JPS61118463A - 積層板製造用エポキシ樹脂ワニス - Google Patents
積層板製造用エポキシ樹脂ワニスInfo
- Publication number
- JPS61118463A JPS61118463A JP23992284A JP23992284A JPS61118463A JP S61118463 A JPS61118463 A JP S61118463A JP 23992284 A JP23992284 A JP 23992284A JP 23992284 A JP23992284 A JP 23992284A JP S61118463 A JPS61118463 A JP S61118463A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- varnish
- acid
- curing
- organic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 45
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 45
- 239000002966 varnish Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 150000007524 organic acids Chemical class 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 24
- 125000003277 amino group Chemical group 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 14
- 238000000465 moulding Methods 0.000 abstract description 11
- 238000003475 lamination Methods 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract description 4
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 abstract description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 abstract description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 abstract description 3
- 239000005642 Oleic acid Substances 0.000 abstract description 3
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 abstract description 3
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 abstract description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 abstract description 3
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23992284A JPS61118463A (ja) | 1984-11-14 | 1984-11-14 | 積層板製造用エポキシ樹脂ワニス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23992284A JPS61118463A (ja) | 1984-11-14 | 1984-11-14 | 積層板製造用エポキシ樹脂ワニス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61118463A true JPS61118463A (ja) | 1986-06-05 |
| JPH0238122B2 JPH0238122B2 (enrdf_load_stackoverflow) | 1990-08-29 |
Family
ID=17051839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23992284A Granted JPS61118463A (ja) | 1984-11-14 | 1984-11-14 | 積層板製造用エポキシ樹脂ワニス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61118463A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01201339A (ja) * | 1987-12-15 | 1989-08-14 | Ciba Geigy Ag | 積層品の製造方法 |
| JP2002161191A (ja) * | 2000-11-27 | 2002-06-04 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50112497A (enrdf_load_stackoverflow) * | 1974-02-15 | 1975-09-03 | ||
| JPS54148098A (en) * | 1978-05-13 | 1979-11-19 | Asahi Chem Ind Co Ltd | Novel epoxy resin composition |
| JPS5761020A (en) * | 1980-09-30 | 1982-04-13 | Ube Ind Ltd | Curing agent for epoxy resin |
-
1984
- 1984-11-14 JP JP23992284A patent/JPS61118463A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50112497A (enrdf_load_stackoverflow) * | 1974-02-15 | 1975-09-03 | ||
| JPS54148098A (en) * | 1978-05-13 | 1979-11-19 | Asahi Chem Ind Co Ltd | Novel epoxy resin composition |
| JPS5761020A (en) * | 1980-09-30 | 1982-04-13 | Ube Ind Ltd | Curing agent for epoxy resin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01201339A (ja) * | 1987-12-15 | 1989-08-14 | Ciba Geigy Ag | 積層品の製造方法 |
| JP2002161191A (ja) * | 2000-11-27 | 2002-06-04 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0238122B2 (enrdf_load_stackoverflow) | 1990-08-29 |
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