JPS61151278A - 電気絶縁被覆用樹脂組成物及び塗料 - Google Patents
電気絶縁被覆用樹脂組成物及び塗料Info
- Publication number
- JPS61151278A JPS61151278A JP27204084A JP27204084A JPS61151278A JP S61151278 A JPS61151278 A JP S61151278A JP 27204084 A JP27204084 A JP 27204084A JP 27204084 A JP27204084 A JP 27204084A JP S61151278 A JPS61151278 A JP S61151278A
- Authority
- JP
- Japan
- Prior art keywords
- electrical insulation
- resin
- filler
- powder
- insulation coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 21
- 238000000576 coating method Methods 0.000 title claims abstract description 20
- 239000011342 resin composition Substances 0.000 title claims description 10
- 238000010292 electrical insulation Methods 0.000 title claims 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 239000000654 additive Substances 0.000 claims abstract description 9
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000000996 additive effect Effects 0.000 claims abstract description 5
- 238000003618 dip coating Methods 0.000 claims abstract description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 4
- 239000007822 coupling agent Substances 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 239000010936 titanium Substances 0.000 claims abstract description 4
- 239000011134 resol-type phenolic resin Substances 0.000 claims abstract 4
- 239000003973 paint Substances 0.000 claims description 16
- 239000005350 fused silica glass Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920003987 resole Polymers 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 238000005476 soldering Methods 0.000 abstract description 7
- 239000000377 silicon dioxide Substances 0.000 abstract description 4
- 239000002562 thickening agent Substances 0.000 abstract description 3
- 239000000440 bentonite Substances 0.000 abstract description 2
- 229910000278 bentonite Inorganic materials 0.000 abstract description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 150000001412 amines Chemical class 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27204084A JPS61151278A (ja) | 1984-12-25 | 1984-12-25 | 電気絶縁被覆用樹脂組成物及び塗料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27204084A JPS61151278A (ja) | 1984-12-25 | 1984-12-25 | 電気絶縁被覆用樹脂組成物及び塗料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61151278A true JPS61151278A (ja) | 1986-07-09 |
| JPH0349945B2 JPH0349945B2 (OSRAM) | 1991-07-31 |
Family
ID=17508282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27204084A Granted JPS61151278A (ja) | 1984-12-25 | 1984-12-25 | 電気絶縁被覆用樹脂組成物及び塗料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61151278A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62288672A (ja) * | 1986-06-09 | 1987-12-15 | Toshiba Chem Corp | 絶縁塗料 |
| JPH01197573A (ja) * | 1988-01-29 | 1989-08-09 | Murata Mfg Co Ltd | 樹脂系絶縁ペースト |
| JPH01259066A (ja) * | 1988-04-08 | 1989-10-16 | Hitachi Ltd | 熱硬化性樹脂組成物 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5321410A (en) * | 1976-08-10 | 1978-02-27 | Hitachi Zosen Corp | Transporting or storing rank for powder-liquid mixture |
| JPS5439852A (en) * | 1977-09-02 | 1979-03-27 | Fujisawa Denki Seisakushiyo Kk | Automatic winding apparatus for capacitor element |
| JPS58179283A (ja) * | 1982-04-14 | 1983-10-20 | Hitachi Chem Co Ltd | 接着フイルムの製造方法 |
-
1984
- 1984-12-25 JP JP27204084A patent/JPS61151278A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5321410A (en) * | 1976-08-10 | 1978-02-27 | Hitachi Zosen Corp | Transporting or storing rank for powder-liquid mixture |
| JPS5439852A (en) * | 1977-09-02 | 1979-03-27 | Fujisawa Denki Seisakushiyo Kk | Automatic winding apparatus for capacitor element |
| JPS58179283A (ja) * | 1982-04-14 | 1983-10-20 | Hitachi Chem Co Ltd | 接着フイルムの製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62288672A (ja) * | 1986-06-09 | 1987-12-15 | Toshiba Chem Corp | 絶縁塗料 |
| JPH01197573A (ja) * | 1988-01-29 | 1989-08-09 | Murata Mfg Co Ltd | 樹脂系絶縁ペースト |
| JPH01259066A (ja) * | 1988-04-08 | 1989-10-16 | Hitachi Ltd | 熱硬化性樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0349945B2 (OSRAM) | 1991-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI284328B (en) | Conductive paste | |
| JPH06267784A (ja) | 導電性樹脂ペースト及びそれにより成る端子電極を有した積層セラミックチップコンデンサ | |
| JP4235887B2 (ja) | 導電ペースト | |
| JP4235888B2 (ja) | 導電ペースト | |
| KR101814084B1 (ko) | 세라믹 칩부품의 연성외부전극 형성용 도전성 페이스트 조성물 | |
| US5683627A (en) | Curable electroconductive composition | |
| JPS61151278A (ja) | 電気絶縁被覆用樹脂組成物及び塗料 | |
| JP4224771B2 (ja) | 導電ペースト | |
| US4593069A (en) | Epoxy resin composition | |
| JP6777548B2 (ja) | 導電性ペースト | |
| JPH0367402A (ja) | 導電性組成物 | |
| JPH0377202A (ja) | 導電性組成物 | |
| JPS61283671A (ja) | 電気絶縁被覆塗料 | |
| JP2002348528A (ja) | エポキシ樹脂粉体塗料 | |
| JP2003203521A (ja) | 導電ペースト及びその使用 | |
| JPH07252460A (ja) | 接着剤 | |
| JP4235885B2 (ja) | 導電ペースト | |
| JPH0119834B2 (OSRAM) | ||
| SU1052532A1 (ru) | Электропровод щий клей | |
| JP4224774B2 (ja) | 導電ペースト | |
| JPH0250129B2 (OSRAM) | ||
| JPH0249352B2 (OSRAM) | ||
| JPH0426240B2 (OSRAM) | ||
| JP3676930B2 (ja) | 電子部品実装用接合剤およびこれを用いた電子部品の実装方法 | |
| JPS6253531B2 (OSRAM) |