JPS61111180A - ポリイミド−金属箔複合フイルムの製法 - Google Patents
ポリイミド−金属箔複合フイルムの製法Info
- Publication number
- JPS61111180A JPS61111180A JP23432084A JP23432084A JPS61111180A JP S61111180 A JPS61111180 A JP S61111180A JP 23432084 A JP23432084 A JP 23432084A JP 23432084 A JP23432084 A JP 23432084A JP S61111180 A JPS61111180 A JP S61111180A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- metal foil
- composite film
- film
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23432084A JPS61111180A (ja) | 1984-11-07 | 1984-11-07 | ポリイミド−金属箔複合フイルムの製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23432084A JPS61111180A (ja) | 1984-11-07 | 1984-11-07 | ポリイミド−金属箔複合フイルムの製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61111180A true JPS61111180A (ja) | 1986-05-29 |
| JPH0457388B2 JPH0457388B2 (enrdf_load_stackoverflow) | 1992-09-11 |
Family
ID=16969160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23432084A Granted JPS61111180A (ja) | 1984-11-07 | 1984-11-07 | ポリイミド−金属箔複合フイルムの製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111180A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114656635A (zh) * | 2022-05-25 | 2022-06-24 | 南京理工大学 | 高剥离强度低介电常数聚酰亚胺印刷电路板的制备方法 |
-
1984
- 1984-11-07 JP JP23432084A patent/JPS61111180A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114656635A (zh) * | 2022-05-25 | 2022-06-24 | 南京理工大学 | 高剥离强度低介电常数聚酰亚胺印刷电路板的制备方法 |
| CN114656635B (zh) * | 2022-05-25 | 2022-08-23 | 南京理工大学 | 高剥离强度低介电常数聚酰亚胺印刷电路板的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0457388B2 (enrdf_load_stackoverflow) | 1992-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4731287A (en) | Process for producing polyimide/metallic foil composite film | |
| US5112694A (en) | Flexible printed-circuit base board and process for producing the same | |
| JPS61111359A (ja) | ポリイミド膜 | |
| EP0271736B1 (en) | Resins of low thermal expansivity | |
| KR101558621B1 (ko) | 폴리이미드 필름 | |
| JPS62282486A (ja) | フレキシブルプリント基板 | |
| JPH03121132A (ja) | 新規ポリイミド | |
| JPH0284434A (ja) | ３，５‐ジアミノベンゾトリフルオライドを用いたポリイミドポリマーおよびコポリマー | |
| JPH05271438A (ja) | ポリイミド複合シート | |
| EP0297139B1 (en) | Flexible printed circuit board and process for its production | |
| JP2020163841A (ja) | 金属張積層板及び回路基板 | |
| JPS61111182A (ja) | ポリイミド−金属箔複合フイルムの製法 | |
| JPH047333A (ja) | 新規ポリイミド | |
| JPS61111181A (ja) | ポリイミド−金属箔複合フイルムの製法 | |
| JPS62253621A (ja) | ポリイミド樹脂 | |
| JPH0796618B2 (ja) | 低熱膨張性樹脂 | |
| KR20090013921A (ko) | 전자기기 부품용 폴리이미드 필름 | |
| US5167985A (en) | Process for producing flexible printed circuit board | |
| JPS61111180A (ja) | ポリイミド−金属箔複合フイルムの製法 | |
| JPS60203638A (ja) | ポリイミドフイルム | |
| JPH0366824B2 (enrdf_load_stackoverflow) | ||
| US5192619A (en) | Flexible copper-applied substrates | |
| JPS61195832A (ja) | ポリイミド−金属箔複合フイルム | |
| JPS61287736A (ja) | ポリイミド−金属箔複合フイルム | |
| JP2000208563A (ja) | フィルムキャリアテ―プ |