JPS6113637A - 化合物半導体装置 - Google Patents

化合物半導体装置

Info

Publication number
JPS6113637A
JPS6113637A JP59134788A JP13478884A JPS6113637A JP S6113637 A JPS6113637 A JP S6113637A JP 59134788 A JP59134788 A JP 59134788A JP 13478884 A JP13478884 A JP 13478884A JP S6113637 A JPS6113637 A JP S6113637A
Authority
JP
Japan
Prior art keywords
compound semiconductor
adhesive resin
semiconductor device
electrode
magnetoresistive element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59134788A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342497B2 (enrdf_load_stackoverflow
Inventor
Makoto Fujita
誠 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP59134788A priority Critical patent/JPS6113637A/ja
Publication of JPS6113637A publication Critical patent/JPS6113637A/ja
Publication of JPH0342497B2 publication Critical patent/JPH0342497B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Hall/Mr Elements (AREA)
  • Wire Bonding (AREA)
JP59134788A 1984-06-28 1984-06-28 化合物半導体装置 Granted JPS6113637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59134788A JPS6113637A (ja) 1984-06-28 1984-06-28 化合物半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59134788A JPS6113637A (ja) 1984-06-28 1984-06-28 化合物半導体装置

Publications (2)

Publication Number Publication Date
JPS6113637A true JPS6113637A (ja) 1986-01-21
JPH0342497B2 JPH0342497B2 (enrdf_load_stackoverflow) 1991-06-27

Family

ID=15136559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59134788A Granted JPS6113637A (ja) 1984-06-28 1984-06-28 化合物半導体装置

Country Status (1)

Country Link
JP (1) JPS6113637A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0342497B2 (enrdf_load_stackoverflow) 1991-06-27

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