JPS61124600A - フレ−ムパタ−ンの形成方法 - Google Patents
フレ−ムパタ−ンの形成方法Info
- Publication number
- JPS61124600A JPS61124600A JP24685384A JP24685384A JPS61124600A JP S61124600 A JPS61124600 A JP S61124600A JP 24685384 A JP24685384 A JP 24685384A JP 24685384 A JP24685384 A JP 24685384A JP S61124600 A JPS61124600 A JP S61124600A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- thickness
- frame
- frame pattern
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims abstract description 22
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 238000004090 dissolution Methods 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- 238000010019 resist printing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000011978 dissolution method Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24685384A JPS61124600A (ja) | 1984-11-21 | 1984-11-21 | フレ−ムパタ−ンの形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24685384A JPS61124600A (ja) | 1984-11-21 | 1984-11-21 | フレ−ムパタ−ンの形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61124600A true JPS61124600A (ja) | 1986-06-12 |
| JPH0355556B2 JPH0355556B2 (enrdf_load_stackoverflow) | 1991-08-23 |
Family
ID=17154685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24685384A Granted JPS61124600A (ja) | 1984-11-21 | 1984-11-21 | フレ−ムパタ−ンの形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61124600A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013057772A1 (ja) * | 2011-10-17 | 2013-04-25 | 株式会社 ベアック | 孔開き金属箔の製造方法 |
| JP2016530140A (ja) * | 2013-09-19 | 2016-09-29 | トレデガー フィルム プロダクツ コーポレイション | 成形用スクリーンを作製するための方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5492527A (en) * | 1977-12-28 | 1979-07-21 | Dainippon Printing Co Ltd | Manufacture of metal foil having apertures |
-
1984
- 1984-11-21 JP JP24685384A patent/JPS61124600A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5492527A (en) * | 1977-12-28 | 1979-07-21 | Dainippon Printing Co Ltd | Manufacture of metal foil having apertures |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013057772A1 (ja) * | 2011-10-17 | 2013-04-25 | 株式会社 ベアック | 孔開き金属箔の製造方法 |
| WO2013058289A1 (ja) * | 2011-10-17 | 2013-04-25 | 株式会社 ベアック | 孔開き金属箔の製造方法 |
| JP2016530140A (ja) * | 2013-09-19 | 2016-09-29 | トレデガー フィルム プロダクツ コーポレイション | 成形用スクリーンを作製するための方法 |
| US10556376B2 (en) | 2013-09-19 | 2020-02-11 | Tredegar Film Products Corporation | Method of making forming screens |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0355556B2 (enrdf_load_stackoverflow) | 1991-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4053370A (en) | Process for the fabrication of printed circuits | |
| JP4534984B2 (ja) | 金属フォトエッチング製品の製造方法 | |
| US4651417A (en) | Method for forming printed circuit board | |
| CN108617104A (zh) | 印刷电路板的局部图形铜厚加厚的制作方法 | |
| TWI772364B (zh) | 利用種子層的電路形成方法及用於選擇性蝕刻種子層的蝕刻液組合物 | |
| ATE228037T1 (de) | Verfahren zur galvanischen herstellung eines rakels | |
| CN103203955B (zh) | 一种台阶模板的混合制作工艺 | |
| JPS61124600A (ja) | フレ−ムパタ−ンの形成方法 | |
| JPH05220920A (ja) | 印刷用メタルマスク版の製造方法 | |
| CN103917052A (zh) | 一种用激光直接成型技术加工电路板的方法 | |
| KR100269101B1 (ko) | 메탈마스크와그제조방법 | |
| JP2004218033A (ja) | エッチング製品及びエッチング方法 | |
| US3945826A (en) | Method of chemical machining utilizing same coating of positive photoresist to etch and electroplate | |
| JPH11121900A (ja) | 回路基板の製造方法 | |
| CN111726943A (zh) | 一种采用激光光刻和全板电镀制作pcb精密线路图的方法 | |
| US5210006A (en) | Process for preparing mounting tapes for automatic mounting of electronic components | |
| JP2005336552A (ja) | 金属エッチング製品の製造方法及び金属エッチング製品 | |
| JP2004204251A (ja) | 金属エッチング製品及びその製造方法 | |
| JPH06340984A (ja) | 超薄形金属板におけるフォトエッチング加工法 | |
| JP2004091909A (ja) | レーザ加工機用マスク等に用いる精密な貫通部パターンを含む銅製プレートの電鋳方法 | |
| KR100203331B1 (ko) | 리드프레임의 제조방법 | |
| JPS6333582A (ja) | エツチング加工方法 | |
| JPH01124284A (ja) | プリント基板の製造方法 | |
| JP2986673B2 (ja) | クリーム印刷用マスクの製造方法 | |
| JPH05124172A (ja) | 金属有孔板およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |