JP2002046700A - Spacecraft heat dissipation apparatus using heat pipe including medium temperature working fluid - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation apparatus using a heat pipe network including medium temperature working fluid of a cooling system in an spacecraft or an artificial satellite. SOLUTION: The heat dissipation apparatus is constituted of at least a heat pipe network 13 including the medium temperature working fluid such as toluene. Toluene base heat pipes 14, 15 as heat pipe networks 13 including the medium temperature working fluid efficiently dissipate a relatively high working temperature. That is, the toluene base heat pipes efficiently dissipate heat led from a heat source operating in a relatively high temperature working temperature such as in a temperature range from +80 deg.C to +180 deg.C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of satellites and spacecraft, and more particularly to a cooling system for spacecrafts and satellites, which uses a network of heat pipes containing a medium temperature working fluid. To a heat dissipating device.

[0002]

BACKGROUND OF THE INVENTION The assignee of the present invention manufactures and deploys spacecraft and geostationary and low earth orbit satellites. Such spacecraft have heat pipes and are used to dissipate heat from components and subsystems that generate heat. Heat pipes transfer thermal energy from the heat-generating components and subsystems to spacecraft cooling panels that dissipate into space. For example, as a reference material for a conventional spacecraft radiator panel,
U.S. Pat. No. 3,749,156 to etcher, U.S. Pat. No. 5,351,746 to Mackey, U.S. Pat. No. 5,806,803 to Watts, and the like are disclosed.

[0003]

Ammonia heat pipes, often used in early spacecraft technology, are used to transfer and disperse heat from heat sources, such as power booths and RF equipment, and are used at relatively low temperatures. That is, -20 ° C to +70
Operates in the temperature range. An environment exceeding the above temperature, which corresponds to an environment exceeding the operating range of the conventional ammonia heat pipe,
That is, in order to dissipate the heat extracted from the heat source operating in the temperature range of + 80 ° C. to + 180 ° C., the initial technology used a large heat sink to avoid the heat. Such massive heat sinks add unnecessary weight to the spacecraft and are relatively inefficient. Accordingly, it is an object of the present invention to provide a heat dissipation device that uses a heat pipe network containing a medium temperature working fluid, which is included in a spacecraft and a satellite cooling system.

[0004]

SUMMARY OF THE INVENTION To achieve the above and other objects, the present invention provides a heat dissipation device for use in spacecraft and satellites. Heat dissipation device, medium temperature working fluid,
For example, it is composed of one or more heat pipe networks containing a fluid such as toluene. The heat release device comprises a network of heat pipes having a medium temperature working fluid, wherein the toluene-based heat pipes are provided with heat supplied from a heat source operating at a relatively high operating temperature, typically in the temperature range of + 80C to + 180C. To dissipate efficiently.

[0005] Toluene-based heat pipe networks dissipate heat through spacecraft cooling panels that radiate heat into space. The toluene-based heat pipe network efficiently dissipates heat generated by components operating at temperatures above the operating temperature of conventional ammonia heat pipes. The toluene-based heat pipe network provided by the present invention has not heretofore been used in the spacecraft field. The present invention contributes significantly to weight reduction over conventional heat sink methods.

As described above, the present invention uses a heat pipe having a medium temperature working fluid, and is used at a relatively high temperature, that is, at + 80 ° C.
Transports and disperses heat from equipment operating in the range of -180C. Heat dissipation from equipment operating at elevated temperatures using toluene-based heat pipes greatly enhances and improves the efficiency of heat rejection into space via radiative heat transfer from the spacecraft surface.

[0007]

BRIEF DESCRIPTION OF THE DRAWINGS The various features and uses of the present invention will be readily understood by reference to the following detailed description, taken in conjunction with the accompanying drawings, including reference numerals indicating structural materials and the like. Referring to the accompanying drawings, FIG. 1 shows a heat dissipation device 10 consistent with the principles of the present invention, an exemplary spacecraft cooling system 10 used in a three-axis stable spacecraft 30 or satellite 30.
Is formed. An exemplary heat dissipating device 10 or spacecraft cooling system 10 includes first and second cooling panels 11a, 11b, each panel having one or more cooling panels.
A heat pipe network 13 having at least one heat pipe group 14, 15;
Is formed. The locations of the cooling panels 11a, 11b are exemplary and may be on any surface of the spacecraft 30. For example, the cooling panels 11a and 11b are east and west,
North and south, and / or stern and earth side or spacecraft 3
0 may be arranged on the surface.

In the first embodiment of the invention shown in FIG. 1, a heat pipe network 13 is sandwiched between the inner and outer panel surfaces 17, 18 of each cooling panel 11a, 11b. The honeycomb core material 24 is formed on the inner and outer panel surface layers 1.
7, 18 and surround each heat pipe network 13 arranged therebetween. The honeycomb core material 24 thermally and structurally bridges the heat pipe network 13 and the facing layers 17 and 18 facing each other.

Each of the heat pipe networks 13 has, for example, an array based on the first and second heat pipe groups 14, 15 or the combination 14, 15 of the first and second heat pipe groups. And placed in the heat transfer material. Heat pipe group 1
4 (or the horizontal heat pipe group 14) is the second set (or the vertical heat pipe group 1) of the heat pipe group 15.
5) It is arranged almost vertically. In the first example,
The heat dissipating component 25 is located adjacent to the first set of lateral heat pipes 14 at the first and second cooling panels 11a,
11b is mounted on the inner panel surface layer 17. A second set of vertically oriented heat pipes 15 is used to efficiently distribute the heat conducted from the heat dissipating components 25 to each outer panel surface 18.

FIG. 2 is a detailed view of a second exemplary embodiment of the heat dissipation device 10 of the present invention. In the second embodiment, as shown in FIG. 2, the heat pipe network 13 is fixed to the outer surface layer of the cooling panels 11a and 11b. In the second embodiment, the heat dissipating component 25 is fixed to the inner surface layer of the cooling panels 11a, 11b (shown on the back surface of the cooling panel 11a in FIG. 2).

The heat pipe network 13 contains a medium temperature working fluid such as, for example, toluene. Other examples of medium temperature working fluids include, for example, methanol, water, butane, heptane, pentane, and the like. The heat dissipation device 10 includes a medium temperature working fluid, and the toluene-based heat pipe network 13 efficiently dissipates the heat conducted from the heat dissipation component 25. The heat dissipating component 25 has a relatively high operating temperature, ie + 80 ° C.
Includes a heat source operating in the temperature range of ~ 180C.

The toluene-based heat pipe network 13 dissipates heat to the outer panel surface layer 18 of the cooling panels 11a and 11b that radiates heat to outer space. In this way, the toluene-based heat pipe network 13 efficiently dissipates the heat generated by components 25 whose operating temperatures exceed the operating temperature range of conventional ammonia heat pipes.

[0013]

The present invention achieves a significant weight reduction over the conventional heat sink method using an enormous heat sink described in the background section. In addition, the use of a toluene-based heat pipe network 13 allows the present invention to dissipate heat conducted from components 25 that operate at higher temperatures than conventional heat pipe systems. As a result, the thermal waste into space via thermal radiation from the spacecraft surface is improved and very efficient.

Thus, the heat dissipating device uses a network of heat pipes that are included in the spacecraft or satellite cooling system and contain the disclosed medium temperature working fluid. The above embodiment is
It is to be understood that some of several distinct embodiments have been described, merely as an application of the principles of the present invention. Obviously, multiple and other configurations can be devised without difficulty by those skilled in the art without departing from the scope of the invention.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of a heat dissipation device forming a spacecraft cooling system used for a spacecraft or an artificial satellite having a three-axis stable structure.

FIG. 2 is a view showing a detailed example of a heat radiator according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Cooling system 11a, 11b Cooling panel 13 Heat pipe network 14, 15 Heat pipe 17 Inner panel surface layer 18 Outer panel surface layer 24 Honeycomb core material 25 Heat dissipation component 30 Spacecraft or satellite

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor John Luong United States of America 94086 Sunnyvale No. 5 Morse Avenue 624 (72) Inventor Lenny Row United States of America 94010 Hillsborough Black Mount Road 1595

Claims (15)

[Claims] 1. A heat dissipating device for use in a spacecraft, comprising: a first and second cooling panel; and one or more cooling panels connected to the first and second cooling panels having a medium temperature working fluid. A heat dissipation device, comprising: a heat pipe group. 2. The heat dissipation device according to claim 1, wherein the medium temperature working fluid is toluene. 3. The heat dissipation device according to claim 1, further comprising a heat dissipation component thermally connected to the heat pipe group. 4. A network of first and second heat pipes, wherein the group of one or more heat pipes comprises a combination of first and second heat pipe groups arranged as a substrate and in a heat transfer material. The heat dissipation device according to claim 1, wherein the heat dissipation device comprises: 5. The heat dissipation device of claim 4, wherein the first set of heat pipes is substantially orthogonal to the second set of heat pipes. 6. The first and second cooling panels are inner and outer panel surfaces, one or more heat pipe groups arranged between the inner panel surface and the outer panel surface, and the inner panel surface. The heat dissipating apparatus according to claim 1, comprising a panel having a honeycomb core material arranged so as to surround the heat pipe group between the outer panel surface layers. 7. The first and second cooling panels include: an inner and outer panel surface; a honeycomb core disposed between the inner and outer panel surfaces; and a selected one of the inner and outer panel surfaces. The heat dissipating device according to claim 1, comprising one or more heat pipe groups mounted on the heat pipe. 8. The heat dissipation device according to claim 1, wherein the plurality of heat pipe groups are connected to each cooling panel. 9. The heat dissipation device according to claim 8, wherein the plurality of heat pipe groups are disposed between an inner panel and an outer panel. 10. The heat dissipation device according to claim 8, wherein the plurality of heat pipe groups are mounted on a selected one of an inner panel and an outer panel. 11. The honeycomb core material comprises a heat pipe network 13
7. The heat dissipating device according to claim 6, wherein the surface layer facing the substrate is thermally and structurally connected. 12. The heat dissipating device according to claim 6, wherein the heat dissipating component is thermally connected to inward surfaces of the inner panel and the outer panel surface. 13. The heat-dissipating component may be at + 80 ° C. to +18.
The heat dissipating device according to claim 1, wherein the device operates at a temperature of 0 ° C. 14. The heat-dissipating component is between + 80 ° C. and +18.
The heat dissipating device according to claim 2, wherein the device operates at 0 ° C. 15. The heat dissipating component may be between + 80 ° C. and +18.
The heat dissipating device according to claim 6, wherein the device operates at 0 ° C.