JPS6113377B2 - - Google Patents

Info

Publication number
JPS6113377B2
JPS6113377B2 JP55069283A JP6928380A JPS6113377B2 JP S6113377 B2 JPS6113377 B2 JP S6113377B2 JP 55069283 A JP55069283 A JP 55069283A JP 6928380 A JP6928380 A JP 6928380A JP S6113377 B2 JPS6113377 B2 JP S6113377B2
Authority
JP
Japan
Prior art keywords
bonding
wire
tool
integrated circuit
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55069283A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56165334A (en
Inventor
Hiroshi Osabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6928380A priority Critical patent/JPS56165334A/ja
Publication of JPS56165334A publication Critical patent/JPS56165334A/ja
Publication of JPS6113377B2 publication Critical patent/JPS6113377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07531—
    • H10W72/5363—

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP6928380A 1980-05-23 1980-05-23 Bonding device Granted JPS56165334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6928380A JPS56165334A (en) 1980-05-23 1980-05-23 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6928380A JPS56165334A (en) 1980-05-23 1980-05-23 Bonding device

Publications (2)

Publication Number Publication Date
JPS56165334A JPS56165334A (en) 1981-12-18
JPS6113377B2 true JPS6113377B2 (enExample) 1986-04-12

Family

ID=13398135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6928380A Granted JPS56165334A (en) 1980-05-23 1980-05-23 Bonding device

Country Status (1)

Country Link
JP (1) JPS56165334A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63268175A (ja) * 1987-04-24 1988-11-04 Hitachi Maxell Ltd 光情報記録デイスク

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
JP2011206808A (ja) * 2010-03-30 2011-10-20 Furukawa Electric Co Ltd:The 溶接装置
JP6304882B2 (ja) * 2014-06-30 2018-04-04 エリーパワー株式会社 電極積層体に対するクリップの装着方法
JP7266299B2 (ja) * 2019-09-30 2023-04-28 株式会社シンアペックス 超音波接合装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63268175A (ja) * 1987-04-24 1988-11-04 Hitachi Maxell Ltd 光情報記録デイスク

Also Published As

Publication number Publication date
JPS56165334A (en) 1981-12-18

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