JPS61140560U - - Google Patents
Info
- Publication number
- JPS61140560U JPS61140560U JP2456385U JP2456385U JPS61140560U JP S61140560 U JPS61140560 U JP S61140560U JP 2456385 U JP2456385 U JP 2456385U JP 2456385 U JP2456385 U JP 2456385U JP S61140560 U JPS61140560 U JP S61140560U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bonding
- flexible substrate
- light receiving
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Description
第1図ないし第3図は本考案の半導体レーザパ
ツケージの第一実施例を示し、第1図は取付け対
象に取付けられた状態を示す断面図、第2図は第
1図の要部拡大断面図、第3図は要部の拡大斜視
図、第4図は本考案の半導体レーザパツケージ使
用されるフレキシブル基板の拡大平面図、第5図
は第4図のV―V線に沿う拡大断面図、第6図は
本考案の半導体レーザパツケージの第二実斜例を
示す一部切り欠き拡大斜視図、第7図は従来例を
示す一部切欠き拡大斜視図である。
11…半導体レーザチツプ、11b…(半導体
レーザチツプの)電極、15…基体、16…チツ
プボンデイング部、17…フレキシブル基板、1
7a…(フレキシブル基板の)先端部、18…フ
レキシブル基板接着部、19…モニタ受光素子、
20a,20b…(フレキシビル基板の端部の)
端子、24,27…ワイヤ(金線)。
1 to 3 show a first embodiment of the semiconductor laser package of the present invention, FIG. 1 is a sectional view showing the state in which it is attached to an object, and FIG. 2 is an enlarged sectional view of the main part of FIG. 1. 3 is an enlarged perspective view of the main parts, FIG. 4 is an enlarged plan view of the flexible substrate used in the semiconductor laser package of the present invention, and FIG. 5 is an enlarged sectional view taken along the line V-V in FIG. 4. , FIG. 6 is a partially cutaway enlarged perspective view showing a second practical example of the semiconductor laser package of the present invention, and FIG. 7 is a partially cutaway enlarged perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 11... Semiconductor laser chip, 11b... Electrode (of semiconductor laser chip), 15... Base body, 16... Chip bonding part, 17... Flexible substrate, 1
7a...Tip part (of the flexible board), 18...Flexible board adhesive part, 19...Monitor light receiving element,
20a, 20b... (at the end of the flexible building board)
Terminals, 24, 27...wires (gold wires).
Claims (1)
るチツプボンデイング部の後方に、チツプボンデ
イング部に対して陥没させたフレキシブル基板接
着部を形成し、これにレーザチツプ用端子、モニ
タ受光素子用端子、およびモニタ受光素子ボンデ
イング面を備えるフイルム状フレキシブル基板の
先端部を接着する一方、上記チツプボンデイング
部にボンデイングしたレーザチツプの電極と上記
フレキシブル基板のレーザチツプ用端子間および
上記モニタ受光素子ボンデイング面にボンデイン
グしたモニタ受光素子の電極と上記フレキシブル
基板のモニタ素子用端子間をそれぞれワイヤボン
デイングしたことを特徴とする、半導体レーザパ
ツケージ。 At the rear of the chip bonding part of the base body on which the chip bonding part is formed, a flexible substrate adhesive part recessed with respect to the chip bonding part is formed, and a terminal for the laser chip, a terminal for the monitor light receiving element, and a bonding of the monitor light receiving element are formed on this part. While bonding the tip of a film-like flexible substrate having a surface, between the electrode of the laser chip bonded to the chip bonding part and the terminal for the laser chip of the flexible substrate, and the electrode of the monitor light receiving element bonded to the bonding surface of the monitor light receiving element. A semiconductor laser package characterized in that wire bonding is performed between the monitor element terminals of the flexible substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2456385U JPS61140560U (en) | 1985-02-21 | 1985-02-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2456385U JPS61140560U (en) | 1985-02-21 | 1985-02-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61140560U true JPS61140560U (en) | 1986-08-30 |
Family
ID=30518828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2456385U Pending JPS61140560U (en) | 1985-02-21 | 1985-02-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61140560U (en) |
-
1985
- 1985-02-21 JP JP2456385U patent/JPS61140560U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS61140560U (en) | ||
JPS61140559U (en) | ||
JPS61136568U (en) | ||
JPS6355537U (en) | ||
JPS63191647U (en) | ||
JPS63200355U (en) | ||
JPS646041U (en) | ||
JPS61140561U (en) | ||
JPS62152442U (en) | ||
JPS63153533U (en) | ||
JPS63187330U (en) | ||
JPH0165134U (en) | ||
JPS61195058U (en) | ||
JPS6399767U (en) | ||
JPS6151737U (en) | ||
JPS63134547U (en) | ||
JPS6282734U (en) | ||
JPH01107155U (en) | ||
JPS6282744U (en) | ||
JPS60158663A (en) | Thick-film circuit substrate | |
JPH0195764U (en) | ||
JPH0328727U (en) | ||
JPS61157339U (en) | ||
JPS61196530U (en) | ||
JPS59112954U (en) | Insulator-encapsulated semiconductor device |