JPS61140561U - - Google Patents
Info
- Publication number
- JPS61140561U JPS61140561U JP2456485U JP2456485U JPS61140561U JP S61140561 U JPS61140561 U JP S61140561U JP 2456485 U JP2456485 U JP 2456485U JP 2456485 U JP2456485 U JP 2456485U JP S61140561 U JPS61140561 U JP S61140561U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- receiving element
- light receiving
- chip
- bonding part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2456485U JPS61140561U (enExample) | 1985-02-21 | 1985-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2456485U JPS61140561U (enExample) | 1985-02-21 | 1985-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61140561U true JPS61140561U (enExample) | 1986-08-30 |
Family
ID=30518830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2456485U Pending JPS61140561U (enExample) | 1985-02-21 | 1985-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61140561U (enExample) |
-
1985
- 1985-02-21 JP JP2456485U patent/JPS61140561U/ja active Pending