JPS6281736A - Semiconductor device - Google Patents

Abstract

PURPOSE:To cool the respective package constituting a semiconductor device with extreme efficiency by disposing a cooling fin having a plurality of wings in the package of a semiconductor (chip) device having a large heat release amount, and simultaneously disposing a cooling fin between the wings of the cooling fin, thereby obtaining a highly efficient cooling apparatus. CONSTITUTION:The semiconductor device is composed by causing a cooling apparatus c to be adhered to the reverse side of the base 1a of a package consisting of aluminium nitride ceramics by means of an adhesive q composed of an epoxy resin, said cooling apparatus c consisting of a cooling fin 2 which has a comb-shaped cross section and is provided with four static wing f consisting of an aluminium plate-like body disposed with a predetermined spacing therebetween and in parallel with each other, and a cooling fin 3 disposed between static wings f. This fin 3 is provided with a brass dynamic wing 3c which is driven by a piezoelectric element 3b, and the heat is dissipated by applying a voltage of an appropriate frequency from a power supply line 3d to the piezoelectric element 3b (bimorph) so as to cause it to oscillate, which piezoelectric element is formed by stacking two piezoelectric bodies composed of lead titanate + lead zirconate + (alpha).

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor device, and particularly relates to a semiconductor device that generates a large amount of heat (e.g.
This invention relates to a method for cooling a package of a circuit (circuit) element.

(Technical applications of inventions and their problems) Along with advances in semiconductor technology, electronic equipment such as Q-meters and other BSB electronic devices are rapidly developing.

For example, in an electronic meter (AM), a plurality of electronic circuit packages each carrying a plurality of electronic components are usually mounted on a single printed wiring board. Since these packages generate heat, conventionally, each package was cooled at a uniform wind speed by forcing the entire printed wiring board to be cooled by blowing +n. This method differs from conventional electronic 3
It was effective on a single calculator.

However, as it becomes possible to integrate logic elements, etc. and to implement high-density mounting of electronic components, today's electronic computers often include electronic circuit packages that generate a particularly large amount of heat on printed wiring boards. Now, a new problem has arisen.

That is, in order to maintain a high heat generating component at a specified temperature or lower, it is necessary to increase the supplied air speed. However, increasing the wind speed to match the level of high-heat-generating parts causes various problems such as excessive cooling of low-heat-generating parts and the need for larger blowers, which increases noise. Ta.

Therefore, as shown in FIGS. 2(a) and 2(b), a structure is adopted in which cooling fins 12 are provided at the base of the package 11 to reduce thermal resistance. The size of the cooling fins cannot be increased indefinitely due to the structure of the parts.

Another method is to place high heat generating components and low heat generating components separately, and introduce most of the air volume from the blower into the high heat generating component rows using vertical flat roots, etc., to selectively cool the high heat generating component rows. -11840) has also been proposed, but this method still has problems such as the need for a fan and the need to align high-heating components, which imposes large restrictions on placement. It had been.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned circumstances, and aims to provide a semiconductor device equipped with a cooling device that can locally and efficiently cool the semiconductor device.

(Summary of the Invention) Therefore, in the present invention, a semiconductor (chip) S
! A plurality of yellow cooling fins are disposed in a package of a semiconductor device, and a cooling fan is disposed between the yellow cooling fins, so that the heat generated from the semiconductor device is effectively dissipated from the cooling fins. I have to.

In other words, most of the heat generated from the semiconductor chip is dissipated into the outside air through the package (base), but the fins attached to the base increase the heat dissipation area and improve heat dissipation. In order to prevent the heat radiated from the fin surface from stagnation in each yellow gate of the fin, a cooling fan is installed between each blade to release the stagnation heat to the outside air.

(Effects of the Invention) According to the present invention, it is possible to obtain an extremely highly efficient cooling device with a size comparable to that of a normal small cooling fin, and to cool individual packages constituting a semiconductor device extremely efficiently.
(Since it is possible to reduce the size of the entire device, it also eliminates the need to cool the entire electronic device and eliminates the need for a manual blower. This makes it possible to make significant improvements in terms of noise and energy savings.

Furthermore, when high heat generating components (semiconductor devices) are crowded together, an even higher heat dissipation effect can be obtained by combining the electronic device with a blower that uniformly cools the entire electronic device.

[Embodiments of the invention]

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIGS. 1(a), 1(b), and 1(C) are diagrams showing semiconductor devices according to embodiments of the present invention, respectively. (Fig. 1(b) and (C) are A-Δa3 and B-8 of Fig. 1(a), respectively.
FIG. 3 is a diagram showing a cross section. ) This semiconductor device consists of four plates made of aluminum (AΩ) arranged parallel to each other with a predetermined interval on the back side of a base 1a of a package made of aluminum nitride <AQN) ceramics. f'i consisting of body? l A cooling fan 3 disposed between a cooling W fin 2 having a comb-shaped cross section and a stator blade f;
A cold section device C consisting of 1 an adhesive q made of boxy resin
It is coated with

This cooling U1 fan 3 is equipped with a motor 113G made of a plate-like body made of Shinrayu, which is driven by a piezoelectric element 3b attached to a piezoelectric element support 3a. )
Consists of +a! By applying a voltage of an appropriate frequency from the power line 3d to the piezoelectric element 3b (bimorph) formed by stacking two E electric bodies and causing it to vibrate, the rotor blade 3C reciprocates with a sweep width of about 1 m and a frequency of about 700H2. It is designed to dissipate heat through exercise.

In addition, inside the package, as usual, the semiconductor depth 4 is fixed to the cavity part of the base 1a made of aluminum nitride (AΩN) ceramics, and the lead frame 6 and the semiconductor depth 4 are connected via the reflier 5 using the wire bonding method. After connecting the alumina (AΩ203
) A cap 1b made of ceramic is attached to the base 1a.
It is constructed by sealing with low melting point glass 7 according to the temperature.

Although the thermal resistance value (℃/W) of this semiconductor device is '1J',
The temperature when 1W of heat is generated from inside is 7Ha (℃
) was 15°C/W.

By the way, by adding aluminum fins to the commonly used alumina package, the 4m/s I! Thermal resistance fMi kl 12°C/
W r Ant, according to the present invention, the heat IIi failure equivalent to the case where 1 is reduced to 1 for the transport of large japonicus at 4 m/s (1) is actually j1.!
-r It's going to be a monkey.

The following table shows the thermal resistance values without air blowing.
Regarding the case where no equipment (cooling U1 fin, cooling M + fan) is used, the case where only cooling fins are used (Fig. 2), and the semiconductor device of the present invention, people constructed the base of the package with aluminum nitride. The results of measurements made for Shino and those made of alumina were as shown in the following table.

(G3) As is clear from this table, the semiconductor device of the present invention is small and can reduce the cold slag 1 effect with an extremely high AI rate. Therefore, high efficiency cold I'l is possible by local application as needed.

Although a bimorph was used as a driving source for the cooling fan, it goes without saying that other means may be used.

[Brief explanation of drawings]

FIGS. 1(a) to (C) are diagrams showing semiconductor devices according to embodiments of the present invention, FIG. 2(a) ++3 and <b> i,
FIG. 2 is a diagram showing a conventional semiconductor device. 1.11...Package, 1a...Base, 1b.
... Kirtsubu, 2,12... cold 7JI Finn, f...
・Shizuoka, 3... Cold 1'' 1 fan, 3a... Piezoelectric element support Rj stand, 3b... Piezoelectric element, 3C... Moving blade, 3d
...Power supply line, 4...Semiconductor component block, 5...Wire, 6...Lead frame, 7...Low melting point glass. A Figure 1 (a) a Figure 1 (b) Figure 1 (C) Figure 2 (0) Figure 2 (b)

Claims (2)

[Claims] (1) Cooling fins with a plurality of stator blades for each package for semiconductor device packages mounting electronic circuit elements, and stator blades to dissipate heat generated between the stator blades. What is claimed is: 1. A semiconductor device comprising: a cooling device including a cooling fan having rotor blades disposed between the semiconductor device and the cooling fan provided with the rotor blades; (2) Claim (1) characterized in that the stationary vanes are made of plate-shaped bodies and are arranged perpendicular to the base surface of the package and parallel to each other at predetermined intervals.
1. Semiconductor device described in Section 1.