JPS61131449A - Surface washing method - Google Patents

Surface washing method

Info

Publication number
JPS61131449A
JPS61131449A JP25187384A JP25187384A JPS61131449A JP S61131449 A JPS61131449 A JP S61131449A JP 25187384 A JP25187384 A JP 25187384A JP 25187384 A JP25187384 A JP 25187384A JP S61131449 A JPS61131449 A JP S61131449A
Authority
JP
Japan
Prior art keywords
ozone
cleaning
infrared rays
cleaned
infrared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25187384A
Other languages
Japanese (ja)
Inventor
Ryuichi Funada
舟田 隆一
Tetsuo Ishikawa
石川 鉄雄
Yoshiharu Takizawa
芳治 滝沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP25187384A priority Critical patent/JPS61131449A/en
Publication of JPS61131449A publication Critical patent/JPS61131449A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Abstract

PURPOSE:To remove organic matters from a surface in a short period of time by using a simplified facility with high efficiency whatever shape the surface may assume by a method wherein the object with its surface to be washed is positioned in an ozone atmosphere and is exposed to infrared rays of a certain wavelength. CONSTITUTION:A washing table 4 is positioned in a washing housing 1 and an object 5 to be washed is place on the washing table 4. A far infrared heater 2 is provided over the object 5 as a means to irradiate the object 5 with infrared rays. A changer wire 3 is provided as a means to generate ozone, also over the object 5 to be washed. The wavelength of the infrared rays should be somewhere between 0.72mum and 100mum to attain a good result. The result is excellent when the wavelength of 2.5-40mum is selected falling in the range wherein the organic matter to be removed absorbs the infrared energy best.

Description

【発明の詳細な説明】 〔発明の利用分野・〕 本発明は、被洗浄物表面に付着した微量有機物を除外す
・る方法に係り、特に電子部品、光学部へ。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method for removing trace amounts of organic matter adhering to the surface of an object to be cleaned, particularly for electronic parts and optical parts.

及び医療器具等の表面の洗浄に好適な洗浄方法に関する
The present invention also relates to a cleaning method suitable for cleaning the surfaces of medical instruments and the like.

〔発明の背景〕    。[Background of the invention].

スパッタリングや蒸着等による薄膜形成工程の前処理と
して基板表面等を洗−浄するため、湿式洗浄やプラズマ
アッシャ−法等が用いられているが、装置の大盤化や、
鼻空装置を必要とする点に問題がある。    ・  
・ 一方、最近では紫外線によるオゾン洗浄方法がある。例
えば、被洗浄物の表面に付着した微量の有機物を洗浄す
る方法としては、米国・特許第4028135号に記載
の”ように、低圧水銀灯を使用して被洗浄物の表面に紫
外線を照射する・ものがある。
Wet cleaning and plasma asher methods are used to clean the substrate surface as a pretreatment for thin film formation processes such as sputtering and vapor deposition.
The problem is that it requires a nasal air device.・
・On the other hand, recently there is an ozone cleaning method using ultraviolet rays. For example, as a method for cleaning trace amounts of organic matter adhering to the surface of the object to be cleaned, as described in U.S. Pat. There is something.

しかし、直進性を、有する紫外線では被洗浄物の形状に
制限があり、複雑な形状を有する被洗浄物の表面の洗浄
性については配慮されていなかった。
However, the shape of the object to be cleaned is limited by ultraviolet rays having straight-travel properties, and no consideration has been given to the cleanability of the surface of the object to be cleaned, which has a complicated shape.

また、発光管近傍でオゾン濃度、酸素ラジカル濃度が高
く、洗浄力を向上させるためには被洗浄物を発光管に近
づけなければならない。その反面、紫外線の強度分布の
影響を受け、洗浄むらが発生するといった難点があった
Furthermore, the ozone concentration and oxygen radical concentration are high near the arc tube, and in order to improve the cleaning power, the object to be cleaned must be brought close to the arc tube. On the other hand, there is a problem in that uneven cleaning occurs due to the influence of the intensity distribution of ultraviolet rays.

〔発明の目・的〕[Object/objective of the invention]

本発明は、被洗浄物の表面に付着し九微量の有機物を簡
易な設備で短時間に、かつ、一般大気中にて被洗浄物の
形状Kかかわらず洗浄しうる洗浄方法を提供することを
目的とする。
The present invention aims to provide a cleaning method capable of cleaning trace amounts of organic matter adhering to the surface of an object to be cleaned in a short time using simple equipment and in the general atmosphere regardless of the shape of the object to be cleaned. purpose.

〔発明の概要〕[Summary of the invention]

上記目的を達成するために、本発明の表面洗浄)方法は
、外囲器内にオゾンを充満させ、そのオゾン雰囲気中に
て被洗浄物に0.72μm〜1000μmの波長域の赤
外線を照射する点に特徴を有するっ 上記オゾンは外d器内に設けたオゾン発生器により充満
させるか、あるいは外部から供給してもよい。
In order to achieve the above object, the surface cleaning method of the present invention involves filling an envelope with ozone and irradiating the object to be cleaned with infrared rays in the wavelength range of 0.72 μm to 1000 μm in the ozone atmosphere. The above-mentioned ozone may be filled with an ozone generator provided in the external device, or may be supplied from the outside.

赤外線の波長域を0.72μm〜100μmとするとと
くより、顕著な効果が得られ、さらには有機物の赤外線
吸収域に対応する45μm〜40μmにおいて格別顕著
な効果が得られる。
When the wavelength range of infrared rays is 0.72 μm to 100 μm, a particularly remarkable effect can be obtained, and an especially remarkable effect can be obtained in a wavelength range of 45 μm to 40 μm, which corresponds to the infrared absorption range of organic substances.

このように、本発明によれば、赤外線の照射により先ず
選択的に有機物の昇温か起こるため、有機物表面にオゾ
ンが酸素ラジカルに変換し、被洗浄物表面の微量有機物
の分解酸化反応を促進できる。その結果、洗浄上の向上
、洗浄時間の短縮化が図れ、また被洗浄物表面やその近
傍で酸素ラジカルを発生させる九め洗浄物は形状Kかか
わりなく効果的に洗浄可能となる。また真空装置等も必
要としないので設備を小型化できろ。
As described above, according to the present invention, since the temperature of organic matter is selectively raised by irradiation with infrared rays, ozone on the surface of the organic matter is converted into oxygen radicals, and the decomposition and oxidation reaction of trace amounts of organic matter on the surface of the object to be cleaned can be promoted. . As a result, cleaning performance can be improved and cleaning time can be shortened, and objects to be cleaned that generate oxygen radicals on or near the surface of the object to be cleaned can be effectively cleaned regardless of the shape K. Also, since no vacuum equipment is required, the equipment can be made smaller.

〔発明の実施例〕[Embodiments of the invention]

次(、本発明の一実施例を説明する。#t1図に本発明
の洗浄方法を実施するための洗浄装置の部品構成概略図
を、示す。洗浄ハウジング1内に洗浄テーブル4を配置
し、その上部に被洗浄物5を位置する。赤外線を照射す
る機能として遠赤外線ヒータ2を、被洗浄物上方に位置
する。オゾンを発生する装置としてチャージャーワイヤ
3を、被洗浄物上方に位置する。なお、オゾン発生器と
じて紫外線発光管等を用いる方法も有効である。
Next, one embodiment of the present invention will be described. Fig. #t1 shows a schematic diagram of the component configuration of a cleaning device for carrying out the cleaning method of the present invention. A cleaning table 4 is arranged in the cleaning housing 1, An object to be cleaned 5 is placed above it.A far-infrared heater 2 is placed above the object to be cleaned as a function of irradiating infrared rays.A charger wire 3 is placed above the object to be cleaned as a device for generating ozone. Note that a method of using an ultraviolet light emitting tube or the like as an ozone generator is also effective.

第2図にオゾンをハウジングl外から供給するようにし
た場合の洗浄装置の部品構成概略図を示す、オゾン発生
部拡別に設け、発生し友オゾンはオゾン導入口6より導
入する。有機物を酸化した結果生じる水、二酸化炭素等
の生成物は、脱気ロアより排出する。    ・□ ′ 次に、第3図、第4図に本笑施例第1図の装置を使
用し次効果を示す、赤外線成長域としては、α72μm
〜100μmとし、被洗浄物として泗ac:1単結晶板
を用い、被洗浄物表1irKワックスを薄膜形成させ、
本装置fは洗浄を行った後、時間毎に赤外線吸収スペク
トルを測定し、C−H結合の特定吸収ピークである。Z
す20cm−’ 1 ンC=O結合の特定吸収ピークで
ある□L720m−’の赤外線吸収強度を求めた。洗浄
における被洗浄物表面の温度は150Cとなるように設
定した、ここで、!920cm−’における吸収強度の
時間変化を第3図に示す。図中Aは被洗浄物表面へオゾ
ンを噴射した場合の効果であ、9、Bは本実施例による
効果である。本実施例の場合、C−H結合の減少が速く
、オゾン噴射に比べ酸化効果にすぐれることがわかる。
FIG. 2 shows a schematic view of the parts structure of the cleaning device in the case where ozone is supplied from outside the housing 1. It is provided in an enlarged view of the ozone generating section, and the generated ozone is introduced from the ozone inlet 6. Products such as water and carbon dioxide produced as a result of oxidizing organic matter are discharged from the deaeration lower.・□ ′ Next, Figures 3 and 4 show the following effect using the apparatus shown in Figure 1 of this example.The infrared growth region is α72μm.
~100 μm, using a ac:1 single crystal plate as the object to be cleaned, forming a thin film of irK wax on the object to be cleaned,
After cleaning the device f, the infrared absorption spectrum is measured every hour, and the specific absorption peak of the C--H bond is detected. Z
The infrared absorption intensity of □L720m-', which is a specific absorption peak of the C=O bond at 20cm-' 1 , was determined. The temperature of the surface of the object to be cleaned during cleaning was set to 150C, where: Figure 3 shows the temporal change in absorption intensity at 920 cm-'. In the figure, A shows the effect when ozone is injected onto the surface of the object to be cleaned, and 9 and B show the effect of this embodiment. In the case of this example, it can be seen that the reduction of C--H bonds is rapid and the oxidation effect is superior to that of ozone injection.

また、第4図は、1.720cm−鳳における吸収強度
の時間変化であり、図中人、Bは前述し次洗浄による効
果である。図中Bを見るとC−H結合が酸化され、>C
=Oとなることがわかる。さらに洗浄を行うことによV
>C=Oが減少することから、C03とHs Oとなり
除去されていくと推測できる。一方、図中五では、まだ
>C=Oが増加している段階で6り、洗浄力はかなり遅
いと判断でき、これらの結果から本実施例では、微量有
機部を高速で除去できる効果がある。
Moreover, FIG. 4 shows the time change of the absorption intensity at 1.720 cm-Otori, and B in the figure is the effect of the subsequent cleaning as described above. Looking at B in the figure, the C-H bond is oxidized, >C
It can be seen that =O. By further washing, V
> Since C=O decreases, it can be inferred that it becomes C03 and HsO and is removed. On the other hand, in Figure 5, 6 indicates that >C=O is still increasing, and it can be judged that the cleaning power is quite slow.From these results, this example shows that trace organic parts can be removed at high speed. be.

ここでは、赤外線として0.72μffl−100μm
の赤外線ヒータを使用したが、赤外線波長域である0、
72μm〜1000μmまでの赤外線を照射することも
同様の効果は期待でき、また有機物のほとんどの赤外線
吸収域である25μm〜40μmまでの波長を主体とす
る赤外線を照射することは、さらに効率良く有機物を除
去できる効果がある。
Here, as infrared rays, 0.72μffl-100μm
I used an infrared heater of 0, which is in the infrared wavelength range.
A similar effect can be expected by irradiating infrared rays from 72 μm to 1000 μm, and irradiating infrared rays mainly having wavelengths from 25 μm to 40 μm, which is the infrared absorption range of most organic materials, can more efficiently remove organic materials. It has the effect of removing

〔発明の効果〕〔Effect of the invention〕

以上述べたように、本発明によれば、被洗浄物の表面に
付着した微量の有機物を簡易な設備で短時間に、かつ形
状にかかわらず洗浄することができる。
As described above, according to the present invention, trace amounts of organic matter adhering to the surface of the object to be cleaned can be cleaned in a short time using simple equipment, regardless of the shape.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の第1の実施例を示す表面洗浄装置の部
品構成概略図、第2図は第2の実施例を示す表面洗浄装
置の部品構成概略図、第3図は赤外線吸収スペクトル測
定によるz920α−1の赤外吸収強度を示す特性図、
第4図は1.720cut−’における赤外線吸収強度
を示す特性図である。 l・・・洗浄ハウジング、2・・・遠赤外線ヒータ、3
・・・チャージャーワイヤ、4・・・洗浄テーブル、5
・・・被洗浄物、6・・・オゾン導入口、7・・・脱気
口、ム・・・オゾン噴射による洗浄結果、B・・・本冥
施飼による洗浄結果。
Fig. 1 is a schematic diagram of the component configuration of a surface cleaning device showing the first embodiment of the present invention, Fig. 2 is a schematic diagram of the component configuration of the surface cleaning device showing the second embodiment, and Fig. 3 is an infrared absorption spectrum. A characteristic diagram showing the infrared absorption intensity of z920α-1 by measurement,
FIG. 4 is a characteristic diagram showing the infrared absorption intensity at 1.720 cut-'. l...Cleaning housing, 2...Far infrared heater, 3
...Charger wire, 4...Cleaning table, 5
...Object to be cleaned, 6.Ozone inlet, 7. Deaeration port, M..Cleaning result by ozone injection, B..Cleaning result by main treatment.

Claims (1)

【特許請求の範囲】 1、外囲器内に充満されたオゾン雰囲気中に配置された
被洗浄物に0.72μm〜1000μmの波長域の赤外
線を照射することを特徴とする表面洗浄方法。 2、特許請求の範囲第1項記載の方法において、オゾン
は外囲器内に設けられたオゾン発生器により充満させる
ことを特徴とする表面洗浄方法。 3、特許請求の範囲第1項記載の方法において、オゾン
は外囲器の外部から供給することを特徴とする表面洗浄
方法。 4、特許請求の範囲第1項又は第2項記載の方法におい
て、赤外線の波長域は0.72μm〜100μmである
ことを特徴とする表面洗浄方法。 5、特許請求の範囲第1項又は第2項記載の方法におい
て、赤外線の波長域は2.5μm〜40μmであること
を特徴とする表面洗浄方法。
[Scope of Claims] 1. A surface cleaning method characterized by irradiating an object to be cleaned placed in an ozone atmosphere filled in an envelope with infrared rays in a wavelength range of 0.72 μm to 1000 μm. 2. A surface cleaning method according to claim 1, characterized in that ozone is filled with an ozone generator provided in the envelope. 3. A surface cleaning method according to claim 1, characterized in that ozone is supplied from outside the envelope. 4. A surface cleaning method according to claim 1 or 2, characterized in that the wavelength range of the infrared rays is 0.72 μm to 100 μm. 5. A surface cleaning method according to claim 1 or 2, characterized in that the wavelength range of the infrared rays is 2.5 μm to 40 μm.
JP25187384A 1984-11-30 1984-11-30 Surface washing method Pending JPS61131449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25187384A JPS61131449A (en) 1984-11-30 1984-11-30 Surface washing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25187384A JPS61131449A (en) 1984-11-30 1984-11-30 Surface washing method

Publications (1)

Publication Number Publication Date
JPS61131449A true JPS61131449A (en) 1986-06-19

Family

ID=17229202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25187384A Pending JPS61131449A (en) 1984-11-30 1984-11-30 Surface washing method

Country Status (1)

Country Link
JP (1) JPS61131449A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178884A (en) * 1987-01-19 1988-07-22 三菱重工業株式会社 Method of removing extraneous matter
JP2009146907A (en) * 2009-03-23 2009-07-02 Gs Yuasa Corporation Ultraviolet radiation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178884A (en) * 1987-01-19 1988-07-22 三菱重工業株式会社 Method of removing extraneous matter
JP2009146907A (en) * 2009-03-23 2009-07-02 Gs Yuasa Corporation Ultraviolet radiation device

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