JPH02206922A - Radiator - Google Patents

Abstract

PURPOSE:To attain uniformized temperature distribution and efficient heat dissipation by delivering heat of 1st and 2nd devices causing heat each comprising plural sets and one of which being a redundant system respectively from a high temperature side toward a low temperature side through a heat pipe group, and dispersing the heat. CONSTITUTION:Thermally coupled 1st-4th heat pipe groups 11-14 arranged nearly symmetrically with respect to a panel 10 are imbeded thereto, and a main travelling wave tube (main TWT) 17a, a main high voltage power supply 18a, a redundancy group travelling wave tube (redundancy group TWT) 17b and a redundancy group high voltage power supply 18b are mounted on the panel 10 opposite to the heat pipe groups 1-14. Thus, the heat dissipated from the main TWT 17a and the main high voltage power supply 18a or the redundancy group TWT 17b and the redundancy group high voltage power supply 18b is delivered from the high temperature side toward the low temperature side respectively via the heat pipes 15, 16 respectively and dissipated. Thus, the temperature distribution of the panel 10 is always kept uniform and efficient heat dissipation is attained.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention is useful for dissipating heat generated by heat-generating equipment such as transmitting relay equipment mounted on a spacecraft such as an artificial satellite. The present invention relates to a heat dissipation device used.

(Prior art) In general, this type of heat dissipation device embeds a well-known heat transport heat pipe in a honeycomb structure panel, installs a heat generating device on this panel, and dissipates the heat generated by the operation of the heat generating device. Effective heat dissipation is achieved by distributing heat over the entire surface of the panel via heat pipes. In this case, efficient heat radiation of the panel is achieved by keeping the temperature of the panel heat radiation surface uniform.

By the way, in such a heat dissipation device, due to the relationship between the buried position of the heat pipe buried in the panel and the installed heat generating equipment, the temperature distribution on the panel surface may vary depending on the activation and deactivation of the heat generating equipment. This may cause the heat dissipation efficiency to change, making it difficult to sufficiently dissipate heat from other heat generating devices. Therefore, in the past, heat pipes were buried densely in the panel to maintain a uniform temperature distribution on the panel even when, for example, one or more heat generating devices were stopped. was designed to dissipate heat efficiently.

However, in the above-mentioned heat radiating device, when the operation of the heat generating device is stopped and the heat generation stops, a large amount of the temperature of the heat generating device is radiated and the temperature decreases. Since it has to be controlled, there is a problem in that the power consumption increases.

(Problems to be Solved by the Invention) As described above, conventional heat dissipation devices have the problem of increasing power consumption due to the need for a large number of heaters when trying to make the temperature distribution uniform. Ta.

This invention has been made in view of the above circumstances, and provides a heat radiating device that has a simple configuration, can achieve uniform temperature distribution, and can achieve as efficient heat radiation as possible. The purpose is to

[Structure of the Invention] (Means for Solving the Problems) The present invention includes a plurality of thermally coupled heat pipe groups arranged and buried in a panel in a substantially symmetrical manner, and a plurality of heat pipe groups facing each of the heat pipe groups. A heat radiating device is constructed by including a plurality of sets of first and second heat generating devices, one of which is mounted on the panel and one of which forms a redundant system.

(Function) According to the above configuration, the heat generated by the first and second heat generating devices is transferred and dispersed from the high temperature side to the low temperature side via the heat pipe group, so that the panel Through this, a uniform temperature distribution is always ensured.

Therefore, even when only one of the first and second heat generating devices is driven, the heat generated from one of the driven devices is uniformly distributed over the entire panel, and efficient heat radiation is performed. Since the heat is transferred to the other first and second heat generating devices in the activated state to keep them warm, the heat keeping heater can be simplified.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a heat dissipation device according to an embodiment of the present invention, and 10 in the figure is a panel 10 formed in a substantially rectangular shape with, for example, a honeycomb structure. First to fourth heat pipe groups 11 to 14 are arranged and buried in this panel 10 in a substantially symmetrical manner. These first to fourth heat pipes 11
-14 groups are thermally coupled via curved and straight heat pipes 15 to enable heat transfer, and both ends of the groups are further thermally coupled via straight heat pipes 16. Ru. Each panel 10 on each heat pipe 15 of the first to fourth heat pipe groups 11 to 14 has a pair of heat generating devices, one of which forms a redundant system, such as a main traveling wave tube (main TWT) 17a and a A main high-voltage power supply 18a, a redundant traveling wave tube (redundant TWT) 17b, and a redundant high-voltage electric power supply 18b are similarly mounted.

In the above configuration, the first to fourth heat pipe groups 11
When the main TWT 17a and the main high-voltage power supply 18a on 14 to 14 are activated and start generating heat, the heat is transferred to the redundant TWT via the working medium (not shown) of the heat pipe 15.16.
17b and the redundant high-voltage power supply 18b, where the heat is radiated. As a result, the main TWT 17a and the main high voltage power supply 1
The heat generated from 8a is dispersed throughout the panel and the panel 10
The temperature distribution becomes uniform, and the desired heat dissipation efficiency of the panel 10 is ensured.

Further, when the operation of the six main TWTs 17 a and the main high voltage power source 18 a of the first to fourth heat pipe groups 11 to 14 is stopped, and the redundant system TWT 17 b and the redundant system high voltage power source 18 b are switchably activated. Similarly, the redundant system TWT
Heat generated from the TWT 17b and the redundant high-voltage power supply 18b is transferred to the main TWT 17a and the main high-voltage power supply 18a via the working medium (not shown) of the heat tube 15, 16, and is radiated.

As a result, the heat generated from the redundant TWT 17b and the redundant high voltage power supply 18b is distributed over the entire panel, the temperature distribution of the panel 10 becomes uniform, and the desired heat dissipation efficiency of the panel 10 is ensured.

In this manner, the heat dissipation device embeds first to fourth heat pipe groups 11 to 14 that are arranged approximately symmetrically and thermally coupled in the panel 10, and these first to fourth heat pipe groups Main T on the panel 10 facing 1 to 14 respectively.
WT17a and main high voltage power supply 18a and redundant system TWT 17
b and the redundant high voltage power supply 18b, the main TWT 17 a and the main high voltage power supply 18
The heat generated in the redundant system TWT 17 b and the redundant high voltage power supply 18 b is transferred from the high temperature side to the low temperature side through the heat pipes 15 and 16 and radiated, so that the temperature distribution of the panel is always the same. Heat is maintained uniformly and efficient heat dissipation is achieved. Further, according to this, heat is always transferred from the high temperature side to the low sound side and radiated, so that the main TW 717a and the main high voltage power supply 18a and the redundant system TW
By ensuring a constant temperature at all times, one of T17b and the redundant high voltage power supply 18b that is in the activated state,
It is possible to reduce the need for a heater (not shown) for keeping warm when the machine is stopped.
Power saving is achieved as much as possible.

Although the above embodiment has been described using the first to fourth heat pipe groups 11 to 14, the present invention is not limited to this number and can be applied.

Therefore, it goes without saying that the present invention is not limited to the above embodiments, and that various modifications can be made without departing from the spirit of the invention.

[Effects of the Invention] As detailed above, according to the present invention, it is possible to achieve uniform temperature distribution with a simple configuration, and to realize heat dissipation as efficiently as possible. A heat dissipation device can be provided.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram showing a heat dissipation device according to an embodiment of the present invention. 10... Panel, 11-14... First to fourth heat pipe group, 15.16... Heat pipe, 17
a--Main TWT, 18 a--Main high voltage power supply, 1
7b... Redundant system TWT, 18b... Redundant system high voltage power supply. Applicant's agent Patent attorney Takehiko Suzue

Claims (1)

[Claims] A plurality of thermally coupled heat pipe groups arranged and buried in a panel in a substantially symmetrical manner, and one mounted on the panel facing each of the heat pipe groups has a redundant system. A heat radiating device comprising a plurality of sets of first and second heat generating devices.