JPS60158663A - 厚膜回路基板 - Google Patents

厚膜回路基板

Info

Publication number
JPS60158663A
JPS60158663A JP59012841A JP1284184A JPS60158663A JP S60158663 A JPS60158663 A JP S60158663A JP 59012841 A JP59012841 A JP 59012841A JP 1284184 A JP1284184 A JP 1284184A JP S60158663 A JPS60158663 A JP S60158663A
Authority
JP
Japan
Prior art keywords
bonding
thick
thick film
film
film conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59012841A
Other languages
English (en)
Inventor
Setsuko Kawasaki
川崎　攝子
Masaharu Takahara
高原　正晴
Koichiro Izumi
和泉　孝一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP59012841A priority Critical patent/JPS60158663A/ja
Publication of JPS60158663A publication Critical patent/JPS60158663A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は混成集積回路などに使用される厚膜回路基板
に関するものである。
〔従来技術〕
第１図および第２図は従来の厚膜回路基板を示す平面図
およびそのＡ−Ａ断面図である。同図において、１はア
ルミナセラミックなどで作られた回路配線基板、２はボ
ンディングバンド部２ａをもつＡｇＰｄ、Ａｕなどの厚
膜導体、３はＡＺ、ＡＵなどのボンディングワイヤ、４
は外部接続用パッド部４ａをもつＩＣチップである。
次に、上記構成による厚膜回路基板において、ボンディ
ングワイヤ３を厚膜導体２にボンディングする場合につ
いて説明すると、第３図（ａ）に示すように、ボンディ
ング装置のボンディングヘッド部のキャピラリ５を厚膜
導体２上に位置決めして、ボンディングワイヤ３をポン
ディングパッド部２ａにボンディングするものである。
しかしながら、従来の厚膜回路基板では厚膜導体２の導
体幅がせ１くなると、そのボンディングバンド部２ａの
中央部が厚く、端部が薄くなり、厚みが中央部と端部で
は不均一になるため、第３図（ａ）に示すように、キャ
ビ５ラリ５が厚膜導体２の中央あるいはその付近に位置
した場合にはボンディングワイヤ３が厚膜導体２に強固
にボンディングされるが、第３図中）に示すように、キ
ャピラリ５が厚膜導体２の中央よシずれて位置した場合
にはキャピラリ５の先端側面が厚膜導体２の中央頂部に
接触して、ボンディングワイヤ３は厚膜導体２に不完全
にボンディングされ、不良の原因になる。
しかも、この厚膜導体２がＡｇ１）ｄのように硬い場合
にはボンディング時の超音波出力などによシキャピラリ
５が厚膜導体２上ですべり易くなシ、不完全にボンディ
ングされるなどの欠点があった。
〔発明の概要〕
したがって、この発明の目的はボンディングワイヤが厚
膜導体の中央頂部に確実にボンディングすることができ
るようにした厚膜回路基板を提供するものである。
このような目的を達成するため、この発明は厚膜導体の
ポンディングパッド部に四部を形成するものであシ、以
下実施例を用いて詳細に説明する。
〔発明の実施例〕
第４図および第５図はこの発明に係る厚膜回路基板の一
実施例を示す一部詳細な平面図およびそのＢ−Ｂ断面図
である。同図において、６は第５図に示すように、ポン
ディングパッド部６ａに凹部６ｂが形成された厚膜導体
である。
次に、上記構成による厚膜回路基板において、ボンディ
ングワイヤ３を厚膜導体６にボンディングする場合につ
いて説明すると、ボンディング装置のボンディングヘッ
ド部のキャピラリ５を厚膜導体６上に位置決めする場合
、そのキャピラリ５が多少ずれても、ポンディングパッ
ド部６ａの中央と端部との膜厚の差が少ないため、ボン
ディングワイヤ３は厚膜導体６に強固にステッチボンド
を形成することができる。しかも、ボンディングワイヤ
３と厚膜導体６との接触面租が増大し、強固なステッチ
ボンドを形成することができる。また、厚膜導体６がＡ
ｇＰｄのように硬い場合でも、ボンディング時の超音波
出力によるキャピラリ５のすべりなども、第６図に示す
ようにポンディングパッド部６ａの凹部６ｂに押えられ
て生じなくなる。
〔発明の効果〕
以上詳細に説明したように、この発明に係る厚膜回路基
板によればボンディングワイヤを厚膜導体にボンディン
グする際、厚膜導体のポンディングパッド部の凹部に、
キャピラリの先端が入るため、キャピラリが固定され、
キャピラリから伝達される超音波振動をより効果的に厚
膜導体に伝えられるので、ボンディングの密着性を向上
することができる効果がある。
【図面の簡単な説明】
第１図および第２図は従来の厚膜回路基板を示す平面図
およびそのＡ−Ａ断面図、縞３図（！Ｌ）および第３図
Φ】は第１図におりるボンディングワイヤをボンディン
グするときの動作を説明するための断面図、第４図およ
び第５図はこの発明に係る厚膜回路基板の一実施例を示
す平面図およびそのＢ−Ｂ断面図、第６図は第４図にお
けるボンディングワイヤをボンディングするときの動作
を説明するだめの断面図である。 １・・・Ｏ回路配線用基板、２Φ・−・厚膜導体、２ａ
・・・・ポンディングパッド部、３・・・・ボンディン
グワイヤ、４・・・・ＩＣチップ、４ａ００．・外部接
続用パッド部、５・０．・ギヤピラリ、６−会・・厚膜
導体、６ａＩＩＩＩ・・ポンディングパッド部、６ｂ・
・・・凹部。 特許出願人　日本電気株式会社 代　理　人　山川政樹（はか２名） 第１図 第３図（０） 第４図 第２図 第３図（ｂ） 第５図 第６図

Claims (1)

    【特許請求の範囲】
  1. 厚痕混成集積回路において、厚膜導体のポンディングパ
    ッド部に四部を形成したことを特徴とする厚膜回路基板
    。
JP59012841A 1984-01-28 1984-01-28 厚膜回路基板 Pending JPS60158663A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59012841A JPS60158663A (ja) 1984-01-28 1984-01-28 厚膜回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59012841A JPS60158663A (ja) 1984-01-28 1984-01-28 厚膜回路基板

Publications (1)

Publication Number Publication Date
JPS60158663A true JPS60158663A (ja) 1985-08-20

Family

ID=11816607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59012841A Pending JPS60158663A (ja) 1984-01-28 1984-01-28 厚膜回路基板

Country Status (1)

Country Link
JP (1) JPS60158663A (ja)

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