JPS61129374U - - Google Patents

Info

Publication number
JPS61129374U
JPS61129374U JP1985013096U JP1309685U JPS61129374U JP S61129374 U JPS61129374 U JP S61129374U JP 1985013096 U JP1985013096 U JP 1985013096U JP 1309685 U JP1309685 U JP 1309685U JP S61129374 U JPS61129374 U JP S61129374U
Authority
JP
Japan
Prior art keywords
coating layer
curved portion
printed circuit
circuit board
pattern formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985013096U
Other languages
English (en)
Japanese (ja)
Other versions
JPH046218Y2 (en18
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985013096U priority Critical patent/JPH046218Y2/ja
Priority to US06/821,606 priority patent/US4716259A/en
Publication of JPS61129374U publication Critical patent/JPS61129374U/ja
Application granted granted Critical
Publication of JPH046218Y2 publication Critical patent/JPH046218Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP1985013096U 1985-02-01 1985-02-01 Expired JPH046218Y2 (en18)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985013096U JPH046218Y2 (en18) 1985-02-01 1985-02-01
US06/821,606 US4716259A (en) 1985-02-01 1986-01-23 Both-side flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985013096U JPH046218Y2 (en18) 1985-02-01 1985-02-01

Publications (2)

Publication Number Publication Date
JPS61129374U true JPS61129374U (en18) 1986-08-13
JPH046218Y2 JPH046218Y2 (en18) 1992-02-20

Family

ID=11823619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985013096U Expired JPH046218Y2 (en18) 1985-02-01 1985-02-01

Country Status (2)

Country Link
US (1) US4716259A (en18)
JP (1) JPH046218Y2 (en18)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018082117A (ja) * 2016-11-18 2018-05-24 住友電工デバイス・イノベーション株式会社 光モジュール

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH041750Y2 (en18) * 1986-08-07 1992-01-21
US4990948A (en) * 1986-12-27 1991-02-05 Canon Kabushiki Kaisha Flexible printed circuit board
JPH02117196A (ja) * 1988-10-26 1990-05-01 Canon Inc プリント基板
US5345205A (en) * 1990-04-05 1994-09-06 General Electric Company Compact high density interconnected microwave system
US5449591A (en) * 1991-03-06 1995-09-12 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing a curved surface multi-layer wiring board
US5462838A (en) * 1991-03-06 1995-10-31 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing a curved surface multi-layer wiring board
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
US5198965A (en) * 1991-12-18 1993-03-30 International Business Machines Corporation Free form packaging of specific functions within a computer system
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5383788A (en) * 1993-05-20 1995-01-24 W. L. Gore & Associates, Inc. Electrical interconnect assembly
US5496970A (en) * 1993-05-20 1996-03-05 W. L. Gore & Associates, Inc. Planar cable array
US5419038A (en) * 1993-06-17 1995-05-30 Fujitsu Limited Method for fabricating thin-film interconnector
US5541399A (en) * 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil
ES2127125B1 (es) * 1997-02-05 1999-11-16 Mecanismos Aux Ind Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos.
FR2786951B1 (fr) * 1998-12-02 2001-01-12 Framatome Connectors Int Disposition en sandwich coudee de rails conducteurs
US6596184B1 (en) 1999-02-15 2003-07-22 International Business Machines Corporation Non-homogeneous laminate materials for suspensions with conductor support blocks
US6585902B1 (en) * 1999-02-27 2003-07-01 International Business Machines Corporation Non-homogeneous laminate material for suspension with vibration dampening
US6533950B1 (en) * 1999-02-27 2003-03-18 International Business Machines Corporation Non-homogeneous laminate material for suspension with flexure motion limiter
KR100733877B1 (ko) * 2000-07-06 2007-07-02 엘지.필립스 엘시디 주식회사 가요성 인쇄회로 필름
JP2002220045A (ja) * 2001-01-26 2002-08-06 Honda Motor Co Ltd 電動駐車ブレーキ装置
WO2004093508A1 (ja) * 2003-04-18 2004-10-28 Ibiden Co., Ltd. フレックスリジッド配線板
JP4151584B2 (ja) * 2004-02-16 2008-09-17 セイコーエプソン株式会社 光学装置、およびプロジェクタ
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
JP4251129B2 (ja) * 2004-10-25 2009-04-08 セイコーエプソン株式会社 実装構造体、電気光学装置及び電子機器
GB2421358B (en) * 2004-12-16 2007-02-21 Sendo Int Ltd Wireless communication unit and flexible printed circuit board therefor
TWI262461B (en) * 2005-04-15 2006-09-21 Au Optronics Corp Double-sided display device
DE102006033269B4 (de) * 2006-07-18 2010-10-28 Continental Automotive Gmbh Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper
DE102006033477B3 (de) * 2006-07-19 2008-01-24 Siemens Ag Leiterträger und Anordnung mit Leiterträger
US20100147581A1 (en) * 2007-05-29 2010-06-17 Sumitomo Bakelite Co., Ltd Flexible substrate and opening/closing electronic device
US9402303B2 (en) * 2013-06-03 2016-07-26 Apple Inc. Flexible printed circuit cables with slits
KR20160110861A (ko) * 2015-03-13 2016-09-22 삼성디스플레이 주식회사 연성 회로 기판 및 이를 포함하는 표시 장치
KR102465929B1 (ko) 2016-02-19 2022-11-10 삼성디스플레이 주식회사 터치 스크린 패널 및 이를 포함하는 이동 단말기
JP2018075267A (ja) * 2016-11-11 2018-05-17 京楽産業．株式会社 遊技機
JP6615826B2 (ja) * 2017-05-12 2019-12-04 株式会社三共 遊技機
CN107864552B (zh) * 2017-11-09 2019-12-06 京东方科技集团股份有限公司 柔性电路板及其组装方法以及显示装置
WO2019216244A1 (ja) * 2018-05-07 2019-11-14 株式会社村田製作所 多層基板及びその接続構造

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5665680U (en18) * 1979-10-25 1981-06-01
JPS57104563U (en18) * 1980-12-18 1982-06-28
JPS58103182U (ja) * 1981-12-29 1983-07-13 日産自動車株式会社 フレキシブル・プリント基板
JPS5913390A (ja) * 1982-07-14 1984-01-24 ソニー株式会社 フレキシブル両面プリント基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE538934A (en18) * 1954-06-15
GB1241169A (en) * 1967-09-21 1971-07-28 Elliott Brothers London Ltd Improvements relating to printed circuits
DE2914336A1 (de) * 1979-04-09 1980-11-06 Telefonbau & Normalzeit Gmbh Verfahren zur herstellung starr- flexibler leiterplatten
JPS5748658A (en) * 1980-09-08 1982-03-20 Teikoku Hormone Mfg Co Ltd Immunologic measuring method and reagent for measurement
JPS605240A (ja) * 1983-06-24 1985-01-11 日本セメント株式会社 脆性物体の破砕方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5665680U (en18) * 1979-10-25 1981-06-01
JPS57104563U (en18) * 1980-12-18 1982-06-28
JPS58103182U (ja) * 1981-12-29 1983-07-13 日産自動車株式会社 フレキシブル・プリント基板
JPS5913390A (ja) * 1982-07-14 1984-01-24 ソニー株式会社 フレキシブル両面プリント基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018082117A (ja) * 2016-11-18 2018-05-24 住友電工デバイス・イノベーション株式会社 光モジュール
CN108072943A (zh) * 2016-11-18 2018-05-25 住友电工光电子器件创新株式会社 光学模块

Also Published As

Publication number Publication date
US4716259A (en) 1987-12-29
JPH046218Y2 (en18) 1992-02-20

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