JPS61141196A - 微細な導電性パターンを有する基体の選択接着方法 - Google Patents

微細な導電性パターンを有する基体の選択接着方法

Info

Publication number
JPS61141196A
JPS61141196A JP59263594A JP26359484A JPS61141196A JP S61141196 A JPS61141196 A JP S61141196A JP 59263594 A JP59263594 A JP 59263594A JP 26359484 A JP26359484 A JP 26359484A JP S61141196 A JPS61141196 A JP S61141196A
Authority
JP
Japan
Prior art keywords
substrate
conductive
adhesive layer
pattern
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59263594A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02877B2 (enExample
Inventor
鈴木　為之
鎌倉　卓郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinto Paint Co Ltd
Original Assignee
Shinto Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinto Paint Co Ltd filed Critical Shinto Paint Co Ltd
Priority to JP59263594A priority Critical patent/JPS61141196A/ja
Priority to DE19853543303 priority patent/DE3543303A1/de
Priority to US06/808,141 priority patent/US4676854A/en
Publication of JPS61141196A publication Critical patent/JPS61141196A/ja
Publication of JPH02877B2 publication Critical patent/JPH02877B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP59263594A 1984-12-13 1984-12-13 微細な導電性パターンを有する基体の選択接着方法 Granted JPS61141196A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59263594A JPS61141196A (ja) 1984-12-13 1984-12-13 微細な導電性パターンを有する基体の選択接着方法
DE19853543303 DE3543303A1 (de) 1984-12-13 1985-12-07 Verfahren zur selektiven verbindung von substraten mit feinen leitungsmustern
US06/808,141 US4676854A (en) 1984-12-13 1985-12-12 Method for selectively bonding substrate having fine electroconductive pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59263594A JPS61141196A (ja) 1984-12-13 1984-12-13 微細な導電性パターンを有する基体の選択接着方法

Publications (2)

Publication Number Publication Date
JPS61141196A true JPS61141196A (ja) 1986-06-28
JPH02877B2 JPH02877B2 (enExample) 1990-01-09

Family

ID=17391712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59263594A Granted JPS61141196A (ja) 1984-12-13 1984-12-13 微細な導電性パターンを有する基体の選択接着方法

Country Status (3)

Country Link
US (1) US4676854A (enExample)
JP (1) JPS61141196A (enExample)
DE (1) DE3543303A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217694A (ja) * 1986-03-18 1987-09-25 ダイソー株式会社 回路の接続方法
JP2018082093A (ja) * 2016-11-17 2018-05-24 サンコール株式会社 半導体素子取付用基板端子板の製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147593A (ja) * 1984-12-20 1986-07-05 神東塗料株式会社 導電性接着剤層を付与したフレキシブル回路基材およびその製造方法
US5093985A (en) * 1989-06-30 1992-03-10 John Houldsworth Method of assembly for small electrical devices
EP0562569A3 (en) * 1992-03-25 1993-11-10 Molex Inc Anisotropic adhesive for fixing an electronic component to a printed circuit module
JPH066887A (ja) * 1992-06-19 1994-01-14 Victor Co Of Japan Ltd 回動式スピーカ装置
US5429735A (en) * 1994-06-27 1995-07-04 Miles Inc. Method of making and amperometric electrodes
US6379865B1 (en) 2000-04-11 2002-04-30 3M Innovative Properties Company Photoimageable, aqueous acid soluble polyimide polymers
US6803092B2 (en) 2001-06-26 2004-10-12 3M Innovative Properties Company Selective deposition of circuit-protective polymers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50118255A (enExample) * 1974-03-04 1975-09-16

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3892646A (en) * 1970-08-17 1975-07-01 Ibm Process for selectively forming electrophoretic coatings on electrical contacts
DE2530090A1 (de) * 1974-07-17 1976-01-29 Astra Laekemedel Ab Mittel zur immunologischen und immunotherapeutischen kontrolle von schistosomiasis und tumorwachstum oder fasciolosis
CA1097495A (en) * 1976-05-24 1981-03-17 James H. Aumiller Electrically conductive adhesive
DE2831984A1 (de) * 1977-07-21 1979-02-01 Sharp Kk Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50118255A (enExample) * 1974-03-04 1975-09-16

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217694A (ja) * 1986-03-18 1987-09-25 ダイソー株式会社 回路の接続方法
JP2018082093A (ja) * 2016-11-17 2018-05-24 サンコール株式会社 半導体素子取付用基板端子板の製造方法

Also Published As

Publication number Publication date
US4676854A (en) 1987-06-30
DE3543303A1 (de) 1986-07-17
JPH02877B2 (enExample) 1990-01-09

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