JPS56165334A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS56165334A
JPS56165334A JP6928380A JP6928380A JPS56165334A JP S56165334 A JPS56165334 A JP S56165334A JP 6928380 A JP6928380 A JP 6928380A JP 6928380 A JP6928380 A JP 6928380A JP S56165334 A JPS56165334 A JP S56165334A
Authority
JP
Japan
Prior art keywords
wire
shifting
amount
arm
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6928380A
Other languages
Japanese (ja)
Other versions
JPS6113377B2 (en
Inventor
Hiroshi Osabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6928380A priority Critical patent/JPS56165334A/en
Publication of JPS56165334A publication Critical patent/JPS56165334A/en
Publication of JPS6113377B2 publication Critical patent/JPS6113377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To detect the breakage of a wire automatically by a method wherein a signal different from an ordinary one is detected by comparing the signal corresponding to the amount of shifting of a tool based upon the fact that the amount of shifting of the tool differs in accordance with the existence of nonoexstence of the wire. CONSTITUTION:By the rotation of a pulse motor 7, a main screw 9 is rotated, the bonding tool 1 is lowered and developed into the condition that the tool 1 is pushed upwards by an integrated circuit element 20, an arm 6 and a detecting arm 12 are rotated and the magnet 15 to be used for detection is displaced against a coil 17. The amount of shifting of the arm up to that time is memorized in a memory device 24 as a pulse number. On the other hand, when a wire is broken, the amount of shifting of the arm is increased in proportion to the diameter of the wire and memorized as a pulse number in the memory device, and it is compared with that of the previous one by the comparing device 25 and a wire breaking signal is outputted when a differential signal in excess of the prescribed range is obtained.
JP6928380A 1980-05-23 1980-05-23 Bonding device Granted JPS56165334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6928380A JPS56165334A (en) 1980-05-23 1980-05-23 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6928380A JPS56165334A (en) 1980-05-23 1980-05-23 Bonding device

Publications (2)

Publication Number Publication Date
JPS56165334A true JPS56165334A (en) 1981-12-18
JPS6113377B2 JPS6113377B2 (en) 1986-04-12

Family

ID=13398135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6928380A Granted JPS56165334A (en) 1980-05-23 1980-05-23 Bonding device

Country Status (1)

Country Link
JP (1) JPS56165334A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
JP2011206808A (en) * 2010-03-30 2011-10-20 Furukawa Electric Co Ltd:The Welding equipment
JP2016015198A (en) * 2014-06-30 2016-01-28 エリーパワー株式会社 Method of mounting clip to electrode laminate
JP2021053677A (en) * 2019-09-30 2021-04-08 株式会社シンアペックス Ultrasonic joining apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63268175A (en) * 1987-04-24 1988-11-04 Hitachi Maxell Ltd Optical information recording disk

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
JP2011206808A (en) * 2010-03-30 2011-10-20 Furukawa Electric Co Ltd:The Welding equipment
JP2016015198A (en) * 2014-06-30 2016-01-28 エリーパワー株式会社 Method of mounting clip to electrode laminate
JP2021053677A (en) * 2019-09-30 2021-04-08 株式会社シンアペックス Ultrasonic joining apparatus

Also Published As

Publication number Publication date
JPS6113377B2 (en) 1986-04-12

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