JPS61117251U - - Google Patents

Info

Publication number
JPS61117251U
JPS61117251U JP57585U JP57585U JPS61117251U JP S61117251 U JPS61117251 U JP S61117251U JP 57585 U JP57585 U JP 57585U JP 57585 U JP57585 U JP 57585U JP S61117251 U JPS61117251 U JP S61117251U
Authority
JP
Japan
Prior art keywords
integrated circuits
temperature
bounce
switching transistor
temperature chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57585U priority Critical patent/JPS61117251U/ja
Publication of JPS61117251U publication Critical patent/JPS61117251U/ja
Pending legal-status Critical Current

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Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の試験装置の一実施例の回路構
成図、第2図は従来の試験装置の回路構成図であ
る。 1……IC、5……スイツチングトランジスタ
、6……コモン回路、7……小形コネクタ。
FIG. 1 is a circuit configuration diagram of an embodiment of the testing device of the present invention, and FIG. 2 is a circuit diagram of a conventional testing device. 1...IC, 5...Switching transistor, 6...Common circuit, 7...Small connector.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路などのバアン・イン法による高温試験
を行なう装置において、高温槽内に収容した複数
の集積回路の各所定の端子をこの高温槽内に設け
た耐高温特性の良好なガリウムヒ素のFETのス
イツチングトランジスタに接続し、このスイツチ
ングトランジスタの出力を並列接続して前記高温
槽の壁面を貫通する信号端子数を減したことを特
徴とするバアン・イン法による集積回路の試験装
置。
In an apparatus for high-temperature testing of integrated circuits and the like by the bounce-in method, each predetermined terminal of a plurality of integrated circuits housed in a high-temperature chamber is provided with a gallium arsenide FET with good high-temperature resistance characteristics. 1. A testing device for integrated circuits using a bounce-in method, characterized in that the number of signal terminals passing through the wall of the high temperature chamber is reduced by connecting a switching transistor and connecting the outputs of the switching transistor in parallel.
JP57585U 1985-01-07 1985-01-07 Pending JPS61117251U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57585U JPS61117251U (en) 1985-01-07 1985-01-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57585U JPS61117251U (en) 1985-01-07 1985-01-07

Publications (1)

Publication Number Publication Date
JPS61117251U true JPS61117251U (en) 1986-07-24

Family

ID=30472545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57585U Pending JPS61117251U (en) 1985-01-07 1985-01-07

Country Status (1)

Country Link
JP (1) JPS61117251U (en)

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