JPH0283958A - Discrete chip cooler - Google Patents
Discrete chip coolerInfo
- Publication number
- JPH0283958A JPH0283958A JP63235003A JP23500388A JPH0283958A JP H0283958 A JPH0283958 A JP H0283958A JP 63235003 A JP63235003 A JP 63235003A JP 23500388 A JP23500388 A JP 23500388A JP H0283958 A JPH0283958 A JP H0283958A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- supplied
- cool
- board
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、計算機に使用するチップと基盤の接続実装方
法に係り、特に、チップを個別に冷却するのに好適な、
低コスト高信頼性の実装冷却装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for connecting and mounting chips and boards used in computers, and in particular, a method suitable for cooling chips individually.
This invention relates to a low-cost, highly reliable mounting cooling device.
従来、チップに可動素子を用いて冷却する方法は特開昭
６２−１４９１５８号公報で論じられている。この方式
では、バイモルフ振動子を用いて、ファンを形成し、こ
こに交流をかけることによって振動させ、チップの上面
の冷却境界層を崩して冷却効率を向上させている。Conventionally, a method of cooling a chip using a movable element is discussed in Japanese Patent Application Laid-Open No. 149158/1983. In this method, a bimorph oscillator is used to form a fan, which is vibrated by applying an alternating current to it, thereby breaking down the cooling boundary layer on the top surface of the chip and improving cooling efficiency.
同様の例は、特開昭６２−６２５４６号、特開昭５９１
５８５４１号、特開昭５９１−１５８５４２号公報等で
開示されている。Similar examples include JP-A-62-62546 and JP-A-591.
58541, Japanese Unexamined Patent Publication No. 591-158542, etc.
上記従来技術では、フィンの冷却性能についての考慮は
なされておらず、高発熱のモジュールを効率よく冷却す
るには、高速度の風を送る必要があった。しかし、高速
度の風を送るためには圧電素子による方式では限界があ
り、冷却性能に限界があった。In the above-mentioned conventional technology, no consideration is given to the cooling performance of the fins, and in order to efficiently cool a module that generates a high amount of heat, it is necessary to send high-velocity air. However, methods using piezoelectric elements have limitations in sending high-velocity air, which limits cooling performance.
本発明の目的は、発熱量の高いチップを個別に冷却する
装置を提供することにある。An object of the present invention is to provide an apparatus for individually cooling chips that generate a large amount of heat.
上記目的は、チップの冷却装置において、チップの上部
に超音波で駆動する小型冷却フィンを設けて、チップを
個別に冷却することにより解決される。The above object is achieved in a chip cooling device by providing small cooling fins driven by ultrasonic waves on top of the chips to cool the chips individually.
特に、冷却ファンに超音波で駆動するモータを使用する
ことにより騒音、ノイズ等に関して影響が小さい。In particular, by using a motor driven by ultrasonic waves for the cooling fan, the influence on noise, etc. is small.
発熱量の高いチップを個別に冷却できるので、装置全体
の冷却に要する負荷が軽減され、低コストで信頼性の高
い実装が可能となる。Since chips that generate a large amount of heat can be individually cooled, the load required to cool the entire device is reduced, allowing for low-cost and highly reliable packaging.
以下、本発明の実施例の詳細を、第１図及び第２図によ
り説明する。Hereinafter, details of embodiments of the present invention will be explained with reference to FIGS. 1 and 2.
全体は、封じられたモジュール８．冷却ハウジング７、
基板６より構成される。The whole is an enclosed module 8. cooling housing 7,
It is composed of a substrate 6.
冷却ファン１は、中央部に送風部分があり１周辺部は超
音波振動子２に挾まれるつばが設置される。超音波素子
２は、冷却ハウジング７の内部に設置される。冷却ハウ
ジング７は、モジュール８の上部に接続子１４を介して
設置される。モジュール８は接続ピン１３を介して大型
基板６に設置される。モジュール８は上部が封じ用の蓋
３と多層配線用の基板５により、内部の素子４が実装配
置される。封じ用の蓋３の材質は、高熱伝導性で、かつ
、熱膨張率の差が小さいセラミックスを用いる。封じ用
の気体は、不活性で熱伝導性に優れたヘリウムなどで封
じる。電気的接続は、半田ボール１２で行われる。The cooling fan 1 has a blowing part in the center, and a collar that is held by the ultrasonic vibrator 2 is installed around the 1 part. The ultrasonic element 2 is installed inside the cooling housing 7. Cooling housing 7 is installed on top of module 8 via connector 14 . The module 8 is installed on the large board 6 via the connection pins 13. The module 8 has a lid 3 for sealing and a board 5 for multilayer wiring at the top, on which internal elements 4 are mounted and arranged. As the material of the sealing lid 3, ceramic is used which has high thermal conductivity and has a small difference in coefficient of thermal expansion. The sealing gas is helium, which is inert and has excellent thermal conductivity. Electrical connections are made with solder balls 12.
次に１本実施例１の動作について説明する。モジュール
８には大型基板６、接続ビン１３を通して電源が供給さ
れ、モジュール基板５、半１Ｈボール１２を通して、チ
ップ４に電力が供給される。Next, the operation of the first embodiment will be explained. Power is supplied to the module 8 through the large board 6 and the connection bin 13, and power is supplied to the chip 4 through the module board 5 and the half 1H ball 12.
チップ４で発生した電力はチップ４の内部で熱に変わり
、大量の熱が発生する。この熱は、チップ１の裏面、あ
るいは、接続面を通して外部へ放散される。チップ４の
裏面には蓋８が設置され、これを介して熱が外部へ移送
される。The electric power generated by the chip 4 is converted into heat inside the chip 4, and a large amount of heat is generated. This heat is dissipated to the outside through the back surface of the chip 1 or the connection surface. A lid 8 is installed on the back side of the chip 4, and heat is transferred to the outside through this lid.
冷却ハウジング７に配置されたフィン１は、超音波素子
２の振動に対応して回転する。その回転に応じて、風が
チップの上部へ供給される。大型基板６の上部には、大
型基板６に搭載された全てのチップを冷却すべく風が供
給される。この大型基板全体な冷却する冷風は、他の素
子を冷却するのには、十分な速度であるが、高発熱素子
を冷却するのには不十分である。フィン１の回転に応じ
て、モジュール８の上部へ供給される冷風は、大型基板
６全体を冷却する冷風を、更に、高速化して供給するの
でモジュール８は良好に冷却される。The fins 1 arranged in the cooling housing 7 rotate in response to vibrations of the ultrasonic element 2. According to the rotation, air is supplied to the top of the chip. Air is supplied to the upper part of the large board 6 in order to cool all the chips mounted on the large board 6. The cold air that cools the entire large substrate has a sufficient speed to cool other elements, but is insufficient to cool high heat generating elements. The cold air supplied to the upper part of the module 8 according to the rotation of the fin 1 cools the entire large substrate 6 at a higher speed, so that the module 8 is cooled well.
こうして、大型基板６の中で、特に１発熱量の大きなチ
ップを個別に冷却することができる。In this way, in the large substrate 6, chips that generate particularly large amounts of heat per unit can be individually cooled.
この実施例の効果は、モジュール８と一体化し１ている
ので、大型基板６への実装が容易である点である。また
、回転を与える素子として超音波を用いているので、ノ
イズや外乱が直流式モータと比較して少ない点である。The advantage of this embodiment is that since it is integrated with the module 8, it can be easily mounted on the large board 6. Furthermore, since ultrasonic waves are used as the element that provides rotation, noise and disturbances are less compared to DC motors.
次に、他の実施例について第３図、第４図を用いて説明
する。全体は、素子２１、冷却ハウジング７、基板６よ
り構成される６
冷却ファン１は、実施例１と同様に中央部に送風部分が
あり、周辺部は超音波振動子２に挾まれるつばが設置さ
れる。超音波素子２は、冷却ハウジング７の内部に設置
される。冷却ハウジング７は、大型基板６の上部に接続
子２３を介して設置される。その下部には、チップ４が
複数配置される。素子の接続配線２２は、大型基板６に
、直接、接続される。Next, another embodiment will be described using FIG. 3 and FIG. 4. The entire cooling fan 1 is composed of an element 21, a cooling housing 7, and a substrate 6. Similar to the first embodiment, the cooling fan 1 has an air blowing part in the center, and a collar that is sandwiched by the ultrasonic transducer 2 in the peripheral part. will be installed. The ultrasonic element 2 is installed inside the cooling housing 7. The cooling housing 7 is installed on the top of the large board 6 via the connector 23 . A plurality of chips 4 are arranged at the bottom thereof. The element connection wiring 22 is directly connected to the large substrate 6.
次に１本実施例２の動作について説明する。チップ４に
は接続配線２２を通して電力が供給される。チップ４で
発生した電力はチップ４の内部で熱となり、熱はチップ
１より外部へ放散される。Next, the operation of the second embodiment will be explained. Power is supplied to the chip 4 through the connection wiring 22. The power generated in the chip 4 becomes heat inside the chip 4, and the heat is dissipated from the chip 1 to the outside.
冷却ハウジング７に配置されたフィン１は、超音波素子
２の振動に対応して回転し、風がチップ４の上部へ供給
される。大型基板６の上部には、大型基板６に搭載され
た全てのチップを冷却すべく風が供給される。フィン１
の回転に応じて、複数のチップ４の上部へ供給される冷
風は、大型基板６の全体を冷却する冷風を、更に、高速
化し、大型基板６の中で特に発熱量の大きなチップを個
別に冷却することができる。The fins 1 arranged in the cooling housing 7 rotate in response to the vibrations of the ultrasonic element 2, and air is supplied to the top of the chip 4. Air is supplied to the upper part of the large board 6 in order to cool all the chips mounted on the large board 6. Fin 1
The cold air supplied to the upper part of the plurality of chips 4 according to the rotation of the large board 6 further increases the speed of the cold air that cools the entire large board 6, and individually cools the chips that generate a particularly large amount of heat in the large board 6. Can be cooled.
他の実施例の特有の効果は、大型基板６に、直接、冷却
ハウジング７を設置するので、モジュール８に振動が伝
わらず、チップ４の接続に信頼性をもたせられる点であ
る。A unique advantage of the other embodiments is that since the cooling housing 7 is installed directly on the large substrate 6, vibrations are not transmitted to the module 8 and the connection of the chip 4 can be made reliable.
本発明によれば１発熱量の高いチップを個別に冷却する
ことができるので、装置全体の冷却に要する負荷が軽減
され、低コストで信頼性の高い実装が可能となる。According to the present invention, chips that generate a large amount of heat per unit can be individually cooled, so the load required for cooling the entire device is reduced, and low-cost and highly reliable mounting is possible.
第１図は本発明の一実施例の平面図、第２図は、第１図
のｎ−ｎ矢視断面図、第３図は１本発明の他の実施例の
平面図、第４図は第３図のＴＶ −ｆＶ矢視断面図であ
る。FIG. 1 is a plan view of one embodiment of the present invention, FIG. 2 is a sectional view taken along the nn arrow in FIG. 1, FIG. 3 is a plan view of another embodiment of the present invention, and FIG. is a sectional view taken along the TV-fV arrow in FIG. 3;
Claims (1)
チップの上部、あるいは、周辺部に小型の回転翼をもつ
モータを前記チップと近接して配備することを特徴とす
るチップ個別冷却装置。 ２、計算機に使用するチップの冷却装置において、前記
チップ上部、あるいは、周辺部に小型の回転翼をもち、
超音波で駆動するモータを配備することを特徴とするチ
ップ個別冷却装置。[Claims] 1. A chip cooling device for use in a computer, characterized in that a motor having small rotary blades is disposed above or in the periphery of the chip in close proximity to the chip. Individual cooling device. 2. A cooling device for a chip used in a computer, which has a small rotary blade on the top of the chip or in the periphery,
An individual chip cooling device characterized by being equipped with a motor driven by ultrasonic waves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63235003A JPH0283958A (en) | 1988-09-21 | 1988-09-21 | Discrete chip cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63235003A JPH0283958A (en) | 1988-09-21 | 1988-09-21 | Discrete chip cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0283958A true JPH0283958A (en) | 1990-03-26 |
Family
ID=16979622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63235003A Pending JPH0283958A (en) | 1988-09-21 | 1988-09-21 | Discrete chip cooler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0283958A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162497A (en) * | 1990-10-24 | 1992-06-05 | Hitachi Ltd | Cooling device for electronic apparatus |
| DE19507662A1 (en) * | 1995-03-04 | 1996-09-26 | Robert Price | Power circuit cooling method for central processing unit of computer |
| US6219236B1 (en) | 1997-10-20 | 2001-04-17 | Fujitsu, Ltd. | Cooling system for multichip module |
| EP1056132A3 (en) * | 1992-08-06 | 2002-01-30 | Pfu Limited | Heat-generating element cooling device |
-
1988
- 1988-09-21 JP JP63235003A patent/JPH0283958A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162497A (en) * | 1990-10-24 | 1992-06-05 | Hitachi Ltd | Cooling device for electronic apparatus |
| EP1056132A3 (en) * | 1992-08-06 | 2002-01-30 | Pfu Limited | Heat-generating element cooling device |
| EP1056131A3 (en) * | 1992-08-06 | 2002-01-30 | Pfu Limited | Heat-generating element cooling device |
| DE19507662A1 (en) * | 1995-03-04 | 1996-09-26 | Robert Price | Power circuit cooling method for central processing unit of computer |
| US6219236B1 (en) | 1997-10-20 | 2001-04-17 | Fujitsu, Ltd. | Cooling system for multichip module |
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