JPS61133314A - 熱処理装置 - Google Patents

熱処理装置

Info

Publication number
JPS61133314A
JPS61133314A JP25358284A JP25358284A JPS61133314A JP S61133314 A JPS61133314 A JP S61133314A JP 25358284 A JP25358284 A JP 25358284A JP 25358284 A JP25358284 A JP 25358284A JP S61133314 A JPS61133314 A JP S61133314A
Authority
JP
Japan
Prior art keywords
hot plate
hot air
plate
hot
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25358284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0346546B2 (enExample
Inventor
Hidetaka Jo
城　英孝
Munenori Ishimi
宗憲 石見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP25358284A priority Critical patent/JPS61133314A/ja
Priority to US06/802,468 priority patent/US4693777A/en
Priority to EP85115144A priority patent/EP0187249B1/en
Priority to DE3587830T priority patent/DE3587830T2/de
Publication of JPS61133314A publication Critical patent/JPS61133314A/ja
Publication of JPH0346546B2 publication Critical patent/JPH0346546B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
  • Heat Treatment Of Articles (AREA)
JP25358284A 1984-11-30 1984-11-30 熱処理装置 Granted JPS61133314A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP25358284A JPS61133314A (ja) 1984-11-30 1984-11-30 熱処理装置
US06/802,468 US4693777A (en) 1984-11-30 1985-11-27 Apparatus for producing semiconductor devices
EP85115144A EP0187249B1 (en) 1984-11-30 1985-11-29 Apparatus for producing semiconductor devices
DE3587830T DE3587830T2 (de) 1984-11-30 1985-11-29 Apparat zur Herstellung von Halbleiteranordnungen.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25358284A JPS61133314A (ja) 1984-11-30 1984-11-30 熱処理装置

Publications (2)

Publication Number Publication Date
JPS61133314A true JPS61133314A (ja) 1986-06-20
JPH0346546B2 JPH0346546B2 (enExample) 1991-07-16

Family

ID=17253377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25358284A Granted JPS61133314A (ja) 1984-11-30 1984-11-30 熱処理装置

Country Status (1)

Country Link
JP (1) JPS61133314A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5747876A (en) * 1980-09-03 1982-03-18 Toshiba Corp Plasma etching apparatus and method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5747876A (en) * 1980-09-03 1982-03-18 Toshiba Corp Plasma etching apparatus and method

Also Published As

Publication number Publication date
JPH0346546B2 (enExample) 1991-07-16

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees