JPS55113338A - Wire cut detection in semiconductor wire bonding device - Google Patents

Wire cut detection in semiconductor wire bonding device

Info

Publication number
JPS55113338A
JPS55113338A JP1948079A JP1948079A JPS55113338A JP S55113338 A JPS55113338 A JP S55113338A JP 1948079 A JP1948079 A JP 1948079A JP 1948079 A JP1948079 A JP 1948079A JP S55113338 A JPS55113338 A JP S55113338A
Authority
JP
Japan
Prior art keywords
wire
current
wire cut
frame
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1948079A
Other languages
Japanese (ja)
Other versions
JPS5824011B2 (en
Inventor
Takayuki Ozaki
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1948079A priority Critical patent/JPS5824011B2/ja
Publication of JPS55113338A publication Critical patent/JPS55113338A/en
Publication of JPS5824011B2 publication Critical patent/JPS5824011B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To detect a wire cut accurately by a method wherein an AC signal having both positive and negative polarities is impressed between a wire and an object on which it is to be bonded, and by detecting current, a wire cut is determined by the presence or absence of current.
CONSTITUTION: Bonding is operated by pressing bonding wire 5 supported by capillary 8 to semiconductor pellet 3 fixed on lead frame 4. At this time, oscillator 1, which generates a square wave signal, is placed between lead frame 4 and wire 5. While the value of current flowing in series-connected resistor 2 is checked to ±0.5mA, a current is caused to flow between frame 4 and wire 5. Further, current detector 6, which detects positive and negative current, is connected in parallel to frame 4 and wire 5, and its output is fed to flip-flop circuit 7, to which the wire cut signal is fed, and a wire cut is determined by the polarity of the current. By this, the detection can be made regardless of the direction of the pn junction of pellet 3, and the determination becomes accurate.
COPYRIGHT: (C)1980,JPO&Japio
JP1948079A 1979-02-21 1979-02-21 Expired JPS5824011B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1948079A JPS5824011B2 (en) 1979-02-21 1979-02-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1948079A JPS5824011B2 (en) 1979-02-21 1979-02-21

Publications (2)

Publication Number Publication Date
JPS55113338A true JPS55113338A (en) 1980-09-01
JPS5824011B2 JPS5824011B2 (en) 1983-05-18

Family

ID=12000497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1948079A Expired JPS5824011B2 (en) 1979-02-21 1979-02-21

Country Status (1)

Country Link
JP (1) JPS5824011B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5058797A (en) * 1989-05-15 1991-10-22 Kabushiki Kaisha Shinkawa Detection method for wire bonding failures
JP2010281625A (en) * 2009-06-03 2010-12-16 Yamaha Corp Inspection method of semiconductor chip
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
US20160351537A1 (en) * 2014-02-14 2016-12-01 Shinkawa Ltd. Wire bonding apparatus and method of manufacturing semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5058797A (en) * 1989-05-15 1991-10-22 Kabushiki Kaisha Shinkawa Detection method for wire bonding failures
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
US8066171B1 (en) 2007-06-28 2011-11-29 Western Digital Technologies, Inc. Conductive metal ball bonding with electrostatic discharge detection
JP2010281625A (en) * 2009-06-03 2010-12-16 Yamaha Corp Inspection method of semiconductor chip
US20160351537A1 (en) * 2014-02-14 2016-12-01 Shinkawa Ltd. Wire bonding apparatus and method of manufacturing semiconductor device
US9899348B2 (en) * 2014-02-14 2018-02-20 Shinkawa Ltd. Wire bonding apparatus and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS5824011B2 (en) 1983-05-18

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