JPS61142761A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS61142761A
JPS61142761A JP59264496A JP26449684A JPS61142761A JP S61142761 A JPS61142761 A JP S61142761A JP 59264496 A JP59264496 A JP 59264496A JP 26449684 A JP26449684 A JP 26449684A JP S61142761 A JPS61142761 A JP S61142761A
Authority
JP
Japan
Prior art keywords
resist
layer
groove
electrode layer
metal electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59264496A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0317215B2 (enExample
Inventor
Ryoichi Matsumoto
良一 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP59264496A priority Critical patent/JPS61142761A/ja
Publication of JPS61142761A publication Critical patent/JPS61142761A/ja
Publication of JPH0317215B2 publication Critical patent/JPH0317215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP59264496A 1984-12-17 1984-12-17 半導体装置の製造方法 Granted JPS61142761A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59264496A JPS61142761A (ja) 1984-12-17 1984-12-17 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59264496A JPS61142761A (ja) 1984-12-17 1984-12-17 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61142761A true JPS61142761A (ja) 1986-06-30
JPH0317215B2 JPH0317215B2 (enExample) 1991-03-07

Family

ID=17404044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59264496A Granted JPS61142761A (ja) 1984-12-17 1984-12-17 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61142761A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004025726A3 (en) * 2002-09-12 2005-04-28 Olivetti I Jet Spa Method for selectively covering a micro machined surface
JP2015088678A (ja) * 2013-10-31 2015-05-07 日亜化学工業株式会社 半導体素子の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004025726A3 (en) * 2002-09-12 2005-04-28 Olivetti I Jet Spa Method for selectively covering a micro machined surface
JP2005539379A (ja) * 2002-09-12 2005-12-22 オリベッティ・アイ−ジェット・ソチエタ・ペル・アツィオーニ 微細加工表面を選択的に覆うための方法
US7255799B2 (en) 2002-09-12 2007-08-14 Telecom Italia S.P.A Method for selectively covering a micro machined surface
CN100439233C (zh) * 2002-09-12 2008-12-03 好利获得I-Jet股份公司 有选择地覆盖微加工表面的方法
AU2003265164B2 (en) * 2002-09-12 2010-06-03 Olivetti I-Jet S.P.A. Method for selectively covering a micro machined surface
JP2015088678A (ja) * 2013-10-31 2015-05-07 日亜化学工業株式会社 半導体素子の製造方法

Also Published As

Publication number Publication date
JPH0317215B2 (enExample) 1991-03-07

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Legal Events

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