GB2369882A - A plurality of two adjacent heat pipes in a single layer for equipment radiator panels. - Google Patents
A plurality of two adjacent heat pipes in a single layer for equipment radiator panels. Download PDFInfo
- Publication number
- GB2369882A GB2369882A GB0122171A GB0122171A GB2369882A GB 2369882 A GB2369882 A GB 2369882A GB 0122171 A GB0122171 A GB 0122171A GB 0122171 A GB0122171 A GB 0122171A GB 2369882 A GB2369882 A GB 2369882A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat
- heat pipes
- panels
- bore
- pipes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/503—Radiator panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/506—Heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/0246—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
Abstract
Heat dissipating apparatus for use on a spacecraft having heat generating elements 11 disposed on panels 22. The heat dissipating apparatus comprises a plurality of two adjacent heat pipes disposed in a single layer 13. The said heat pipes 13 may be selectively disposed on non radiating surfaces of the panels 22, or between the outer and the inner surfaces 22a, 22b of the panels 22. Heat generating elements 11 are disposed opposite to the said heat pipes 13. Preferably, the heat generating elements 11 are components such as travelling wave tube, channel, power amplifiers, and the arrangement of the said heat pipes 13 comprise a plurality of 'U' shaped heat pipes 13 nestled/interlinked with adjacent 'U, shaped heat pipes 13.
Description
MONO-LAYER DUAL-BO1lE HEAT PIPE SYSTEM FOR EQUIPMENT RADIATOR PANELS
The present invention relates generally to spacecraft, and more particularly, to heat 5 dissipating apparatus comprising a mono-layer dual-bore heat pipe for use in or on equipment and radiator panels of a spacecraft.
The assignee of the present invention manufactures and deploys communication spacecraft. Such spacecraft use heat pipes that are used to dissipate heat. The heat pipes transfer thermal energy from equipment panels to spacecraft radiator panels where it is 10 radiated into space.
For example, conventional spacecraft have radiator panels mounted on opposite sides thereof. The radiator panels are typically positioned in north and south directions and are used to dissipate heat from electronic components of the spacecraft. The radiator panels typically extend across the side surface of the spacecraft body so that thermal energy 15 is distributed over the panel so that it is effectively radiated into space.
Due to solar effects, as well as heat caused by the electronic components of the spacecraft, it is often difficult for the radiator panels to effectively dissipate heat generated inside the spacecraft body. U.S. Patent No. 5,806,803 discloses a heat pipe network that is constructed from formed and straight heat pipes connected together with a highly 20 conductive material, such as Grafoil, that is used as an interface gasket. The heat pipe network is interconnected to subnadir and auxiliary panels, and thermally couples to north and south radiator panels. The electronic components are mounted to heat pipes on panels attached to the main spacecraft radiator panels. The heat pipes transfer the thermal energy to the radiator panels where it is radiated into space.
25 Previous satellites developed by the assignee of the present invention have used north to south coupled matrix heat pipes with north to south crossing heat pipes external of any panels and used an outboard face of the radiator panels as the interface. The heat pipe matrix comprises generally horizontal and vertical interconnected single heat pipes that remove heat from heat generating equipment (payload) on the spacecraft.
According to the invention, there is provided heat dissipating apparatus, for use on a spacecraft comprising one or more panels that have a heat radiating surface and heat generating elements disposed thereon, comprising:
a heat pipe system comprising a plurality of mono-layer dual-bore heat pipes coupled to the panel that remove heat from the heat generating elements disposed opposite to the mono-layer dual bore heat pipes.
The invention provides improved heat dissipating apparatus for use on a spacecraft.
5 In particular, the system of the invention improves the ability to dissipate heat generated onboard the spacecraft in comparison to previously used systems.
Each dual bore heat pipe preferably comprises two adjacent bores. The heat pipes may be disposed on inner surfaces of the panels, or between inner and outer surfaces of the panels. 10 Heat generating elements, such as amplifiers, command and control computers and instruments, and the like, are disposed on surfaces of the panels opposite to the dual bore heat pipes. The mono-layer dual bore heat pipe may be advantageously shaped and routed to provide improved cooling. The dual-bore heat pipes provide an excellent thermal interface for equipment mounting and provide for redundancy.
15 The heat dissipating apparatus provides for improved performance (heat rejection capacity). The heat dissipating apparatus reduces the overall mass of the panels, reduces costs of manufacturing the panels, and reduces the amount of time required to manufacture the panels.
The mono-layer heat pipes employed in the heat dissipating apparatus have reduced 20 thermal resistance compared with prior matrix heat pipe structures developed by the assignee of the present invention. The heat dissipating apparatus uses high reliability dual bore heat pipes and permits a simple and flexible heat pipe layout. The heat dissipating apparatus minimizes the number of heat pipes employed on the spacecraft by using long continuous heat pipes.
- The various features and advantages of the present invention may be more readily understood with reference to the following detailed description taken in conjunction with
the accompanying drawings, wherein like reference numerals designate like structural elements, and in which: 30 Fig. 1 illustrates a spacecraft employing exemplary heat dissipating apparatus in accordance with the principles of the present invention;
Fig. 2 illustrates a partial cross sectional view of a spacecraft radiator panel containing exemplary heat dissipating apparatus in accordance with the principles of the present invention; and Fig. 3 illustrates a plan view of a portion of an exemplary spacecraft panel 5 employing exemplary heat dissipating apparatus in accordance with the principles of the present invention.
Referring to the drawing figures, Fig. 1 illustrates a spacecraft 20 employing an exemplary embodiment of heat dissipating apparatus 10 in accordance with the principles 10 of the present invention. The spacecraft 20 typically has six outermost panels 22 which each have outer and inner surfaces 23a, 23b or sides 23a, 23b. The outer surfaces 23a comprise heat radiating surfaces 23a while the inner surfaces 23b comprise equipment mounting surfaces 23b.
The spacecraft 20 thus has six possible radiating surfaces, which include the outer 15 or outward-facing surfaces of the six outermost panels 22. The radiating surfaces 23a are designated in Fig. 1 as a north-facing surface "A", a south-facing surface "B", an east facing surface "C", a west-facing surface "D", an earth-facing surface "E" and an aft-facing or anti-earth-facing surface "F". The spacecraft 20 has one or more deployable solar arrays 23, one of which is shown mounted to the northfacing radiating panel 22.
20 The spacecraft 20 has one or more equipment panels 23b or surfaces 23b on which heat generating equipment 11 is secured. In the exemplary spacecraft 20 shown in Fig. 1, inward-facing surfaces of the north and south panels 22 are used as equipment mounting panels 23b, although others may be readily employed. The heat generating equipment 11 is typically disposed on the inward facing surfaces of the panels 22. The outward facing 25 surfaces of the panels 22 radiate heat generated by the heat generating equipment 11 into space. Some or all of the outward- facing surfaces 22 of the spacecraft 20 may be used as heat radiating surfaces 23a. Such heat radiating surfaces 23a dissipate heat from the heat generating components 11, or payload, (such as communication systems, control systems, 30 electronic instruments, heat generating components, and amplifiers, and the like) disposed on the spacecraft 20.
The heat dissipating apparatus 10 in accordance with the present invention will now generally be described. As was mentioned above, each of the panels 22 have outer and
inner surfaces 23a, 23b or sides 23a, 23b. In accordance with the principles of the present invention, one or more dual-bore heat pipes 13, and typically a plurality of dual-bore heat pipes 13, are disposed in a single layer (sandwiched) between the respective outer and inner surfaces 23a, 23b of the panel 22. For drawing clarity, only heat pipes 13 associated 5 with the north-facing surface "A" are shown in Fig. l, and the outer heat radiating surface 23a has been removed to show the arrangement of the heat pipes 13.
The one or more heat pipes 13 are preferably embedded between the outer and inner surfaces 23a, 23b. However, in certain, applications, the heat pipes 13 may be mounted to the inner or equipment mounting surfaces 23b. An enlarged partial cross 10 sectional view illustrating details of exemplary heat dissipating apparatus 10 is shown to Fig. 2.
More particularly, Fig. 2 illustrates a cross sectional view of the exemplary heat dissipating apparatus 10 shown in Fig. 1. The heat dissipating apparatus 10 comprises a mono-layer (single layer) dual-bore heat pipe system 10 for use in or on equipment-radiator 15 panels 22 of the spacecraft 20. The heat dissipating apparatus 10 comprises one or more (preferably a plurality) mono-layer dual bore heat pipes 13 that comprise two adjacent heat pipes 13a, 13b. Multiple heat pipes 13 are used to more efficiently couple heat out of each of the respective heat generating elements 11.
The mono-layer dual bore heat pipes 13 may be disposed on the inner surface 22b, 20 or as is shown in Fig. 2, disposed between the outer and inner surfaces 23a, 23b of the panel 22. Typically, high density core material 15 is disposed in the space between adjacent heat pipes 13. Heat generating elements 11, such as a traveling wave tube (TOOT) amplifier 11 having one or more mounting feet 14, channel amplifiers lla, or power amplifiers 1 lb, for example, are disposed on (secured to) the innerfacing surface 23b of 25 the panel 22 opposite to the mono-layer dual bore heat pipe 13.
- Referring now to Fig. 3, it illustrates a plan view of a portion of an exemplary spacecraft panel 22 employing exemplary heat dissipating apparatus 10 in accordance with the principles of the present invention. One half of a complete panel 22 is shown in Fig. 3.
The other half of the panel 22 is a mirror image of the panel 22 illustrated in Fig. 3. The 30 complete panel 22 has the plurality of dual bore heat pipes 13 configured as shown in Fig. 1. The panel 22 is shown having a plurality of traveling wave tube amplifiers 11, a plurality of channel amplifiers (CAMP) 1 la, and a plurality of power amplifiers (AMP) 1 lb disposed on the inner-facing surface 23b of the panel 22.
The heat dissipating apparatus 10 includes three U-shaped dual bore heat pipes 13 that are disposed within the panel 22 adjacent to the traveling wave tube amplifiers 11 and channel amplifiers 1 la. The illustrated dual bore heat pipes 13 are coupled to respective other halves of the dual bore heat pipes 13 in the mirrored half of the panel 22. These three 5 dual bore heat pipes 13 share heat with each other. These three dual bore heat pipes 13 thus couple heat dissipated by the traveling wave tube amplifiers 11 and channel amplifiers 11 a and coupled it to the outer surface 23a of the panel 22 where it is radiated into space.
The heat dissipating apparatus 10 includes two U-shaped dual bore heat pipes 13 that are disposed within the panel 22 adjacent to the power amplifiers 1 lb. These two dual 10 bore heat pipes 13 share heat with each other. These two dual bore heat pipes 13 thus couple heat dissipated by the power amplifiers 1 lb and coupled it to the outer surface 23a of the panel 22 where it is radiated into space.
Again, all of the respective dual bore heat pipes 13 are located in a single layer, which may be sandwiched between the outer and inner surfaces 23a, 23b of the panel 22 or 15 disposed on the inner surface 23b of the panel 22. The U-shaped arrangement of dual bore heat pipes 13 creates two thermal zones that are optimized to remove heat from the traveling wave tube amplifiers 11 and channel amplifiers lla, and from the power amplifiers 1 lb, respectively. The mono-layer dual bore heat pipes 13 have a smaller bore than a single heat pipe sized to remove the same amount of heat. This provides a better 20 thermal interface for equipment mounting. The dual bore heat pipes 13 also provide for redundancy and better cooling than single-bore heat pipes having comparable heat removal capability. The heat dissipating apparatus 10 described above was analytically modeled by the present inventors. Model assumptions are as follows. Each section of the panel 22 (i.e., 25 the portion of the complete panel 22 shown in Fig. 3) is 30 inches wide by 66 inches long, modeled in detail to be 3 inch by 3 inch nodes, 220 per panel 22. Baseline matrix model boundary conditions were adjusted to yield 0.184 watts/in2 heat rejection for a spacecraft 20 with no crossing heat pipes. Data are shown in comparison Table 1. The heat dissipation represents 110 watts RF output for each operative Ku-band traveling wave tube 30 amplifier 11 (68% efficiency) with 0.9 dB output loss.
The thermal capacities of the heat dissipating apparatus 10 was determined by ratioing the overall dissipation of the panel 22 until the heat pipe temperature associated with the heat pipes 13 that remove heat from the power amplifiers 11 b was equal to 48 C.
The mass presented represents only heat pipes 13, high density core material 15, adhesive and spacers (not shown). The structural mass of the complete panel 22 is not included.
Comparison Table 1 Config. Heat pipes Heat pipe Mass/area Dissipation Dissipation (ka/m2) mass (ka) (k /m2) mass (ka/kW) /area (w/in2) dualbore 11 dBlaterals, 6.83 5.34 18.9 0.184 baseline 10 matrix, 1 " 3 dB headers panel single-bore 11 sBlaterals, 3.92 3.06 11.0 0.179 baseline 3 sB headers (includes 15 matrix, 1" spacer mass) panel mono-layer, S dB heat pipes 3.97 3.10 1 1.9 0.169 O.S" panel Advantages of the present invention are shown in comparison Table 1. A single-
bore matrix layout provides for a mass savings of approximately 8 kg for a 1000 watt thermal dissipation compared to a baseline dual-bore layout. The single-bore matrix layout requires 5% additional radiator area compared to the baseline layout. The single-bore 25 matrix layout preserves a one-inch panel interface currently used by the assignee of the present invention.
The mass savings resulting from a layout using the mono-layer dual bore heat pipes 13 is approximately 7 kg for a 1000 watt thermal dissipation compared to the baseline layout. While the mass savings is slightly less for the mono-layer design, the single bore 30 matrix configuration does not maintain a redundancy heat pipe configuration.
The thickness of the panel layout, modeled using the mono-layer dual bore heat pipes 13 is 0.5 inches. The mono-layer layout requires modification for different payloads.
If the area of the panels 22 is a constraint (the mass of the panels is not considered), the
layout using mono-layer dual bore heat pipes 13 provides a mechanism to reduce both heat pipe mass and radiating area.
Thus, heat dissipating apparatus comprising a mono-layer dual-bore heat pipe for use in or on equipment and radiator panels of a spacecraft has been disclosed. It is to be 5 understood that the above-described embodiment is merely illustrative of some of the many specific embodiments that represent applications of the principles of the present invention.
Clearly, numerous and other arrangements can be readily devised by those skilled in the art without departing from the scope of the invention.
Claims (7)
1. Heat dissipating apparatus, for use on a spacecraft comprising one or more panels that have a heat radiating surface and heat generating elements disposed thereon, 5 comprising: a heat pipe system comprising a plurality of mono-layer dual-bore heat pipes coupled to the panel that remove heat from the heat generating elements disposed opposite to the mono-layer dual bore heat pipes.
10
2. The apparatus claimed in Claim 1 wherein the mono-layer dual-bore heat pipes
are disposed between outer and inner surfaces of the one or more panels.
3. The apparatus claimed in Claim 1 wherein the mono-layer dual-bore heat pipes are disposed on inner surfaces of the one or more panels.
4. The apparatus claimed in any preceding Claim wherein the heat generating elements are selected from the group consisting of traveling wave tube amplifiers, channel amplifiers and power amplifiers.
20
5. The apparatus claimed in any preceding Claim wherein the mono-layer dual bore heat pipe comprises two adjacent heat pipes disposed in a single layer.
6. The apparatus claimed in any preceding Claim wherein the heat pipe system comprises a plurality of U-shaped dual-bore heat pipes.
7. The apparatus claimed in Claim 6 wherein the plurality of U-shaped dual-bore heat pipes are disposed adjacent to each other adjacent the base of each U so that the.
plurality of heat pipes share heat with each other.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US66619700A | 2000-09-21 | 2000-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0122171D0 GB0122171D0 (en) | 2001-10-31 |
| GB2369882A true GB2369882A (en) | 2002-06-12 |
Family
ID=24673222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0122171A Withdrawn GB2369882A (en) | 2000-09-21 | 2001-09-13 | A plurality of two adjacent heat pipes in a single layer for equipment radiator panels. |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2002162180A (en) |
| FR (1) | FR2815935A1 (en) |
| GB (1) | GB2369882A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1736042A2 (en) * | 2004-03-12 | 2006-12-27 | Powerwave Technologies, Inc. | Rf power amplifier assembly with heat pipe enhanced pallet |
| US10780998B1 (en) | 2017-03-22 | 2020-09-22 | Space Systems/Loral, Llc | Spacecraft design with multiple thermal zones |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015038396A (en) * | 2012-12-21 | 2015-02-26 | 古河電気工業株式会社 | Heat sink |
| CN108448432A (en) * | 2018-05-21 | 2018-08-24 | 江含飞 | A kind of electric automobile high-voltage controller distribution box |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0687627A1 (en) * | 1994-06-15 | 1995-12-20 | Space Systems / Loral, Inc. | Power enhancement techniques for high power satellites |
| EP0776827A1 (en) * | 1995-11-30 | 1997-06-04 | HE HOLDINGS, INC. dba HUGHES ELECTRONICS | Heat pipe network |
| GB2315854A (en) * | 1996-07-31 | 1998-02-11 | Matra Marconi Space Uk Ltd | Deployable radiators for spacecraft |
| US5730211A (en) * | 1996-01-22 | 1998-03-24 | Lockheed Martin Corporation | Apparatus and method for operating a heat pipe panel assembly |
-
2001
- 2001-08-28 FR FR0111185A patent/FR2815935A1/en not_active Withdrawn
- 2001-09-04 JP JP2001266738A patent/JP2002162180A/en active Pending
- 2001-09-13 GB GB0122171A patent/GB2369882A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0687627A1 (en) * | 1994-06-15 | 1995-12-20 | Space Systems / Loral, Inc. | Power enhancement techniques for high power satellites |
| EP0776827A1 (en) * | 1995-11-30 | 1997-06-04 | HE HOLDINGS, INC. dba HUGHES ELECTRONICS | Heat pipe network |
| US5730211A (en) * | 1996-01-22 | 1998-03-24 | Lockheed Martin Corporation | Apparatus and method for operating a heat pipe panel assembly |
| GB2315854A (en) * | 1996-07-31 | 1998-02-11 | Matra Marconi Space Uk Ltd | Deployable radiators for spacecraft |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1736042A2 (en) * | 2004-03-12 | 2006-12-27 | Powerwave Technologies, Inc. | Rf power amplifier assembly with heat pipe enhanced pallet |
| EP1736042A4 (en) * | 2004-03-12 | 2010-06-02 | Powerwave Technologies Inc | Rf power amplifier assembly with heat pipe enhanced pallet |
| US10780998B1 (en) | 2017-03-22 | 2020-09-22 | Space Systems/Loral, Llc | Spacecraft design with multiple thermal zones |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2815935A1 (en) | 2002-05-03 |
| GB0122171D0 (en) | 2001-10-31 |
| JP2002162180A (en) | 2002-06-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |