CN201985088U - Heat radiation device and computer - Google Patents
Heat radiation device and computer Download PDFInfo
- Publication number
- CN201985088U CN201985088U CN201020690892XU CN201020690892U CN201985088U CN 201985088 U CN201985088 U CN 201985088U CN 201020690892X U CN201020690892X U CN 201020690892XU CN 201020690892 U CN201020690892 U CN 201020690892U CN 201985088 U CN201985088 U CN 201985088U
- Authority
- CN
- China
- Prior art keywords
- heat
- pipe
- heat pipe
- heater element
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
Abstract
The utility model provides a heat radiation device and a computer. The heat radiation device comprises heat radiating fins; a first heat pipe, one end of which is connected with the heat radiating fins and the other end of which is connected with a heating element; and a second heat pipe, one end of which is connected with the heat radiating fins and the other end of which is connected with the heating element; wherein when the heating element is at a low power, the heat radiation capability of the first heat pipe is higher than the heat radiation capability of the second heat pipe, and when the heating element is at a high power, the heat radiation capability of the second heat pipe is higher than the heat radiation capability of the first heat pipe. By using the heat radiation device and the computer, no matter whether the heating element is at a high power or a low power, effective heat radiation can be realized.
Description
Technical field
The utility model relates to field of computer technology, relates in particular to a kind of heat abstractor and computer.
Background technology
At present, computer more and more develops to miniaturization, highly integrated direction, and the inner space of miniaturization, highly integrated computer is less, thereby the heat dissipation problem of CPU (Central Processing Unit, central processing unit) becomes the focus that industry is concerned about.Usually adopt following two kinds of heat abstractors in the prior art, CPU dispelled the heat:
First kind of heat abstractor is single heat pipe (HP, Heatpipe) heat abstractor, single heat-pipe radiating apparatus is made up of radiator fan, radiating fin and single heat pipe, one end of single heat pipe is connected with the metal base that is used for support CPU, the other end is connected with radiating fin, and radiator fan is arranged at the radiating fin side.The heat that discharges during CPU work is absorbed by metal base, and metal base conducts heat to radiating fin by single heat pipe, and the air-flow that radiator fan produces dispels the heat on the radiating fin.Because single heat pipe is analgesic limited in one's ability, therefore when CPU was in high power state, the radiating effect of single heat-pipe radiating apparatus was limited.
Second kind of heat abstractor is loop circuit heat pipe (LHP, Loop Heatpipe) heat abstractor, the loop circuit heat pipe heat abstractor is made up of radiator fan, radiating fin and loop circuit heat pipe, one end of loop circuit heat pipe is connected with the metal base that is used for support CPU, the other end is connected with radiating fin, and radiator fan is arranged at the radiating fin side.The heat that discharges during CPU work is absorbed by metal base, and metal base conducts heat to radiating fin by loop circuit heat pipe, and the air-flow that radiator fan produces dispels the heat on the radiating fin.Test learns that when CPU was in low power state, the radiating effect of loop circuit heat pipe heat abstractor was not obvious according to reality.
The utility model content
In view of this, the utility model provides a kind of heat abstractor and computer, and no matter heater element is in high power state still is in low power state, all can carry out efficiently radiates heat to it.
For addressing the above problem, the utility model provides a kind of heat abstractor, comprising:
Radiating fin;
First heat pipe, an end of described first heat pipe is connected with described radiating fin, and the other end is connected with heater element;
Second heat pipe, an end of described second heat pipe is connected with described radiating fin, and the other end is connected with described heater element;
Wherein, when described heater element is in low power state, the heat-sinking capability of described first heat pipe is higher than the heat-sinking capability of described second heat pipe, and when described heater element was in high power state, the heat-sinking capability of described second heat pipe was higher than the heat-sinking capability of described first heat pipe.
Preferably, described first heat pipe comprises endotherm section and radiating segment, and described endotherm section is connected with described heater element, offers a perforation that matches with described radiating segment on the described radiating fin, and described radiating segment is arranged in the described perforation.
Preferably, described first heat pipe is the hollow metal pipe that liquid is housed.
Preferably, a side of described radiating fin offers first groove, described second heat pipe to the small part assembly in described first groove.
Preferably, described second heat pipe comprises a U type pipe and the 2nd U type pipe, the one U type pipe and the 2nd U type Guan Chengyi loop, a described U type pipe is connected with described heater element, two openends of a described U type pipe are connected with two openends of described the 2nd U type pipe respectively, and described the 2nd U type pipe assembly is in described first groove.
Preferably, a described U type pipe and described the 2nd U type pipe are the hollow metal pipe that liquid is housed, and the liquid in a described U type pipe and described the 2nd U type pipe forms the loop.
Preferably, the bottom of a described U type pipe is provided with a substrate, and described second heat pipe is connected with described heater element by described substrate, and the endotherm section of described first heat pipe is connected with described heater element by described substrate.
Preferably, offer second groove on the described substrate, described endotherm section to the small part assembly in described second groove.
Preferably, described heat abstractor also comprises:
One radiator fan, described radiator fan is arranged at the side of described radiating fin.
The utility model also provides a kind of computer, comprises a heat abstractor, and described heat abstractor comprises:
Radiating fin;
First heat pipe, an end of described first heat pipe is connected with described radiating fin, and the other end is connected with heater element;
Second heat pipe, an end of described second heat pipe is connected with described radiating fin, and the other end is connected with described heater element;
Wherein, when described heater element is in low power state, the heat-sinking capability of described first heat pipe is higher than the heat-sinking capability of described second heat pipe, and when described heater element was in high power state, the heat-sinking capability of described second heat pipe was higher than the heat-sinking capability of described first heat pipe.
Preferably, described first heat pipe comprises endotherm section and radiating segment, and described endotherm section is connected with described heater element, offers a perforation that matches with described radiating segment on the described radiating fin, and described radiating segment is arranged in the described perforation.
Preferably, described first heat pipe also comprises bending segment, and an end of described endotherm section is connected with described heater element, and the other end is connected with described bending segment, and the other end of described bending segment is connected with described radiating segment.
Preferably, described first heat pipe is the hollow metal pipe that liquid is housed.
Preferably, a side of described radiating fin offers first groove, described second heat pipe to the small part assembly in described first groove.
Preferably, described second heat pipe comprises a U type pipe and the 2nd U type pipe, the one U type pipe and the 2nd U type Guan Chengyi loop, a described U type pipe is connected with described heater element, two openends of a described U type pipe are connected with two openends of described the 2nd U type pipe respectively, and described the 2nd U type pipe assembly is in described first groove.
Preferably, a described U type pipe and described the 2nd U type pipe are the L type.
Preferably, a described U type pipe and described the 2nd U type pipe are the hollow metal pipe that liquid is housed, and the liquid in a described U type pipe and described the 2nd U type pipe forms the loop.
Preferably, the bottom of a described U type pipe is provided with a substrate, and the endotherm section of described first heat pipe is connected with described heater element by described substrate.
Preferably, offer second groove on the described substrate, described endotherm section to the small part assembly in described second groove.
Preferably, described computer also comprises:
One radiator fan, described radiator fan is arranged at the side of described radiating fin.
The utlity model has following beneficial effect:
Adopt the mode of the heat pipe combination of two kinds of different performances, wherein, first heat pipe has good heat-sinking capability when heater element is in low power state, second heat pipe has good heat-sinking capability when heater element is in high power state, making no matter heater element is in high power state still is in low power state, all can carry out efficiently radiates heat to it.
Because the high efficiency and heat radiation of heat pipe makes radiator fan not need to maintain high-speed state, therefore reduce system noise, and can use undersized radiator fan, further reduced the shared system space of heat abstractor.
Description of drawings
Fig. 1 is the structural representation of the heat abstractor of the utility model embodiment;
Fig. 2 is the partition structural representation of the heat abstractor of the utility model embodiment.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.
Please refer to Fig. 1 and Fig. 2, be the structural representation of the heat abstractor of the utility model embodiment, described heat abstractor is used to heater element heat radiation, and described heat abstractor comprises:
Radiating fin 101, described radiating fin 101 is made up of several stacked fins;
Wherein, when described heater element is in low power state, the heat-sinking capability of described first heat pipe 102 is higher than the heat-sinking capability of described second heat pipe 103, and when described heater element was in high power state, the heat-sinking capability of described second heat 103 was higher than the heat-sinking capability of described first heat pipe 102.
The heat abstractor that the foregoing description provides, adopt the mode of the heat pipe combination of two kinds of different performances, wherein, first heat pipe 102 has good heat-sinking capability when heater element is in low power state, second heat pipe 103 has good heat-sinking capability when heater element is in high power state, making no matter heater element is in high power state still is in low power state, all can carry out efficiently radiates heat to it.
Described first heat pipe 102 and described second heat pipe 103 can be multiple structures, describe for example below described.
Please refer to Fig. 2, described first heat pipe 102 can be a single heat pipe, and described first heat pipe 102 comprises endotherm section 1021 and radiating segment 1022, and wherein, described endotherm section 1021 is connected with described heater element, and described radiating segment 1022 is connected with described radiating fin 101.Described radiating segment 1022 can be connected with described radiating fin 101 in several ways, as shown in Figure 2, can on described radiating fin 101, offer a perforation 1011 that matches with described radiating segment 1022, described radiating segment 1022 is arranged in the described perforation 1011, under this kind structure, described radiating segment 1022 can fully contact with described radiating fin 101, helps the quick heat radiating of described radiating segment 1022.In addition, described radiating segment 1022 also can be connected with described radiating fin 101 by other modes, for example, can on the surface of described radiating fin 101, offer a groove that matches with described radiating segment 1022, with described radiating segment 1022 assemblies in described groove.
In addition, in order to be connected with described radiating fin 101 and described second heat pipe 103, described first heat pipe 102 also comprises a bending segment 1023, one end of described endotherm section 1021 is connected with described heater element, the other end is connected with described bending segment 1023, and the other end of described bending segment 1023 is connected with described radiating segment 1022.
In order to increase radiating effect, described first heat pipe 102 can be for being equipped with the hollow metal pipe of liquid, and wherein, described liquid can be water or wet goods.Certainly, described first heat pipe 102 also can be solid metal tube.
Please refer to Fig. 2, described second heat pipe 103 can be a loop circuit heat pipe, described second heat pipe 103 can be connected with described radiating fin 101 in several ways, as depicted in figs. 1 and 2, one side of described radiating fin 101 offers first groove 1012, described second heat pipe 103 to the small part assembly in described first groove 1012.Described second heat pipe 103 comprises a U type pipe 1031 and the 2nd U type pipe 1032, the one U type pipe 1031 and the 2nd U type pipe 1032 are a loop, a described U type pipe 1031 is connected with described heater element, two openends of a described U type pipe 1031 are connected with two openends of described the 2nd U type pipe 1032 respectively, and described the 2nd U type pipe 1032 assemblies are in described first groove 1012.A described U type pipe 1031 and described the 2nd U type pipe 1032 are the L type.
In order to increase radiating effect, a described U type pipe 1031 and described the 2nd U type pipe 1032 can be for being equipped with the hollow metal pipe of liquid, and described liquid can be water or wet goods, and the liquid in a described U type pipe 1031 and described the 2nd U type pipe 1032 forms the loop.Certainly, described U type pipe 1031 and described the 2nd U type pipe 1032 also can be solid metal pipe.
In order fully to contact with described heater element, can be provided with a substrate 10311 in the bottom of a described U type pipe 1031, described substrate 10311 is a metal material, described second heat pipe 103 is connected with described heat generating component by described substrate, in addition, the endotherm section 1021 of described first heat pipe 102 also is connected with described heater element by described substrate 10311.The endotherm section 1021 of described first heat pipe 102 also can combine with described substrate 10311 in several ways, for example, can offer second groove 103111 on the described substrate 10311, described endotherm section 1021 to the small part assembly in described second groove 103111.
Loop circuit heat pipe has the far away and strong characteristics of heat-transfer capability of heat transfer distances, therefore can when being in high power state, heater element carry out efficiently radiates heat to it, single heat pipe has efficient performance when heater element is in low power state, can remedy the deficiency of loop circuit heat pipe heat-sinking capability when heater element is in low power state.
In addition, above-mentioned heat abstractor can also comprise a radiator fan (figure does not show), described radiator fan is arranged at the side of described radiating fin 101, and the air-flow that described radiator fan produces can dispel the heat on described radiating fin 101, described first heat pipe 102 and described second heat pipe 103.Because the high efficiency and heat radiation of heat pipe makes radiator fan not need to maintain high-speed state, therefore reduce system noise, and can use undersized radiator fan, further reduced the shared system space of heat abstractor.
In the foregoing description, the heat that discharges during heater element work can be absorbed by described substrate 10311, by described first heat pipe 102 and described second heat pipe 103 heat is conducted to described radiating fin 101, the air-flow that described radiator fan produces dispels the heat on the described radiating fin 101.
The utility model embodiment also provides a kind of computer, the heat abstractor that described computer comprises a heater element and is used to described heater element heat radiation, described heater element can be elements such as CPU, the structure of the heat abstractor among the structure of described heat abstractor and the described embodiment is identical, comprising:
Radiating fin, described radiating fin is made up of several stacked fins;
First heat pipe, an end of described first heat pipe is connected with described radiating fin, and the other end is connected with described heater element;
Second heat pipe, an end of described second heat pipe is connected with described radiating fin, and the other end is connected with described heater element;
Wherein, when described heater element is in low power state, the heat-sinking capability of described first heat pipe is higher than the heat-sinking capability of described second heat pipe, and when described heater element was in high power state, the heat-sinking capability of described second heat was higher than the heat-sinking capability of described first heat pipe.
The heat abstractor that the foregoing description provides, adopt the mode of the heat pipe combination of two kinds of different performances, wherein, first heat pipe has good heat-sinking capability when heater element is in low power state, second heat pipe has good heat-sinking capability when heater element is in high power state, making no matter heater element is in high power state still is in low power state, all can carry out efficiently radiates heat to it.
Described first heat pipe and described second heat pipe can be multiple structures, describe for example below described.
Described first heat pipe can be a single heat pipe, and described first heat pipe comprises endotherm section and radiating segment, and wherein, described endotherm section is connected with described heater element, and described radiating segment is connected with described radiating fin.Described radiating segment can be connected with described radiating fin in several ways, for example, can on described radiating fin, offer a perforation that matches with described radiating segment, described radiating segment is arranged in the described perforation, under this kind structure, described radiating segment can fully contact with described radiating fin, helps the quick heat radiating of described radiating segment.In addition, described radiating segment also can be connected with described radiating fin by other modes, for example, can offer a groove that matches with described radiating segment on the surface of described radiating fin, and described radiating segment assembly is in described groove.
In addition, in order to be connected with described radiating fin and described second heat pipe, described first heat pipe also comprises a bending segment, and an end of described endotherm section is connected with described heater element, the other end is connected with described bending segment, and the other end of described bending segment is connected with described radiating segment.
In order to increase radiating effect, described first heat pipe can be for being equipped with the hollow metal pipe of liquid, and wherein, described liquid can be water or wet goods.Certainly, described first heat pipe also can be solid metal tube.
Described second heat pipe can be a loop circuit heat pipe, described second heat pipe can be connected with described radiating fin in several ways, for example, can offer one first groove in a side of described radiating fin, described second heat pipe to the small part assembly in described first groove.Described second heat pipe comprises a U type pipe and the 2nd U type pipe, a described U type pipe and described the 2nd U type Guan Chengyi loop, a described U type pipe is connected with described heater element, two openends of a described U type pipe are connected with two openends of described the 2nd U type pipe respectively, and described the 2nd U type pipe assembly is in described first groove.A described U type pipe and described the 2nd U type pipe are the L type.
In order to increase radiating effect, a described U type pipe and described the 2nd U type pipe can be for being equipped with the hollow metal pipe of liquid, and described liquid can be water or wet goods, and the liquid in a described U type pipe and described the 2nd U type pipe forms the loop.Certainly, described U type pipe and described the 2nd U type pipe also can be solid metal pipe.
In order fully to contact with described heater element, can one substrate be set in the bottom of a described U type pipe, described substrate is a metal material, in addition, the endotherm section of described first heat pipe is connected with described heater element by described substrate.The endotherm section of described first heat pipe also can combine with described substrate in several ways, for example, can offer one second groove on the described substrate, described endotherm section to the small part assembly in described second groove.
Loop circuit heat pipe has the far away and strong characteristics of heat-transfer capability of heat transfer distances, therefore can when being in high power state, heater element carry out efficiently radiates heat to it, single heat pipe has efficient performance when heater element is in low power state, can remedy the deficiency of loop circuit heat pipe heat-sinking capability when heater element is in low power state.
In addition, the aforementioned calculation machine can also comprise a radiator fan, and described radiator fan is arranged at the side of described radiating fin, and the air-flow that described radiator fan produces can dispel the heat on described radiating fin, described first heat pipe and described second heat pipe.Because the high efficiency and heat radiation of heat pipe makes radiator fan not need to maintain high-speed state, therefore reduce system noise, and can use undersized radiator fan, further reduced the shared system space of heat abstractor.
In the foregoing description, the heat that discharges during heater element work can be absorbed by described substrate, by described first heat pipe and described second heat pipe heat is conducted to described radiating fin, the air-flow that described radiator fan produces dispels the heat on the described radiating fin.
For convenience of description, the heat abstractor in the foregoing description only comprises one first heat pipe and one second heat pipe, and certainly, in order to increase radiating effect, described heat abstractor also can comprise a plurality of first heat pipes or a plurality of second heat pipe, no longer describes in detail at this.
The above only is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (10)
1. a heat abstractor is characterized in that, comprising:
Radiating fin;
First heat pipe, an end of described first heat pipe is connected with described radiating fin, and the other end is connected with heater element;
Second heat pipe, an end of described second heat pipe is connected with described radiating fin, and the other end is connected with described heater element;
Wherein, when described heater element is in low power state, the heat-sinking capability of described first heat pipe is higher than the heat-sinking capability of described second heat pipe, and when described heater element was in high power state, the heat-sinking capability of described second heat pipe was higher than the heat-sinking capability of described first heat pipe.
2. heat abstractor as claimed in claim 1, it is characterized in that described first heat pipe comprises endotherm section and radiating segment, described endotherm section is connected with described heater element, offer a perforation that matches with described radiating segment on the described radiating fin, described radiating segment is arranged in the described perforation.
3. heat abstractor as claimed in claim 2 is characterized in that, described first heat pipe is the hollow metal pipe that liquid is housed.
4. heat abstractor as claimed in claim 1 or 2 is characterized in that, a side of described radiating fin offers first groove, described second heat pipe to the small part assembly in described first groove.
5. heat abstractor as claimed in claim 4, it is characterized in that, described second heat pipe comprises a U type pipe and the 2nd U type pipe, the one U type pipe and the 2nd U type Guan Chengyi loop, a described U type pipe is connected with described heater element, two openends of a described U type pipe are connected with two openends of described the 2nd U type pipe respectively, and described the 2nd U type pipe assembly is in described first groove.
6. heat abstractor as claimed in claim 5 is characterized in that, a described U type pipe and described the 2nd U type pipe are the hollow metal pipe that liquid is housed, and the liquid in a described U type pipe and described the 2nd U type pipe forms the loop.
7. heat abstractor as claimed in claim 5, it is characterized in that, the bottom of a described U type pipe is provided with a substrate, and described second heat pipe is connected with described heater element by described substrate, and the endotherm section of described first heat pipe is connected with described heater element by described substrate.
8. heat abstractor as claimed in claim 7 is characterized in that, offers second groove on the described substrate, described endotherm section to the small part assembly in described second groove.
9. heat abstractor as claimed in claim 1 is characterized in that, also comprises:
One radiator fan, described radiator fan is arranged at the side of described radiating fin.
10. a computer is characterized in that, comprising: as each described heat abstractor in the claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020690892XU CN201985088U (en) | 2010-12-21 | 2010-12-21 | Heat radiation device and computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020690892XU CN201985088U (en) | 2010-12-21 | 2010-12-21 | Heat radiation device and computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201985088U true CN201985088U (en) | 2011-09-21 |
Family
ID=44612544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020690892XU Expired - Lifetime CN201985088U (en) | 2010-12-21 | 2010-12-21 | Heat radiation device and computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201985088U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107357393A (en) * | 2017-07-25 | 2017-11-17 | 合肥铭剑信息技术有限公司 | A kind of fast computer heat radiating device of radiating rate |
| CN110906767A (en) * | 2018-09-14 | 2020-03-24 | 财团法人工业技术研究院 | Three-dimensional pulse type heat pipe, three-dimensional pulse type heat pipe set and heat dissipation module |
-
2010
- 2010-12-21 CN CN201020690892XU patent/CN201985088U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107357393A (en) * | 2017-07-25 | 2017-11-17 | 合肥铭剑信息技术有限公司 | A kind of fast computer heat radiating device of radiating rate |
| CN110906767A (en) * | 2018-09-14 | 2020-03-24 | 财团法人工业技术研究院 | Three-dimensional pulse type heat pipe, three-dimensional pulse type heat pipe set and heat dissipation module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6535385B2 (en) | High performance heat sink configurations for use in high density packaging applications | |
| JP3169627U (en) | Cooling device heat dissipation structure | |
| US20030019610A1 (en) | Rapidly self - heat-conductive heat - dissipating module | |
| US20100238630A1 (en) | Heat dissipation device | |
| JP2004320021A (en) | System and method for cooling electronic device | |
| US20040052051A1 (en) | Heat sink with heat pipe and base fins | |
| US20080253082A1 (en) | Cooling system with flexible heat transport element | |
| CN101616565A (en) | Heat abstractor | |
| CN101193535B (en) | Heat pipe radiator | |
| CN108491046A (en) | A kind of heat radiation type computer cabinet | |
| US20150096720A1 (en) | Heat dissipation module | |
| CN201985088U (en) | Heat radiation device and computer | |
| US20030189813A1 (en) | High performance heat sink configurations for use in high density packaging applications | |
| US20110048677A1 (en) | Heat-conducting assembly for heat pipes of different diameters and heat sink having the same | |
| CN101415312B (en) | Radiating device | |
| US20150062817A1 (en) | Server | |
| US6968890B1 (en) | Heat sink | |
| US7688590B2 (en) | Thermal module and electronic apparatus using the same | |
| TW201324095A (en) | Heat dissipation device and interface card with the same | |
| US6257323B1 (en) | Heat dissipating device | |
| CN104914949A (en) | Combined type computer water-cooling heat dissipation device | |
| TWI544866B (en) | Heat dissipation device | |
| JP2008089253A (en) | Heat sink | |
| TW200829148A (en) | Heat sink assembly | |
| CN212851545U (en) | Heat sink and electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110921 |