JPS61107095A - Heat pipe embedded type sandwich panel - Google Patents
Heat pipe embedded type sandwich panelInfo
- Publication number
- JPS61107095A JPS61107095A JP22844784A JP22844784A JPS61107095A JP S61107095 A JPS61107095 A JP S61107095A JP 22844784 A JP22844784 A JP 22844784A JP 22844784 A JP22844784 A JP 22844784A JP S61107095 A JPS61107095 A JP S61107095A
- Authority
- JP
- Japan
- Prior art keywords
- panel
- heat
- heat pipe
- sandwich panel
- panels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ヒートパイプを用いて熱制御を行なうヒート
パイプ埋込型サンドウィッチパネルに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat pipe-embedded sandwich panel that performs thermal control using heat pipes.
従来、ヒートパイプパネルはパネルに実装する発熱機器
の温度を最適に維持するため、その発熱をヒートパイプ
を用いてパネル全面に均一に分散し、ラジェータ面から
効率よく放熱するための装置である。そして、ラジェー
タ面からの放熱効率を上げるためにはパネルの温度を均
一化する必要がある。Conventionally, heat pipe panels are devices that use heat pipes to uniformly distribute the heat generated over the entire surface of the panel and efficiently radiate heat from the radiator surface in order to optimally maintain the temperature of heat generating devices mounted on the panel. In order to increase the efficiency of heat radiation from the radiator surface, it is necessary to equalize the temperature of the panel.
従来のヒートパイプパネルは第2図から第4図に示すよ
う々構造を有していた。第2図中、ヒートパイプパネル
は表裏ラジェータ4を有するサンドウィッチパネル3の
表面に外付ヒートパイプ1を設け、更に機器2を設けた
ものである。Conventional heat pipe panels have structures as shown in FIGS. 2 to 4. In FIG. 2, the heat pipe panel includes an external heat pipe 1 provided on the surface of a sandwich panel 3 having front and back radiators 4, and a device 2 further provided thereon.
しかるに、これによればサンドウィッチパネル3の表裏
間の温度差が大きくなりラジェータ面の放熱効率が悪く
なり、又ヒートパイプ1をパネル3の外に配置するため
、機器2の実装スペースに制約を与え、更にヒートパイ
プ1が一方向に配置されるだめ、ヒートパイプ1と直交
する方向のパネル面に温度分布が生じ、パネルの放熱効
率が悪くなるという問題点があった。However, according to this method, the temperature difference between the front and back sides of the sandwich panel 3 increases, which deteriorates the heat dissipation efficiency of the radiator surface, and since the heat pipe 1 is placed outside the panel 3, the mounting space for the equipment 2 is restricted. Furthermore, since the heat pipes 1 are arranged in one direction, a temperature distribution occurs on the panel surface in a direction perpendicular to the heat pipes 1, resulting in a problem that the heat dissipation efficiency of the panel deteriorates.
第3図は、ヒートパイプ5をサンドウィッチパネル3内
部に埋込む構造としたものである。これによれば、第2
図のものと較べて機器実装性が改善され、パネル3表裏
間の温度差を小さくできた。FIG. 3 shows a structure in which the heat pipe 5 is embedded inside the sandwich panel 3. According to this, the second
Compared to the one shown in the figure, equipment mounting has been improved, and the temperature difference between the front and back of the panel 3 can be reduced.
しかし、第2図の場合と同様に、ヒートパイプ5の方向
が1方向であるため、パネル3に温度分布が生じるとい
う問題点があった。However, as in the case of FIG. 2, since the heat pipe 5 is oriented in one direction, there is a problem in that a temperature distribution occurs in the panel 3.
第4図は、第2図および第3図のものを改良したパネル
で、ヒートバイブ5を埋込んだパネル3の外部に更にヒ
ートバイブ1を外付けしたものであり、これによりパネ
ル温度を均一化することができた。Figure 4 shows a panel that is an improvement on the panels shown in Figures 2 and 3, in which a heat vibrator 1 is further attached externally to the outside of the panel 3 in which a heat vibrator 5 is embedded, thereby making the panel temperature uniform. I was able to convert it into
しかし、第4図の構成によっても、ヒートバイブ1がパ
ネル3の外面に外付けされるため、第2図の場合と同様
に機器2の実装スペースが制約されてしまうという問題
点があった。However, even with the configuration shown in FIG. 4, since the heat vibrator 1 is externally attached to the outer surface of the panel 3, there is a problem in that the mounting space for the device 2 is restricted as in the case of FIG. 2.
c問題点の解決手段〕
本発明は、上記問題点を解決したものであり、夫々ヒー
トパイプを一方向に埋込んだ複数のサンドウィッチパネ
ルを、夫々のヒートバイブが平面的に互いに直交するよ
うに段重ねして構成したものである。c. Solution to Problem] The present invention solves the above problem, and consists of a plurality of sandwich panels each having a heat pipe embedded in one direction so that each heat vibrator is orthogonal to each other in a plane. It is constructed by stacking layers.
〔実施例〕 次に、その実施例を第1図と共に説明する。〔Example〕 Next, an example thereof will be explained with reference to FIG.
第1図は本発明に係るヒートパイプ埋込型サンドウィッ
チパネルの一実施例の斜視図であり、同図中、第2図〜
第3図と同一部分には同一符号を付す。FIG. 1 is a perspective view of an embodiment of the sandwich panel with embedded heat pipes according to the present invention, and FIG.
The same parts as in FIG. 3 are given the same reference numerals.
図中、ヒートパイプ埋込型サンドウィッチパネルは、上
部サンドウィッチパネル3−1及び下部サンドウィッチ
パネル3−2が段重ねされ、各パネル3−1 、3−2
内に夫々ヒートパイプ5が埋込壕れている。In the figure, the heat pipe embedded type sandwich panel has an upper sandwich panel 3-1 and a lower sandwich panel 3-2 stacked one on top of the other, and each panel 3-1, 3-2.
A heat pipe 5 is embedded in each trench.
この場合、各パネル3−1 、3−2のヒートバイブ5
は互いに直交するように配置されている。したがってパ
ネル3−1 、3−2の温度均一化が達成されさらにヒ
ートバイブ5は全てサンドウィッチパネル3−1 、.
3−2内部に埋込まれるため、機器2の実装の自由度が
増加した。このような構造のパネルは高熱伝達特性ヒー
トパイプパネルに応用できる。In this case, the heat vibrator 5 of each panel 3-1, 3-2
are arranged perpendicular to each other. Therefore, temperature uniformity of the panels 3-1, 3-2 is achieved, and furthermore, the heat vibes 5 are all applied to the sandwich panels 3-1, .
Since it is embedded inside 3-2, the degree of freedom in mounting the device 2 is increased. A panel with such a structure can be applied to a heat pipe panel with high heat transfer characteristics.
以上説明した如く、本発明は、夫々ヒートパイプを一方
向に埋込んだ複数のサンドウィッチパネルを、夫々のヒ
ートバイブが平面的に互いに直交するように段重ねして
構成してなるため、パネルの温度を均一化することがで
き、また、パネルへの機器実装も容易となり、さらに、
数種類の1方向ヒートパイプパネルを標準パネルとし、
その組み合わせを適切に選ぐことによりヒートパイプパ
ネルの標準化ができ、コストの低減、信頼性の向上が計
れるという利点がある。As explained above, the present invention is constructed by stacking a plurality of sandwich panels each having a heat pipe embedded in one direction in such a way that each heat vibrator is orthogonal to each other in a plane. The temperature can be made uniform, equipment can be easily mounted on the panel, and
Several types of unidirectional heat pipe panels are used as standard panels,
By appropriately selecting the combination, heat pipe panels can be standardized, which has the advantage of reducing costs and improving reliability.
第1図は本発明に係るヒートパイプ埋込型サンドウィッ
チパネルの一実施例の斜視図、第2図〜第4図は夫々従
来のヒートパイプパネルの各種例の斜視図である。
1.5・・・ヒートバイブ 2・・・機器3 、3
−1 、3−2・・・サンドウィッチパネル4・・・ラ
ジェータFIG. 1 is a perspective view of an embodiment of a heat pipe embedded type sandwich panel according to the present invention, and FIGS. 2 to 4 are perspective views of various examples of conventional heat pipe panels, respectively. 1.5...Heat vibrator 2...Device 3, 3
-1, 3-2...Sandwich panel 4...Radiator
Claims (1)
ッチパネルを、夫々のヒートパイプが平面的に互いに直
交するように段重ねして構成したことを特徴とするヒー
トパイプ埋込型サンドウィッチパネル。A sandwich panel with embedded heat pipes, comprising a plurality of sandwich panels each having a heat pipe embedded in one direction, stacked in layers such that the heat pipes are perpendicular to each other in a plane.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22844784A JPS61107095A (en) | 1984-10-30 | 1984-10-30 | Heat pipe embedded type sandwich panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22844784A JPS61107095A (en) | 1984-10-30 | 1984-10-30 | Heat pipe embedded type sandwich panel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61107095A true JPS61107095A (en) | 1986-05-24 |
Family
ID=16876632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22844784A Pending JPS61107095A (en) | 1984-10-30 | 1984-10-30 | Heat pipe embedded type sandwich panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61107095A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02206922A (en) * | 1989-02-07 | 1990-08-16 | Natl Space Dev Agency Japan<Nasda> | Radiator |
JP2012084907A (en) * | 2005-07-08 | 2012-04-26 | Fuji Electric Co Ltd | Cooling apparatus for power module |
-
1984
- 1984-10-30 JP JP22844784A patent/JPS61107095A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02206922A (en) * | 1989-02-07 | 1990-08-16 | Natl Space Dev Agency Japan<Nasda> | Radiator |
JP2012084907A (en) * | 2005-07-08 | 2012-04-26 | Fuji Electric Co Ltd | Cooling apparatus for power module |
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