JPS61148853A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS61148853A JPS61148853A JP27081784A JP27081784A JPS61148853A JP S61148853 A JPS61148853 A JP S61148853A JP 27081784 A JP27081784 A JP 27081784A JP 27081784 A JP27081784 A JP 27081784A JP S61148853 A JPS61148853 A JP S61148853A
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- shape
- reduced
- connection terminal
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は半導体装置、特に多数の外部接続端子を必要と
する半導体集積回路に用いて有効な技術に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique that is effective for use in semiconductor devices, particularly semiconductor integrated circuits that require a large number of external connection terminals.
版 ｐ６９〜ｐ７２）には、半導体集積回路の機能密度
の増加、リード（外部接続端子）数の増加にともなって
、パッケージの寸法、端子位置に関する余裕度が一層き
びしくなっている、との記載がある。(pages 69 to 72) states that as the functional density of semiconductor integrated circuits increases and the number of leads (external connection terminals) increases, margins regarding package dimensions and terminal positions are becoming more stringent. be.
このため、高集積度の半導体集積回路においては、各外
部接続端子間の間隔を狭めるとともに、各外部接続端子
自体を細くして、多数の外部接続端子を設けるようにし
ている。For this reason, in highly integrated semiconductor integrated circuits, the distance between each external connection terminal is narrowed, and each external connection terminal itself is made thinner, so that a large number of external connection terminals are provided.
ところが、上記技術的動向に関する本発明者の検討によ
ると、各外部接続端子が細く、かつ間隔が狭いため、半
導体集積回路の運搬時、実装時などにおいて、各外部接
続端子に折れ、曲がりなどが発生し易いことに気付いた
。However, according to the inventor's study regarding the above-mentioned technological trends, each external connection terminal is thin and has narrow intervals, so each external connection terminal may be bent or bent during transportation or mounting of a semiconductor integrated circuit. I noticed that this can easily happen.
外部接続端子の折れは、不良品となり、曲がりは実装時
において手直しせねばならず、非常に煩わしく、また作
業効率低下の原因ともなって好ましくない。A bent external connection terminal will result in a defective product, and a bent one will have to be repaired during mounting, which is very troublesome and also causes a decrease in work efficiency, which is undesirable.
本発明の目的は、折れや曲がりなどの不所望な事故を低
減し得る外部接続端子を設けた半導体装置を提供するこ
とにある。An object of the present invention is to provide a semiconductor device provided with external connection terminals that can reduce undesirable accidents such as bending and bending.
本発明の上記ならびにその他の目的と新規な特徴は、本
明細書の記述及び添付図面から明らかになるであろう。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
本願において開示される発明の概要を簡単番こ述ベれば
、下記の通りである。A brief summary of the invention disclosed in this application is as follows.
すなわち、外部接続端子の横方向をほぼＵ字型、或いは
Ｌ字型等に形成することにより、外部接続端子を折れ１
曲がりを低減するという本発明の目的を達成するもので
ある。That is, by forming the external connection terminal in a substantially U-shape or L-shape in the horizontal direction, the external connection terminal can be folded.
This achieves the objective of the invention of reducing bending.
〔実施例−１〕
以下、第１図及び第２図を参照して本発明の第１実施例
を説明する。[Example-1] Hereinafter, a first example of the present invention will be described with reference to FIGS. 1 and 2.
なお、第１図はいわゆる面実装型と呼ばれている半導体
集積回路（以下においてＩＣという）の斜視図を示し、
第２図は一側面図を示すものである。Note that FIG. 1 shows a perspective view of a so-called surface-mount type semiconductor integrated circuit (hereinafter referred to as IC).
FIG. 2 shows a side view.
本実施例の特徴は、各外部接端子をＵ字型に形成したこ
とにある。A feature of this embodiment is that each external contact terminal is formed into a U-shape.
第１図に示すように、ＩＣＩを構成するパッケージ２の
外周囲には、多数の外部接続端子３が設けられている。As shown in FIG. 1, a large number of external connection terminals 3 are provided around the outer periphery of a package 2 constituting the ICI.
各外部接続端子３は図示の如く板状であるが、その３分
１程度を残し、先端方向はＵ字型、換言すれば円弧状に
形成されている。As shown in the figure, each external connection terminal 3 is plate-shaped, but about one-third of the terminal is formed in a U-shape, in other words, in an arc shape.
上記Ｕ字型への変形は、リードフレーム成形字にプレス
によって同時に行うことができる。The above-mentioned deformation into the U-shape can be simultaneously performed on the molded lead frame by pressing.
そして、上記変形を行うことにより、変形部分は上下方
向はもとより、横方向に力を加えても機械的抵抗力が増
すことになり、曲がりが低減される。なお、曲がりは折
れの前段階であるから、曲がりの低減は折れの低減にな
る。すなわち、何等の補強部材を設けることなく、実質
的に各外部接続端子３を補強し得たことになる。By carrying out the above deformation, the mechanical resistance of the deformed portion increases even when force is applied not only in the vertical direction but also in the lateral direction, and bending is reduced. Note that since bending is a step before breaking, a reduction in bending is a reduction in bending. In other words, each external connection terminal 3 can be substantially reinforced without providing any reinforcing member.
従って、各外部接続端子３が、互いに隣接する端子に接
触する、といった不都合が少なくなる。Therefore, the inconvenience that each external connection terminal 3 comes into contact with mutually adjacent terminals is reduced.
なお、上記外部接続端子３の形状は、ＩＣ１を実装する
際にも極めて効果的である。Note that the shape of the external connection terminal 3 described above is extremely effective when mounting the IC1.
すなわち、実装時においては、第２図に示す如く各外部
接続端子３が配線パターン１１上に配置され、ハンダデ
ィップ等によりハンダ付け１２されるのであるが、この
際ハンダ１２が各外部接続端子３の下面、換言すれば配
線パターン１１との間に入り易くなり、ハンダ付け１２
が確実におこなわれる。That is, during mounting, each external connection terminal 3 is placed on the wiring pattern 11 as shown in FIG. 2, and soldered 12 by solder dipping or the like. In other words, it becomes easier to fit between the lower surface of the wiring pattern 11 and the soldering 12
will be carried out reliably.
〔実施例−２〕
次に１本発明の第２実施例を第３図を参照して説明する
。[Embodiment 2] Next, a second embodiment of the present invention will be described with reference to FIG.
なお、上記第１実施例と同一の部分には同一の符号を付
し、説明の重複を避けるものとする。Note that the same parts as in the first embodiment are given the same reference numerals to avoid duplication of explanation.
本実施例の特徴は、各外部接続端子２３をＬ字状に形成
したことにある。A feature of this embodiment is that each external connection terminal 23 is formed in an L-shape.
第３図に示すように、各外部接続端子２３の先端部は横
方向に断面り字状に形成され、上下方向及び横方向への
変形を低減し得るようになされている。As shown in FIG. 3, the distal end of each external connection terminal 23 is formed in a cross-sectional shape in the lateral direction, so that deformation in the vertical and lateral directions can be reduced.
各外部接続端子２３を上記構成にすることにより、隣接
する外部接続端子との接触などが低減される上に、折れ
などの不測の事故も低減しえる。By configuring each external connection terminal 23 as described above, not only contact with adjacent external connection terminals can be reduced, but also unexpected accidents such as bending can be reduced.
また、ハンダ付けに際しては、垂直部２３ａの外側面に
ハンダ（図示せず）が伸び上がるようになるので、各外
部接続端子２３と配線パターン（図示せず）とのハンダ
付けも良好に行われる。Further, during soldering, since the solder (not shown) extends up the outer surface of the vertical portion 23a, the soldering between each external connection terminal 23 and the wiring pattern (not shown) can be performed satisfactorily.
（１）ＩＣの各外部接続端子を横断面Ｕ字状、或いはＬ
字状に形成することにより、実質的に各外部接続端子を
補強することができ、上記各外部接続端子の折れや曲が
り等を低減する。という効果が得られる。(1) Each external connection terminal of the IC has a U-shaped cross section or an L shape.
By forming the external connection terminal into a letter shape, each external connection terminal can be substantially reinforced, and bending, bending, etc. of each of the external connection terminals can be reduced. This effect can be obtained.
（２）上記（１）により、ＩＣの信頼度が向上する。(2) The above (1) improves the reliability of the IC.
（３）実装時に上記Ｕ時状部の底面、或いはＬ字状部の
垂直面を利用してハンダ付けが行われるので、ハンダ付
は不良などの不測の事故を低減する。(3) During mounting, soldering is performed using the bottom surface of the U-shaped portion or the vertical surface of the L-shaped portion, so soldering reduces unexpected accidents such as defects.
という効果が得られる。This effect can be obtained.
以、上に本発明者によってなされた発明を実施例にもと
づき具体的に説明したが、本発明は上記実施例に限定さ
れるものではなく、その要旨を逸脱しない範囲で種々変
更可能であることは言うまでもない、 、
例えば１客外部接続端子のＵ字状、或いはＬ字状の変形
は、パッケージ内から行ってもよい。この場合、各外部
接続端子の折れや曲寄りの低減は、より一層向上する。Although the invention made by the present inventor has been specifically explained above based on examples, the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Needless to say, for example, the single customer external connection terminal may be modified into a U-shape or an L-shape from within the package. In this case, the bending and bending of each external connection terminal can be further reduced.
以上の説明では、主として本発明者によってりされた発
明をその背景となった利用分野である面実装型の半導体
集積回路に適用した場合について説明したが、それに限
定されるものではなく、例えば他の形状の半導体集積回
路にも利用することができる。In the above explanation, the invention made by the present inventor was mainly applied to surface-mounted semiconductor integrated circuits, which is the background field of application, but the present invention is not limited to this. It can also be used for semiconductor integrated circuits of the shape.
第１図は本発明を適用した半４体集積回路の第１実施例
を示す斜視図を示し、
第２図は上記半導体集積回路の実装時の態様を示す一側
面図を示す、
第３図は本発明の第２実施例を示す半導体集積回路の要
部の斜視図を示す。
１・・・半導体集積回路、２・・・パッケージ、３゜２
３・・・外部接続端子、１１・・・配線パターン、１２
・・・ハンダ、２３ａ・・・垂直部。
第 １ 図
” ２３／／
第 ３ 図FIG. 1 shows a perspective view showing a first embodiment of a semi-quad integrated circuit to which the present invention is applied, FIG. 2 shows a side view showing an aspect of the semiconductor integrated circuit at the time of mounting, and FIG. 1 shows a perspective view of the main parts of a semiconductor integrated circuit showing a second embodiment of the present invention. 1... Semiconductor integrated circuit, 2... Package, 3゜2
3... External connection terminal, 11... Wiring pattern, 12
...Solder, 23a...Vertical part. Figure 1” 23// Figure 3
Claims (1)
してなる外部接続端子を設けたことを特徴とする半導体
装置。1. A semiconductor device comprising an external connection terminal formed with a deformable structure to reduce folding and bending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27081784A JPS61148853A (en) | 1984-12-24 | 1984-12-24 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27081784A JPS61148853A (en) | 1984-12-24 | 1984-12-24 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61148853A true JPS61148853A (en) | 1986-07-07 |
Family
ID=17491429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27081784A Pending JPS61148853A (en) | 1984-12-24 | 1984-12-24 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61148853A (en) |
-
1984
- 1984-12-24 JP JP27081784A patent/JPS61148853A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002222906A (en) | Semiconductor device and manufacturing method therefor | |
| JPS6344749A (en) | Semiconductor device and lead frame for it | |
| EP0484062A1 (en) | A semiconductor device comprising two integrated circuit packages | |
| US5286999A (en) | Folded bus bar leadframe | |
| US5444293A (en) | Structure and method for providing a lead frame with enhanced solder wetting leads | |
| US5451716A (en) | Resin-packaged electronic component having bent lead terminals | |
| US5105261A (en) | Semiconductor device package having particular lead structure for mounting multiple circuit boards | |
| JPS61148853A (en) | Semiconductor device | |
| JPS61148855A (en) | Semiconductor device | |
| JPH0212861A (en) | Resin-sealed semiconductor device | |
| JPH01232753A (en) | Semiconductor device | |
| JP3268688B2 (en) | Semiconductor integrated circuit device | |
| JPH0555435A (en) | Package for semiconductor integrated circuit | |
| JPS62206868A (en) | Electronic device | |
| JPH0341475Y2 (en) | ||
| JPS622560A (en) | Resin-sealed type semiconductor device | |
| JP3153185B2 (en) | Semiconductor device | |
| JPH01286343A (en) | Resin sealed type semiconductor device | |
| JPH04199564A (en) | Package structure of electronic parts | |
| KR950006837Y1 (en) | Outlead surface exposure type semiconductor package | |
| JP2954561B2 (en) | Lead frame, molding die for resin-encapsulated semiconductor device using lead frame, resin-encapsulated semiconductor device using lead frame, and method of manufacturing resin-encapsulated semiconductor device | |
| JP2834192B2 (en) | Resin-sealed semiconductor device | |
| JPH05259357A (en) | Lead frame for flat package semiconductor device | |
| JPH09116080A (en) | Lead terminal and lead frame to be used for it | |
| JPH0637240A (en) | Lead frame and semiconductor integrated circuit device using same |