JPH01233796A - Radiator - Google Patents
RadiatorInfo
- Publication number
- JPH01233796A JPH01233796A JP6119988A JP6119988A JPH01233796A JP H01233796 A JPH01233796 A JP H01233796A JP 6119988 A JP6119988 A JP 6119988A JP 6119988 A JP6119988 A JP 6119988A JP H01233796 A JPH01233796 A JP H01233796A
- Authority
- JP
- Japan
- Prior art keywords
- fins
- heat
- piezoelectric fan
- fan unit
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は放熱器に関し、特にフィンを有し、たとえば
パワートランジスタなどのように発熱する電子部品や電
子機器などからの熱を吸収し放熱するための放熱器に関
する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a heat sink, and in particular, has fins and absorbs and radiates heat from electronic components and devices that generate heat, such as power transistors. Regarding radiators for
（従来技術）
第４図はこの発明の背景となる従来の放熱器の一例を示
す斜視図である。(Prior Art) FIG. 4 is a perspective view showing an example of a conventional heat radiator, which is the background of the present invention.
この放熱器１には、たとえばパワートランジスタなどの
ように発熱する電子部品などが取り付けられる。そして
、その電子部品などから発する熱が、放熱器１に吸収さ
れそのフィン２から発散される。The heat sink 1 is attached with electronic components that generate heat, such as power transistors. Heat generated from the electronic components is absorbed by the heat radiator 1 and radiated from the fins 2.
（発明が解決しようとする問題点）
ところが、このような従来の放熱器では、熱がフィンの
周囲にこもってしまうので、効率よく放熱することがで
きない。(Problems to be Solved by the Invention) However, in such a conventional heat radiator, heat is trapped around the fins, so that heat cannot be efficiently radiated.
それゆえに、この発明の主たる目的は、効率よく放熱す
ることができる、放熱器を提供することである。Therefore, the main object of the present invention is to provide a heat radiator that can efficiently radiate heat.
（問題点を解決するための手段）
この発明は、複数のフィンを有するヒートシンクと、フ
ィン間に配置される圧電ファンユニットとを含む、放熱
器である。(Means for Solving the Problems) The present invention is a heat radiator including a heat sink having a plurality of fins and a piezoelectric fan unit disposed between the fins.
（作用）
フィンから発散される熱が、圧電ファンユニットによっ
て拡散される。(Function) Heat emitted from the fins is diffused by the piezoelectric fan unit.
（発明の効果）
この発明によれば、フィンの周囲に熱がこもらないので
、効率よく放熱することができる。(Effects of the Invention) According to the present invention, heat is not accumulated around the fins, so that heat can be efficiently dissipated.
この発明の上述の目的、その他の目的、特徴および利点
は、図面を参照して行う以下の実施例の詳細な説明から
一層明らかとなろう。The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.
（実施例）
第１図はこの発明の一実施例を示す平面図である。この
放熱器１０は、たとえば６枚のフィン１２ａを有するヒ
ートシンク１２を含む。なお、これらのフィン１２ａは
、互いに間隔を隔てて平行に形成されている。(Embodiment) FIG. 1 is a plan view showing an embodiment of the present invention. This heat sink 10 includes a heat sink 12 having, for example, six fins 12a. Note that these fins 12a are formed parallel to each other at intervals.
さらに、６枚のフィン１２ａの間には、それぞれ、圧電
ファンユニット１４が配置される。したがって、この実
施例では、５つの圧電ファンユニット１４が設けられる
ことになる。Further, a piezoelectric fan unit 14 is arranged between each of the six fins 12a. Therefore, in this embodiment, five piezoelectric fan units 14 are provided.
圧電ファンユニット１４は、特に第２図に示すように、
矩形板状の音片１６を含み、この音片１６の両生面には
、それぞれ、圧電素子１８が固着されている。さらに、
音片１６の一端部には、帯状のブレード２０の一端部が
固着されている。In particular, the piezoelectric fan unit 14, as shown in FIG.
It includes a rectangular plate-shaped sound bar 16, and a piezoelectric element 18 is fixed to each of the two sides of the sound bar 16. moreover,
One end of a band-shaped blade 20 is fixed to one end of the vibrating bar 16 .
そして、各圧電ファンユニット１４は、音片１６の他端
部が支持棒２２で支持板２４に取り付けられることによ
って、ヒートシンク１２の各フィン１２ａの間で片持支
持されている。Each piezoelectric fan unit 14 is cantilever-supported between each fin 12a of the heat sink 12 by attaching the other end of the vibrating bar 16 to a support plate 24 with a support rod 22.
この放熱器１０にたとえばパワートランジスタなどのよ
うに発熱する電子部品などを取り付ければ、その電子部
品から発する熱が吸収されフィン１２ａから発散されさ
らにその熱が圧電ファンユニット１４で拡散される。そ
のため、フィン１２ａの周囲には熱がこもらなく、効率
よく放熱することができる。If an electronic component that generates heat, such as a power transistor, is attached to the heat sink 10, the heat generated by the electronic component is absorbed, radiated from the fins 12a, and further diffused by the piezoelectric fan unit 14. Therefore, heat does not accumulate around the fins 12a and can be efficiently radiated.
第３図は第１図に示す実施例の変形例を示す平面図であ
る。この実施例では、特に、ヒートシンク１２に７枚の
フィン１２ａが形成されている。FIG. 3 is a plan view showing a modification of the embodiment shown in FIG. 1. In this embodiment, in particular, seven fins 12a are formed on the heat sink 12.
さらに、圧電ファンユニットとして音叉型の音片１６を
有する音叉型の圧電ファンユニット１４が３つ用いられ
ている。Furthermore, three tuning fork type piezoelectric fan units 14 having tuning fork type sound pieces 16 are used as piezoelectric fan units.
この実施例でも、圧電ファンユニット１４によってフィ
ン１２ａの周囲の熱を拡散することができるので、フィ
ン１２ａの周囲に熱がこもらなく、効率よく放熱するこ
とができる。この実施例のようにヒートシンク１２のフ
ィン１２ａの数や圧電ファンユニット１４の形状を任意
に変更してもよい。In this embodiment as well, the heat around the fins 12a can be diffused by the piezoelectric fan unit 14, so that heat does not accumulate around the fins 12a and can be efficiently radiated. As in this embodiment, the number of fins 12a of the heat sink 12 and the shape of the piezoelectric fan unit 14 may be changed arbitrarily.
なお、上述の各実施例では、圧電ファンユニット１４に
ブレード２０が設けられているが、ブレード２０は設け
られなくてもよい。また、圧電ファンユニット１４は、
すべてのフィン１２ａの間に設ける必要はない。Note that in each of the embodiments described above, the piezoelectric fan unit 14 is provided with the blade 20, but the blade 20 may not be provided. Moreover, the piezoelectric fan unit 14 is
It is not necessary to provide between all the fins 12a.
さらに、圧電ファンユニット１４を支持するための支持
板２４は、ヒートシンク１２に固着されてもよく、ある
いは、このような支持板２４を設けずに圧電ファンユニ
ット１４をヒートシンク１２に取り付けてもよい。Further, a support plate 24 for supporting the piezoelectric fan unit 14 may be fixed to the heat sink 12, or the piezoelectric fan unit 14 may be attached to the heat sink 12 without providing such a support plate 24.
第１図はこの発明の一実施例を示す平面図である。
第２図は第１図に示す実施例の要部斜視図である。
第３図は第１図に示す実施例の変形例を示す平面図であ
る。
第４図はこの発明の背景となる従来の放熱器を示す斜視
図である。
゛ 図において、１０は放熱器、１２はヒートシンク
、１２ａはフィン、１４は圧電ファンユニットを示す。
特許出願人 株式会社村田製作所
代理人 弁理士 岡 １） 全 啓
第４図
第１ ｒｔ １０FIG. 1 is a plan view showing an embodiment of the present invention. FIG. 2 is a perspective view of essential parts of the embodiment shown in FIG. 1. FIG. 3 is a plan view showing a modification of the embodiment shown in FIG. 1. FIG. 4 is a perspective view showing a conventional heat radiator which is the background of this invention. In the figure, 10 is a heat sink, 12 is a heat sink, 12a is a fin, and 14 is a piezoelectric fan unit. Patent Applicant Murata Manufacturing Co., Ltd. Agent Patent Attorney Oka 1) Zen Kei Figure 4 1 rt 10
Claims (1)
ン間に配置される圧電ファンユニットを含む、放熱器。A heat sink including a heat sink having a plurality of fins and a piezoelectric fan unit disposed between the fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6119988A JPH01233796A (en) | 1988-03-14 | 1988-03-14 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6119988A JPH01233796A (en) | 1988-03-14 | 1988-03-14 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01233796A true JPH01233796A (en) | 1989-09-19 |
Family
ID=13164271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6119988A Pending JPH01233796A (en) | 1988-03-14 | 1988-03-14 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01233796A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5335143A (en) * | 1993-08-05 | 1994-08-02 | International Business Machines Corporation | Disk augmented heat transfer system |
| US7321184B2 (en) * | 2005-08-09 | 2008-01-22 | Intel Corporation | Rake shaped fan |
| WO2009034956A1 (en) * | 2007-09-14 | 2009-03-19 | Murata Manufacturing Co., Ltd. | Cooling apparatus |
| US20090218074A1 (en) * | 2008-03-02 | 2009-09-03 | Mpj Lighting, Llc | System and method for active cooling utilizing a resonant shear technique |
| WO2009116455A1 (en) * | 2008-03-21 | 2009-09-24 | 株式会社村田製作所 | Piezoelectric fan and cooling device employing said fan |
| US20100139306A1 (en) * | 2008-12-06 | 2010-06-10 | Krenik Thomas R | Air cycle heat pump techniques and system |
| US20110063800A1 (en) * | 2009-09-14 | 2011-03-17 | Kwan Woo Park | Heat dissipating device |
| US20110122582A1 (en) * | 2009-11-20 | 2011-05-26 | Kwan Woo Park | Heat dissipating device |
| WO2014092881A1 (en) * | 2012-12-11 | 2014-06-19 | GE Lighting Solutions, LLC | Active cooling device |
| TWI454620B (en) * | 2012-07-10 | 2014-10-01 | Hsiao Kang Ma | Magnetic-force interactive fan |
| CN105156366A (en) * | 2015-09-24 | 2015-12-16 | 南京航空航天大学 | Micro-electronic device cooling fan and working method thereof |
| US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
| US9587820B2 (en) | 2012-05-04 | 2017-03-07 | GE Lighting Solutions, LLC | Active cooling device |
| CN106574638A (en) * | 2014-08-28 | 2017-04-19 | 通用电气航空系统有限责任公司 | Air-cooling system and airflow generator |
| CN106662122A (en) * | 2014-08-25 | 2017-05-10 | 通用电气航空系统有限责任公司 | Airflow generator and array of airflow generators |
| US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6272149A (en) * | 1985-09-26 | 1987-04-02 | Ube Ind Ltd | Heat dissipation fin with piezoelectric fan |
| JPS6281736A (en) * | 1985-10-07 | 1987-04-15 | Toshiba Corp | Semiconductor device |
-
1988
- 1988-03-14 JP JP6119988A patent/JPH01233796A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6272149A (en) * | 1985-09-26 | 1987-04-02 | Ube Ind Ltd | Heat dissipation fin with piezoelectric fan |
| JPS6281736A (en) * | 1985-10-07 | 1987-04-15 | Toshiba Corp | Semiconductor device |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5335143A (en) * | 1993-08-05 | 1994-08-02 | International Business Machines Corporation | Disk augmented heat transfer system |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| US7321184B2 (en) * | 2005-08-09 | 2008-01-22 | Intel Corporation | Rake shaped fan |
| CN102543915A (en) * | 2007-09-14 | 2012-07-04 | 株式会社村田制作所 | Cooling device |
| WO2009034956A1 (en) * | 2007-09-14 | 2009-03-19 | Murata Manufacturing Co., Ltd. | Cooling apparatus |
| JP5083322B2 (en) * | 2007-09-14 | 2012-11-28 | 株式会社村田製作所 | Cooling system |
| US20090218074A1 (en) * | 2008-03-02 | 2009-09-03 | Mpj Lighting, Llc | System and method for active cooling utilizing a resonant shear technique |
| US8596337B2 (en) * | 2008-03-02 | 2013-12-03 | Lumenetix, Inc. | System and method for active cooling utilizing a resonant shear technique |
| WO2009116455A1 (en) * | 2008-03-21 | 2009-09-24 | 株式会社村田製作所 | Piezoelectric fan and cooling device employing said fan |
| CN101978171A (en) * | 2008-03-21 | 2011-02-16 | 株式会社村田制作所 | Piezoelectric fan and cooling device using piezoelectric fan |
| US8591206B2 (en) * | 2008-12-06 | 2013-11-26 | Thomas R. Krenik | Air cycle heat pump techniques and system |
| CN101749888A (en) * | 2008-12-06 | 2010-06-23 | 托马斯·R·克雷尼科 | Air cycle heat pump techniques and system |
| US20100139306A1 (en) * | 2008-12-06 | 2010-06-10 | Krenik Thomas R | Air cycle heat pump techniques and system |
| US8520383B2 (en) * | 2009-09-14 | 2013-08-27 | Lg Electronics Inc. | Heat dissipating device |
| US20110063800A1 (en) * | 2009-09-14 | 2011-03-17 | Kwan Woo Park | Heat dissipating device |
| US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
| US20110122582A1 (en) * | 2009-11-20 | 2011-05-26 | Kwan Woo Park | Heat dissipating device |
| US8520384B2 (en) * | 2009-11-20 | 2013-08-27 | Lg Electronics Inc. | Heat dissipating device |
| US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
| US9587820B2 (en) | 2012-05-04 | 2017-03-07 | GE Lighting Solutions, LLC | Active cooling device |
| US9841175B2 (en) | 2012-05-04 | 2017-12-12 | GE Lighting Solutions, LLC | Optics system for solid state lighting apparatus |
| US10139095B2 (en) | 2012-05-04 | 2018-11-27 | GE Lighting Solutions, LLC | Reflector and lamp comprised thereof |
| TWI454620B (en) * | 2012-07-10 | 2014-10-01 | Hsiao Kang Ma | Magnetic-force interactive fan |
| WO2014092881A1 (en) * | 2012-12-11 | 2014-06-19 | GE Lighting Solutions, LLC | Active cooling device |
| CN106662122A (en) * | 2014-08-25 | 2017-05-10 | 通用电气航空系统有限责任公司 | Airflow generator and array of airflow generators |
| JP2017532477A (en) * | 2014-08-25 | 2017-11-02 | ジーイー・アビエイション・システムズ・エルエルシー | Airflow generator and arrangement of airflow generators |
| CN106574638A (en) * | 2014-08-28 | 2017-04-19 | 通用电气航空系统有限责任公司 | Air-cooling system and airflow generator |
| JP2017533577A (en) * | 2014-08-28 | 2017-11-09 | ジーイー・アビエイション・システムズ・エルエルシー | Air cooling system and air flow generator |
| CN105156366A (en) * | 2015-09-24 | 2015-12-16 | 南京航空航天大学 | Micro-electronic device cooling fan and working method thereof |
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