JPS611468A - Production of silver brazed structural body - Google Patents

Production of silver brazed structural body

Info

Publication number
JPS611468A
JPS611468A JP12334584A JP12334584A JPS611468A JP S611468 A JPS611468 A JP S611468A JP 12334584 A JP12334584 A JP 12334584A JP 12334584 A JP12334584 A JP 12334584A JP S611468 A JPS611468 A JP S611468A
Authority
JP
Japan
Prior art keywords
silver
layer
glass
plating layer
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12334584A
Other languages
Japanese (ja)
Inventor
Osamu Umene
梅根 治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP12334584A priority Critical patent/JPS611468A/en
Publication of JPS611468A publication Critical patent/JPS611468A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work

Abstract

PURPOSE:To prevent the exfoliation of an Ni plating layer by subjecting plural members provided with the parts where metal and glass are sealed to silver brazing in a slightly oxidizing atmosphere and forming successively a silver plating layer and Ni plating layer to the silver brazed structural body. CONSTITUTION:Transparent glass 5 is sealed into the large-diameter through- hole 2 of an outside metallic ring 1 and lead wires 7 are hermetically and isolatedly sealed via glass 6 into small-diameter through-holes 3. After such sealed body is pickled, the glass sealed body, screw members 8, a cylindrical member 9 and silver solder 10 are assembled in prescribed relative positions and are heated to about 800 deg.C in the slightly oxidizing atmosphere, by which these members are silver-brazed. The silver-brazed structural body is pickled and is then dipped in a cyan plating bath, by which a copper plating layer 11 is formed to about 2-4mu thickness. An electroless Ni placting layer 12 is further formed on the layer 11 to abou 4-6mu thickness. Since the layer 12 has the good adhesiveness to the layer 11, the exfoliation thereof is prevented.

Description

【発明の詳細な説明】 産業上の利用分野 この発明は銀ロウ付け構体の製造方法に関し、特に例え
ば半導体装置、水晶振動子、電子式水道メータ等の容器
の製造に用いられる。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a method for manufacturing a silver brazed structure, and is particularly used for manufacturing containers such as semiconductor devices, crystal oscillators, and electronic water meters.

従来の技術 2部材を固着する場合、銀ロウ付けは広く行なわれてい
る。
BACKGROUND OF THE INVENTION Silver brazing is widely used to bond two members together.

第3(2)は、例えば特開昭56−120080号公報
に開示されている、電子式水道メータ用容器の平面図で
、第4図は第3図の■−■線に沿う断面図を示す。図に
おいて、1は鉄、低炭素鋼、コバー)v (鉄・二、ケ
ル・コバ/l/ )合金)よりなる金属外項で、1個の
大径の透孔2と、小径の3個の透孔3と、これら小径の
透孔3の両側の凹所4とを有する。前記透孔2には透明
ガラス5が気密に封着されている。各透孔3にはガラス
6を介してリード線7が気密に封着されている。また、
前記各凹所4には黄銅等よりなり内面にネジを刻設した
ネジ部材8が銀ロウ付けされている。9は銅製の筒状部
材で、前記金属外環1の下面に銀ロウ付けされている。
3(2) is a plan view of an electronic water meter container disclosed in, for example, Japanese Unexamined Patent Publication No. 56-120080, and FIG. 4 is a sectional view taken along the line ■-■ in FIG. show. In the figure, 1 is a metal external term consisting of iron, low carbon steel, Kobar) v (Iron-2, Kel-Kova/l/ ) alloy), and there is one large-diameter through hole 2 and three small-diameter through holes. through holes 3 and recesses 4 on both sides of these small diameter through holes 3. A transparent glass 5 is hermetically sealed in the through hole 2. A lead wire 7 is hermetically sealed in each through hole 3 with a glass 6 interposed therebetween. Also,
In each of the recesses 4, a screw member 8 made of brass or the like and having a thread carved on its inner surface is soldered with silver. Reference numeral 9 denotes a cylindrical member made of copper, which is soldered with silver to the lower surface of the metal outer ring 1.

そして、上記金属外環1乙透明ガラス5やガラス6の封
着およびガラス6とリード線7の封着は、金属外環1や
リード線7の表面の酸化嘆を介して実施される。これは
、透明ガラス5やガラス6そのものが金属酸化物で構成
されており、金属外環1やリード線7の酸化膜とよく滞
れて、優れた気密封着が実現されるためである。
The sealing between the metal outer ring 1 and the transparent glass 5 and the glass 6 and the sealing between the glass 6 and the lead wires 7 are performed through oxidation of the surfaces of the metal outer ring 1 and the lead wires 7. This is because the transparent glass 5 and the glass 6 themselves are composed of metal oxides, which easily stagnate with the oxide film of the metal outer ring 1 and the lead wire 7, thereby achieving excellent hermetic sealing.

発明が解決しようとする問題点 ところで、一般の2部材の銀ロウ付けは、還元性雰囲気
中で実施されるが、上記の金属外環1とネジ部材8や筒
状部材9との銀ロウ付けを従来と同様の雰囲気中で実施
すると、次のような問題へかある。
Problems to be Solved by the Invention By the way, general silver brazing of two members is carried out in a reducing atmosphere, but silver brazing of the metal outer ring 1 and the screw member 8 or the cylindrical member 9 is difficult. If this is carried out in the same atmosphere as before, the following problems may arise.

(1)還元性雰囲気中で銀ロウ何けを実施すると、金属
外環1やリード線7の表面の酸化膜が還元されて消失し
て、気密劣化を生じやすい。すなわち、金属外環1やリ
ード線7等の酸化膜は、前述のとおりガラスとの優れた
封着に寄与するものであるが、カラスが酸化膜を全部食
った場合、ガラスと金属素地とが直接接することになり
、気密性が悪くなるので、酸化膜が残存するような条件
で封着すると、良好な封着結果をもたらすことが知られ
ている。しかしながら、還元性雰囲気中で銀ロウ付けを
実施すると、封着時に残存させた酸化膜が、金属とガラ
スの封着界面の端部から還元されて消失する結果、金属
とガラスとの間に微小間隙が形成されて、気密劣化や封
着強度の低下をもたらすのである。
(1) When silver brazing is carried out in a reducing atmosphere, the oxide film on the surface of the metal outer ring 1 and the lead wire 7 is reduced and disappears, which tends to cause airtightness deterioration. In other words, the oxide film on the metal outer ring 1, the lead wire 7, etc. contributes to excellent sealing with the glass as described above, but if the crow eats away all the oxide film, the glass and the metal base will be damaged. Since they come into direct contact and the airtightness deteriorates, it is known that good sealing results can be obtained if the sealing is performed under conditions where the oxide film remains. However, when silver brazing is performed in a reducing atmosphere, the oxide film left during sealing is reduced and disappears from the edge of the sealing interface between the metal and glass, resulting in microscopic gaps between the metal and glass. Gaps are formed, resulting in deterioration of airtightness and reduction in sealing strength.

(2)一方、中性雰囲抜中で銀ロウ付けを実施する場合
、ロウ付け治具の持ち込み空気により、ロウ付け時の溶
融銀ロウの酸素透過溶存性により、銀ロウ中の銅が酸化
されるだけにとどまらず。
(2) On the other hand, when silver brazing is performed in a neutral atmosphere, the copper in the silver solder is oxidized due to the oxygen permeation and solubility of the molten silver solder during brazing due to the air brought in by the brazing jig. Not just being treated.

ネジ部材8や筒状部材9の銅素地をも酸化させる。ネジ
部材8や筒状部材9の表面の酸化膜は、仕上げメッキ前
の酸洗い等によって簡単に除去できるが、根ロウ中の銅
の連化膜を除去することはできない。このため、酸洗い
後仕上げニリケルノ・ツキを施した場合、ニッケルは銀
ロウ中の根および酸化された銅のいずれとも密着性が悪
いだめ、ニッケルメッキ層が剥離する。
The copper base of the screw member 8 and the cylindrical member 9 is also oxidized. Although the oxide film on the surface of the screw member 8 and the cylindrical member 9 can be easily removed by pickling or the like before finishing plating, the copper entrainment film in the root wax cannot be removed. For this reason, when a finish is applied after pickling, the nickel plating layer peels off because nickel has poor adhesion to both the roots in the silver solder and the oxidized copper.

問題点を解決するだめの手段 この発明は、少なくとも一つの部材が金属とカラスの封
着部分を備えた複数の部材を微酸化性雰囲気中で銀ロウ
付けする工程と、上記銀ロウ付け構体に銅メッキ層を形
成する工程と、前記銅メッキ層上にニッケルメッキ層を
形成する工程とを含むことを特徴とするものである。
Means for Solving the Problems The present invention includes a step of silver brazing a plurality of members, at least one of which has a metal-to-glass sealing portion, in a slightly oxidizing atmosphere, and a method for applying silver brazing to the above-mentioned silver brazing structure. This method is characterized by including a step of forming a copper plating layer and a step of forming a nickel plating layer on the copper plating layer.

作用 上記の方法によれば、微酸化性雰囲気中で銀ロウ付けを
実施するので、金属とガラスの封着界面の酸化膜が還元
されて消失することがないので、気密劣化や機械的封着
強度の低下がない。寸だ、この銀ロウ付け時の雰囲架で
、銀ロウ中の銅が酸化されても、銅メッキ層は銀ロウ中
の銀との密着性が良いので、銀ロウと銅メッキ層との密
着性は良好である。さらに、銅メッキ層と二、フケルメ
ノキ騰とも密着性が良好である。この結果、銀ロウ付け
部の二、フケルメリキ層の剥離を防止できる。
Effect According to the above method, since silver brazing is carried out in a slightly oxidizing atmosphere, the oxide film at the sealing interface between metal and glass will not be reduced and disappear, thereby preventing airtightness deterioration or mechanical sealing. There is no decrease in strength. Even if the copper in the silver solder is oxidized in the atmosphere during silver brazing, the copper plating layer has good adhesion to the silver in the silver solder, so the bond between the silver solder and the copper plating layer is good. Adhesion is good. Furthermore, it has good adhesion to the copper plating layer and the second layer. As a result, it is possible to prevent the peeling of the silver solder layer at the silver soldered portion.

実施例 第1図はこの発明の一実施例方法の工程ブロック図を示
す。第2図はこの発明を第3図および第4図に示す電子
式水道メータ用容器に実施した場合の要部拡大断面図を
示す。第2図において、第4図と同一部分には同一参照
符号を付して、その説明を省略する。
Embodiment FIG. 1 shows a process block diagram of a method according to an embodiment of the present invention. FIG. 2 shows an enlarged sectional view of a main part when the present invention is applied to the electronic water meter container shown in FIGS. 3 and 4. In FIG. 2, the same parts as in FIG. 4 are given the same reference numerals, and their explanations will be omitted.

まず、金属外環1の透孔2に透明ガラス5を封着すると
ともに、各透孔3にガラス6を介してリード線7を気密
かつ絶縁して封着する(第1図、fL)次に、上記ガラ
ス封着体を酸洗いしたのち、グラフ1イト製のロウ付け
治具(図示せず)を用いて、第1の部材である上記ガラ
ス封着体と、第2の部材であるネジ部材8と、第3の部
材である筒状部材9と、銀ロウ10とを所定の関係位置
に組み立てて、ロウ付け治具の持ち込む空電を含む程度
の微酸化性雰囲気中で約80θ℃に加熱して、銀ロウイ
」けする。このとき、従来の還元性雰囲気中の銀ロウ付
けと異なり、金属外環1やリード線7のガラス封着部分
の酸化膜が還元されて消失することがない。(第1図b
)。
First, the transparent glass 5 is sealed in the through hole 2 of the metal outer ring 1, and the lead wire 7 is sealed in an airtight and insulated manner through the glass 6 in each through hole 3 (FIG. 1, fL). After pickling the glass sealing body, using a brazing jig (not shown) made of graphite, the glass sealing body, which is the first member, and the glass sealing body, which is the second member, are assembled. The screw member 8, the cylindrical member 9 that is the third member, and the silver solder 10 are assembled in a predetermined relationship position, and heated at approximately 80θ in a slightly oxidizing atmosphere that includes the static electricity introduced by the brazing jig. Heat to ℃ and roast with silver. At this time, unlike conventional silver brazing in a reducing atmosphere, the oxide film on the glass-sealed portion of the metal outer ring 1 and the lead wire 7 is not reduced and disappears. (Figure 1b
).

次に、この銀ロウ付け構体を酸洗いしたのち、シアン系
のメッキ浴を用いて厚さ2〜4μmの銅メッキ層11を
形成する。この銅メッキ層11は銀ロウ10中の銅が酸
化されていても、銀ロウ1゜中の銀との密着性が良いの
で、銀ロウ1o中の銀と強固に密着する。これは銅メッ
キ層11中のCN−の存在が銀の活性に大きく関係して
いるものと推察される(第1図C)。
Next, after pickling this silver brazed structure, a copper plating layer 11 having a thickness of 2 to 4 μm is formed using a cyan-based plating bath. Even if the copper in the silver solder 10 is oxidized, this copper plating layer 11 has good adhesion to the silver in the silver solder 1°, so it firmly adheres to the silver in the silver solder 1o. This is presumably because the presence of CN- in the copper plating layer 11 is largely related to the activity of silver (FIG. 1C).

続いて、銅メッキ層11上に無電解ニッケフレメッキ層
12を厚さ4〜6μmに形成する。この無電解ニッケル
メッキ層12は銅メッキ層11との密着性が良好なので
、両者の密着力も十分である(第1図d)。
Subsequently, an electroless Nickel plating layer 12 is formed on the copper plating layer 11 to a thickness of 4 to 6 μm. Since this electroless nickel plating layer 12 has good adhesion to the copper plating layer 11, the adhesion between the two is also sufficient (FIG. 1d).

次表は、銀ロウ付け時の雰囲気と、メッキ仕様と、メッ
キ剥離発生率との関係について示す。
The following table shows the relationship between the atmosphere during silver brazing, plating specifications, and the rate of plating peeling.

なお、Cのようにロウ付け治具の空間を全くなくすこと
は、量産上困難であるし、Dのように還元性雰囲気にし
た場合は、従来方法でもメッキ層の剥離は生じないが、
前述したように酸化模の還元による気密劣化や封着強度
の低下が生じるので、採用できない。
It should be noted that it is difficult in mass production to completely eliminate the space in the brazing jig as shown in C, and when a reducing atmosphere is used as shown in D, the plating layer does not peel off even with the conventional method.
As mentioned above, this method cannot be used because it causes deterioration of airtightness and decrease in sealing strength due to reduction of oxidized particles.

上記実施例は電子式水道メータ用容器について説明しだ
が、半導体装置や水晶振動子用容器にも実施できる。
Although the above embodiment describes a container for an electronic water meter, it can also be implemented in a container for a semiconductor device or a crystal oscillator.

究明の効果 この発明は以上のように、銀ロウ付け部分に銅メッキ層
を形成してからニノケルメ・ツキ層を形成するので、二
、ケルメッキ層の剥離を防止できる。
Effects of the Investigation As described above, in the present invention, the copper plating layer is formed on the silver brazing part and then the Ni-Kerume-tsuki layer is formed, so that 2. Peeling of the KEL-plated layer can be prevented.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例方法について説明するだめ
の工程ブロック図で、第2はこの発明を電子式水道メー
タ用容器に実施しだ場合の要部拡大断面図である。 第3図は銀ロウ付け構体の一例としての電子式水道メー
タ用容器の平面図で、第4図は第3図のIV−IV線に
沿う断面図である。 1・・・・・・・・金属外環(第1の部材)、5・・・
・透明ガラス、 6・・・・・・・ ガラス、 7・・・・・・・リード線、 8・ ・・・ネジ部材(第2の部材)、9・・・・・ 
筒状部材(第3の部利)、10  ・銀ロウ、 11・・・・・銅メッキ層、 12・・・ニッケルメッキ層。 第1図
FIG. 1 is a process block diagram for explaining one embodiment of the method of the present invention, and the second is an enlarged sectional view of the main parts when the present invention is applied to a container for an electronic water meter. FIG. 3 is a plan view of an electronic water meter container as an example of a silver brazed structure, and FIG. 4 is a sectional view taken along line IV--IV in FIG. 3. 1... Metal outer ring (first member), 5...
・Transparent glass, 6...Glass, 7...Lead wire, 8...Screw member (second member), 9...
Cylindrical member (third part), 10 - silver solder, 11... copper plating layer, 12... nickel plating layer. Figure 1

Claims (1)

【特許請求の範囲】 少なくとも一つの部材が金属とガラスの封着部分を備え
た複数の部材を微酸化性雰囲気中で銀ロウ付けする工程
と、 上記銀ロウ付け構体に銅メッキ層を形成する工程と、 上記銅メッキ層上にニッケルメッキ層を形成する工程と
を含む銀ロウ付け構体の製造方法。
[Claims] A step of silver brazing a plurality of members, at least one of which has a sealed portion of metal and glass, in a slightly oxidizing atmosphere, and forming a copper plating layer on the silver brazing structure. and forming a nickel plating layer on the copper plating layer.
JP12334584A 1984-06-14 1984-06-14 Production of silver brazed structural body Pending JPS611468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12334584A JPS611468A (en) 1984-06-14 1984-06-14 Production of silver brazed structural body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12334584A JPS611468A (en) 1984-06-14 1984-06-14 Production of silver brazed structural body

Publications (1)

Publication Number Publication Date
JPS611468A true JPS611468A (en) 1986-01-07

Family

ID=14858261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12334584A Pending JPS611468A (en) 1984-06-14 1984-06-14 Production of silver brazed structural body

Country Status (1)

Country Link
JP (1) JPS611468A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5364257A (en) * 1976-11-22 1978-06-08 Toyoda Gosei Co Ltd Impact-resistant resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5364257A (en) * 1976-11-22 1978-06-08 Toyoda Gosei Co Ltd Impact-resistant resin composition
JPS611468B2 (en) * 1976-11-22 1986-01-17 Toyoda Gosei Kk

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