JPS61140560U - - Google Patents
Info
- Publication number
- JPS61140560U JPS61140560U JP2456385U JP2456385U JPS61140560U JP S61140560 U JPS61140560 U JP S61140560U JP 2456385 U JP2456385 U JP 2456385U JP 2456385 U JP2456385 U JP 2456385U JP S61140560 U JPS61140560 U JP S61140560U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bonding
- flexible substrate
- light receiving
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2456385U JPS61140560U (enExample) | 1985-02-21 | 1985-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2456385U JPS61140560U (enExample) | 1985-02-21 | 1985-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61140560U true JPS61140560U (enExample) | 1986-08-30 |
Family
ID=30518828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2456385U Pending JPS61140560U (enExample) | 1985-02-21 | 1985-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61140560U (enExample) |
-
1985
- 1985-02-21 JP JP2456385U patent/JPS61140560U/ja active Pending