JPS61139035A - 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置 - Google Patents
一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置Info
- Publication number
- JPS61139035A JPS61139035A JP26006784A JP26006784A JPS61139035A JP S61139035 A JPS61139035 A JP S61139035A JP 26006784 A JP26006784 A JP 26006784A JP 26006784 A JP26006784 A JP 26006784A JP S61139035 A JPS61139035 A JP S61139035A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- storage tower
- center line
- arrangement position
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001125 extrusion Methods 0.000 claims description 7
- 238000012840 feeding operation Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 9
- 238000005422 blasting Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26006784A JPS61139035A (ja) | 1984-12-11 | 1984-12-11 | 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26006784A JPS61139035A (ja) | 1984-12-11 | 1984-12-11 | 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61139035A true JPS61139035A (ja) | 1986-06-26 |
JPH0221134B2 JPH0221134B2 (enrdf_load_stackoverflow) | 1990-05-11 |
Family
ID=17342846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26006784A Granted JPS61139035A (ja) | 1984-12-11 | 1984-12-11 | 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61139035A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0413423U (enrdf_load_stackoverflow) * | 1990-05-24 | 1992-02-03 |
-
1984
- 1984-12-11 JP JP26006784A patent/JPS61139035A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0221134B2 (enrdf_load_stackoverflow) | 1990-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN207451079U (zh) | 一种餐盘的自动上料下料设备 | |
KR870005451A (ko) | Ic 시이트 절단 프레스 및 이를 이용한 ic 시이트 가공장치 | |
CN107464686A (zh) | 自动电感磁芯装配机 | |
CN111776714B (zh) | 一种陶瓷板自动上下料设备及其上下料的方法 | |
JPH0441029A (ja) | 多数個取り小製品の仕分け集積装置 | |
CN105458367A (zh) | 一种设有堆垛台的pcb分板机 | |
CN212580927U (zh) | 一种陶瓷板自动上下料设备 | |
CN105458364A (zh) | 一种设有治具回流升降台的pcb板连片分割机 | |
JPS61139035A (ja) | 一側寄りにパツケ−ジを有するリ−ドフレ−ムの送り出し装置 | |
US4047622A (en) | Pallet feeding apparatus | |
CN207943228U (zh) | 一种装填流水线设备 | |
CN115780918B (zh) | 一种齿条全自动加工设备 | |
CN218201032U (zh) | 自动出入料机 | |
CN201655774U (zh) | 打标机送料装置 | |
CN114194845B (zh) | 一种循环喂料机构及其工作方法 | |
JPH01115526A (ja) | トレイ供給装置 | |
CN210614907U (zh) | 一种冲床加工中心 | |
CN205587732U (zh) | 一种设有治具回流升降台的pcb分板机 | |
CN113636353A (zh) | 一种产品码垛装置及其控制方法 | |
JPH07196161A (ja) | 部品供給方法および装置 | |
CN217591235U (zh) | 一种柔性电路板进料单元和加工系统 | |
CN220787322U (zh) | 一种棒料码垛机 | |
JP2549830B2 (ja) | パンチプレス | |
CN113800252B (zh) | 一种车灯灯杯上下料系统 | |
CN219541000U (zh) | 产品外观尺寸检测及分类系统 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |