JPS61135498A - 板状複合ろう材 - Google Patents

板状複合ろう材

Info

Publication number
JPS61135498A
JPS61135498A JP25597284A JP25597284A JPS61135498A JP S61135498 A JPS61135498 A JP S61135498A JP 25597284 A JP25597284 A JP 25597284A JP 25597284 A JP25597284 A JP 25597284A JP S61135498 A JPS61135498 A JP S61135498A
Authority
JP
Japan
Prior art keywords
brazing
solder
plate
filler metal
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25597284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470120B2 (enrdf_load_stackoverflow
Inventor
Hidekazu Yanagisawa
秀和 柳澤
Kozo Kashiwagi
孝三 柏木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP25597284A priority Critical patent/JPS61135498A/ja
Publication of JPS61135498A publication Critical patent/JPS61135498A/ja
Publication of JPH0470120B2 publication Critical patent/JPH0470120B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
JP25597284A 1984-12-04 1984-12-04 板状複合ろう材 Granted JPS61135498A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25597284A JPS61135498A (ja) 1984-12-04 1984-12-04 板状複合ろう材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25597284A JPS61135498A (ja) 1984-12-04 1984-12-04 板状複合ろう材

Publications (2)

Publication Number Publication Date
JPS61135498A true JPS61135498A (ja) 1986-06-23
JPH0470120B2 JPH0470120B2 (enrdf_load_stackoverflow) 1992-11-10

Family

ID=17286126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25597284A Granted JPS61135498A (ja) 1984-12-04 1984-12-04 板状複合ろう材

Country Status (1)

Country Link
JP (1) JPS61135498A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023509856A (ja) * 2019-12-19 2023-03-10 ロジャーズ ジャーマニー ゲーエムベーハー 金属層をセラミック層に接合するためのはんだ材料、そのようなはんだ材料の製造方法、およびそのようなはんだ材料の使用

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023509856A (ja) * 2019-12-19 2023-03-10 ロジャーズ ジャーマニー ゲーエムベーハー 金属層をセラミック層に接合するためのはんだ材料、そのようなはんだ材料の製造方法、およびそのようなはんだ材料の使用
JP2024109917A (ja) * 2019-12-19 2024-08-14 ロジャーズ ジャーマニー ゲーエムベーハー 金属層をセラミック層に接合するための接合材料、そのような接合材料の製造方法、およびそのような接合材料の使用

Also Published As

Publication number Publication date
JPH0470120B2 (enrdf_load_stackoverflow) 1992-11-10

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