JPS61149476A - スパツタリング装置 - Google Patents

スパツタリング装置

Info

Publication number
JPS61149476A
JPS61149476A JP27224584A JP27224584A JPS61149476A JP S61149476 A JPS61149476 A JP S61149476A JP 27224584 A JP27224584 A JP 27224584A JP 27224584 A JP27224584 A JP 27224584A JP S61149476 A JPS61149476 A JP S61149476A
Authority
JP
Japan
Prior art keywords
chamber
sputtering
chambers
wafers
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27224584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0375631B2 (enrdf_load_stackoverflow
Inventor
Riichiro Aoki
利一郎 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP27224584A priority Critical patent/JPS61149476A/ja
Publication of JPS61149476A publication Critical patent/JPS61149476A/ja
Publication of JPH0375631B2 publication Critical patent/JPH0375631B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP27224584A 1984-12-24 1984-12-24 スパツタリング装置 Granted JPS61149476A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27224584A JPS61149476A (ja) 1984-12-24 1984-12-24 スパツタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27224584A JPS61149476A (ja) 1984-12-24 1984-12-24 スパツタリング装置

Publications (2)

Publication Number Publication Date
JPS61149476A true JPS61149476A (ja) 1986-07-08
JPH0375631B2 JPH0375631B2 (enrdf_load_stackoverflow) 1991-12-02

Family

ID=17511153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27224584A Granted JPS61149476A (ja) 1984-12-24 1984-12-24 スパツタリング装置

Country Status (1)

Country Link
JP (1) JPS61149476A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280265A (ja) * 1985-10-04 1987-04-13 Toshiba Corp 真空処理装置
JPH024967A (ja) * 1988-02-08 1990-01-09 Optical Coating Lab Inc 薄膜形成装置及び方法
JPH04176864A (ja) * 1990-11-08 1992-06-24 Sharp Corp スパッタリング装置
US5618388A (en) * 1988-02-08 1997-04-08 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
US5755888A (en) * 1994-09-01 1998-05-26 Matsushita Electric Industrial Co., Ltd. Method and apparatus of forming thin films

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153740A (en) * 1978-05-25 1979-12-04 Ulvac Corp Continuous vacuum treatment apparatus
JPS5741369A (en) * 1980-08-27 1982-03-08 Hitachi Ltd Continuous vacuum treatment device
JPS61112312A (ja) * 1984-11-07 1986-05-30 Hitachi Ltd 真空連続処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153740A (en) * 1978-05-25 1979-12-04 Ulvac Corp Continuous vacuum treatment apparatus
JPS5741369A (en) * 1980-08-27 1982-03-08 Hitachi Ltd Continuous vacuum treatment device
JPS61112312A (ja) * 1984-11-07 1986-05-30 Hitachi Ltd 真空連続処理装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280265A (ja) * 1985-10-04 1987-04-13 Toshiba Corp 真空処理装置
JPH024967A (ja) * 1988-02-08 1990-01-09 Optical Coating Lab Inc 薄膜形成装置及び方法
US5618388A (en) * 1988-02-08 1997-04-08 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
JPH04176864A (ja) * 1990-11-08 1992-06-24 Sharp Corp スパッタリング装置
US5755888A (en) * 1994-09-01 1998-05-26 Matsushita Electric Industrial Co., Ltd. Method and apparatus of forming thin films

Also Published As

Publication number Publication date
JPH0375631B2 (enrdf_load_stackoverflow) 1991-12-02

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Legal Events

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LAPS Cancellation because of no payment of annual fees