ja) 1984-12-26 1984-12-26 ワイヤボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59272828A JPS61152029A (ja) 1984-12-26 1984-12-26 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JPS61152029A true JPS61152029A (ja) 1986-07-10
JPH0564462B2 JPH0564462B2 (enExample) 1993-09-14

Family

ID=17519329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59272828A Granted JPS61152029A (ja) 1984-12-26 1984-12-26 ワイヤボンディング方法

Country Status (1)

Country Link
JP (1) JPS61152029A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142647A (en) * 1980-04-05 1981-11-07 Shinkawa Ltd Wire bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142647A (en) * 1980-04-05 1981-11-07 Shinkawa Ltd Wire bonding method

Also Published As

Publication number Publication date
JPH0564462B2 (enExample) 1993-09-14

Similar Documents

Publication Publication Date Title
US5060841A (en) wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
EP0540189A2 (en) Control system
US8267303B2 (en) Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds
US5839640A (en) Multiple-tool wire bonder
JP2516806B2 (ja) ワイヤボンデイング方法及びその装置
US5176311A (en) High yield clampless wire bonding method
US6182882B1 (en) Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
JPH0258845A (ja) 超音波ワイヤボンディング装置
US5360155A (en) Wire bonding apparatus
JPH0564462B2 (enExample)
JPH02299247A (ja) ボンデイング方法
US10692835B2 (en) Ball bond attachment for a semiconductor die
JP2954093B2 (ja) ワイヤボンディング装置
JP3313568B2 (ja) ワイヤボンディング装置およびその制御方法
JP2555120B2 (ja) ワイヤボンディング方法
JP2761922B2 (ja) ワイヤボンディング方法および装置
JPH03203340A (ja) ワイヤボンディング方法および装置
JPH04320048A (ja) 半導体集積回路装置の製造方法
JPS6122641A (ja) 超音波加工装置
JPH1056034A (ja) ボンディング装置
JPS62123728A (ja) ワイヤボンデイング方法および装置
JPS6050933A (ja) ワイヤボンディング装置
JPS63233542A (ja) ワイヤボンデイング装置
JP3455137B2 (ja) ワイヤボンディング方法及び装置
JPS62104126A (ja) ワイヤボンデイング方法