JPS61129850A - リ−ドレス半導体装置の製造方法 - Google Patents
リ−ドレス半導体装置の製造方法Info
- Publication number
- JPS61129850A JPS61129850A JP59251110A JP25111084A JPS61129850A JP S61129850 A JPS61129850 A JP S61129850A JP 59251110 A JP59251110 A JP 59251110A JP 25111084 A JP25111084 A JP 25111084A JP S61129850 A JPS61129850 A JP S61129850A
- Authority
- JP
- Japan
- Prior art keywords
- glass tube
- large diameter
- electrode
- projections
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59251110A JPS61129850A (ja) | 1984-11-28 | 1984-11-28 | リ−ドレス半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59251110A JPS61129850A (ja) | 1984-11-28 | 1984-11-28 | リ−ドレス半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61129850A true JPS61129850A (ja) | 1986-06-17 |
| JPH0222542B2 JPH0222542B2 (enExample) | 1990-05-18 |
Family
ID=17217797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59251110A Granted JPS61129850A (ja) | 1984-11-28 | 1984-11-28 | リ−ドレス半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61129850A (enExample) |
-
1984
- 1984-11-28 JP JP59251110A patent/JPS61129850A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0222542B2 (enExample) | 1990-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3238425A (en) | Encapsuled semiconductor device and method of its manufacture | |
| JPH01238148A (ja) | 半導体装置 | |
| US3187240A (en) | Semiconductor device encapsulation and method | |
| US4277275A (en) | Method for fabricating liquid crystal display element | |
| US3335336A (en) | Glass sealed ceramic housings for semiconductor devices | |
| US3532944A (en) | Semiconductor devices having soldered joints | |
| JPH0222542B2 (enExample) | ||
| JPS61129849A (ja) | リ−ドレス半導体装置 | |
| US3475663A (en) | High voltage glass sealed semiconductor device | |
| JP3056159B2 (ja) | 半導体パッケージの気密封止方法及びそれを適用した抵抗溶接装置 | |
| JPS6018845Y2 (ja) | Dhdガラス封止ダイオ−ド | |
| JPS63158855A (ja) | 半導体装置の封止治具 | |
| JPS6218048Y2 (enExample) | ||
| JPH01257361A (ja) | 樹脂封止型半導体装置 | |
| JPS5915080Y2 (ja) | 半導体装置 | |
| JPH0365019B2 (enExample) | ||
| KR100322059B1 (ko) | 형광표시장치 | |
| JPH04137561A (ja) | 圧接型半導体装置 | |
| JPH02263498A (ja) | 電子装置用ステム | |
| JPH01115187A (ja) | 半導体レーザ装置 | |
| JPS6290952A (ja) | 半導体装置 | |
| JPS6225903Y2 (enExample) | ||
| JPH036028Y2 (enExample) | ||
| JPS6020930Y2 (ja) | 両面冷却形半導体装置 | |
| JPS63158856A (ja) | 半導体装置の封止治具 |