JP3406394B2 - Local cooling device with Peltier effect member - Google Patents
Local cooling device with Peltier effect memberInfo
- Publication number
- JP3406394B2 JP3406394B2 JP20594494A JP20594494A JP3406394B2 JP 3406394 B2 JP3406394 B2 JP 3406394B2 JP 20594494 A JP20594494 A JP 20594494A JP 20594494 A JP20594494 A JP 20594494A JP 3406394 B2 JP3406394 B2 JP 3406394B2
- Authority
- JP
- Japan
- Prior art keywords
- effect member
- peltier effect
- heat sink
- fan motor
- impala
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims description 30
- 230000005679 Peltier effect Effects 0.000 title claims description 12
- 230000005855 radiation Effects 0.000 claims description 10
- 241000282813 Aepyceros melampus Species 0.000 claims description 9
- 230000000694 effects Effects 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 3
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Motor Or Generator Cooling System (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、コンピュータに搭載
される中央演算処理素子（ＣＰＵ，ＭＰＵ）を冷却する
局部冷却装置の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a local cooling device for cooling a central processing unit (CPU, MPU) mounted on a computer.
【０００２】[0002]
【従来の技術】パーソナルコンピユータなどのＯＡ機器
の発熱を防ぐためファンモータを後部に配して機器の内
部電子回路全体を空冷させるシステムがあり、最近のダ
ウンサイジング化によりこれらの回路の主要発熱部材、
たとえば発熱による故障など絶対にさけなくてはならな
い中央演算処理素子（ＣＰＵ，ＭＰＵ）などにヒートシ
ンクを配したものだけでは高集積化に伴う発熱を押さえ
きれず、さらに、これに一体化したファンモータで直接
冷却する方法、いわゆる局部冷却システムが採用されは
じめている。2. Description of the Related Art In order to prevent heat generation in office automation equipment such as personal computers, there is a system in which a fan motor is arranged at the rear part to cool the entire internal electronic circuits of the equipment, and recent downsizing has led to the main heat generating members of these circuits. ,
For example, a central processing unit (CPU, MPU), etc., which must be absolutely avoided in case of failure due to heat generation, cannot fully suppress heat generation due to high integration, and a fan motor integrated with it. The so-called local cooling system, which is a method of directly cooling in, has begun to be adopted.
【０００３】[0003]
【発明が解決しようとする課題】ところが、このような
構成では、冷却能力をアップさせるには、ヒートシンク
と共にファンモータのサイズを大にする必要があり、セ
ットの小型化に相容れないものとなっている。However, in such a structure, in order to increase the cooling capacity, it is necessary to increase the size of the fan motor together with the heat sink, which is incompatible with the miniaturization of the set. .
【０００４】この発明は、上記従来の問題点を克服する
ために創成したもので薄型でしかも冷却能力の高い局部
冷却装置を提供しようとするものである。The present invention has been made in order to overcome the above-mentioned conventional problems, and an object of the present invention is to provide a thin local cooling device having a high cooling capacity.
【０００５】[0005]
【０００６】[0006]
【０００７】上記課題は、請求項１に示す発明のよう
に、平坦な上面を有し、印刷配線板（Ｐ）に載置した中
央演算処理素子（ＭＰ）と、この中央演算処理素子の前
記平坦な上面に配した板状のペルチェ効果部材（Ｃ）
と、このペルチェ効果部材の上面に配され上方外周に多
数の放熱フィンを一体に有するヒートシンク（Ｈ１）
と、このヒートシンクのほぼ中央上面に、インパラ
（８）を有する小型冷却用ファンモータ（ＭＦ）が前記
外周の放熱フィンより上方に突き出ないように配され、
前記インパラ（８）によって外周部の放熱フィンに送風
するようにしたペルチェ効果部材を備えたもので達成で
きる。The above-mentioned problem is, as in the invention described in claim 1, the central processing element (MP) having a flat upper surface and mounted on the printed wiring board (P), and the central processing element of the central processing element. Plate-shaped Peltier effect member (C) placed on a flat upper surface
And a heat sink (H1) arranged on the upper surface of the Peltier effect member and integrally having a large number of heat radiation fins on the upper outer periphery.
A small cooling fan motor (MF) having an impala (8) is disposed on the upper surface of the center of the heat sink so as not to project above the heat radiation fins on the outer periphery.
This can be achieved by using a Peltier effect member configured to blow air to the radiation fins on the outer peripheral portion by the impala (8).
【０００８】さらに、別の手段として請求項２に示す発
明のように、前記小型冷却用ファンモータは、マグネッ
トケース（６）の中心に配されたシャフト（７）とこの
マグネットケースの内部に配された界磁マグネット
（５）と前記マグネットケースの外周に配されたインパ
ラ（８）とを備えたロータ（Ｒ）と、前記ヒートシンク
（Ｈ１）から一体に軸受ホルダ（２）を立ち上げ、この
軸受ホルダに内蔵した軸受（１）と、この軸受ホルダの
周囲に配され、前記界磁マグネット（５）に空隙を介し
て臨ませたステータコイル（３）とを有する請求項１に
記載のペルチェ効果部材を備えたもので達成できる。As another means, as in the invention described in claim 2, the small cooling fan motor is arranged inside the magnet case (6) and a shaft (7) arranged at the center of the magnet case (6). The bearing holder (2) is integrally launched from the heat sink (H1) and the rotor (R) including the field magnet (5) and the impala (8) arranged on the outer periphery of the magnet case. The Peltier device according to claim 1, further comprising a bearing (1) built in the bearing holder, and a stator coil (3) arranged around the bearing holder and facing the field magnet (5) through a gap. This can be achieved by using an effect member.
【０００９】[0009]
【００１０】[0010]
【００１１】請求項１に示す上記課題達成手段によれ
ば、小型冷却用ファンモータの一体化により、さらに一
層熱ポンプ作用が効果的になり、小型冷却用ファンモー
タを一体化しながらも、小型冷却用ファンモータの厚み
が無視できるので低姿勢にできる。According to the above-mentioned means for achieving the above object, the heat pump action becomes more effective by integrating the small cooling fan motor, and the small cooling fan motor is integrated while the small cooling fan motor is integrated. Since the thickness of the fan motor for use can be ignored, it can be placed in a low position.
【００１２】請求項２に示す上記課題達成手段によれ
ば、ヒートシンクの部材が小型冷却用ファンモータの部
材を兼ねることができ、薄型化とコストダウンができ
る。According to the above-mentioned means for achieving the above object, the member of the heat sink can also serve as the member of the small-sized cooling fan motor, and the reduction in thickness and cost can be achieved.
【００１３】[0013]
【第１の実施例】図１は、この発明の第１の実施例の概
略要部断面図で印刷配線板Ｐに載置した中央演算処理素
子（マイクロプロセッサ）ＭＰの放熱に利用したもので
ある。ペルチェ効果部材Ｃは、公知のＰ型半導体とＮ型
半導体を組み合わせて直流電流によって駆動させるもの
であり、ヒートシンクＨと前記の中央演算処理素子ＭＰ
の間に、例えば、ここではアルミ箔を基材とする薄い粘
着テープＡで取り付けられている。このペルチェ効果部
材Ｃの上半分の放熱側はヒートシンクＨの一部に少し埋
め込まれるようになっている。[First Embodiment] FIG. 1 is a schematic sectional view of a first embodiment of the present invention, which is used for heat dissipation of a central processing unit (microprocessor) MP mounted on a printed wiring board P. is there. The Peltier effect member C is a member that combines known P-type semiconductors and N-type semiconductors and is driven by a direct current, and includes a heat sink H and the central processing element MP.
For example, here, a thin adhesive tape A having an aluminum foil as a base material is attached. The heat radiation side of the upper half of the Peltier effect member C is slightly embedded in a part of the heat sink H.
【００１４】このようにすると薄型に配置することがで
きるし、放熱部の熱は下半分の冷却部に伝わりにくく放
熱効果がよい。しかも、動く部分がないため寿命は半永
久的なものとなる。In this way, it can be arranged in a thin shape, and the heat of the heat radiating portion is less likely to be transferred to the lower half cooling portion, and the heat radiating effect is good. Moreover, since there are no moving parts, the life is semi-permanent.
【００１５】[0015]
【第２の実施例】図２に示すものは、図１に更に小型な
小容量の冷却用ファンモータＭＦをヒートシンクに一体
化したものの要部断面図で、ヒートシンクはＨ１は、上
面に前記の実施例と同様に多数の放熱フィンが一体に立
ち上げられているが、ここでは、前記小型な小容量の冷
却用ファンモータＭＦを配置する部分が削除されてお
り、この小型冷却用ファンモータＭＦは、ヒートシンク
Ｈ１のほぼ中央で、このヒートシンクＨ１から一体に立
ち上げられた軸受けホルダ２に軸受け１，１が圧入さ
れ、この軸受けホルダ２の周囲に複数個のステータコイ
ル３…をフレキシブル基板４を介して載置し、このステ
ータコイル３に空隙を介して臨ませた界磁マグネット５
と、この界磁マグネット５を保持するヨークを兼ねたマ
グネットケース６からなるロータＲを、シャフト７を介
して前記軸受け１，１に回転自在に支承し、さらに前記
マグネットケース６の外周にインパラ８を取付けたもの
で、回転時にこのインパラによってその外周に配した前
記ヒートシンクＨ１の放熱フィンに送風する構成となっ
ている。[Second Embodiment] FIG. 2 is a cross-sectional view of an essential part of a cooling fan motor MF having a smaller capacity and a smaller capacity, which is integrated with a heat sink, as shown in FIG. Like the embodiment, a large number of heat radiation fins are integrally launched, but here, the portion for disposing the small-sized small-capacity cooling fan motor MF is deleted, and this small-sized cooling fan motor MF is removed. Is press-fitted into the bearing holder 2 integrally raised from the heat sink H1 at approximately the center of the heat sink H1, and around the bearing holder 2, a plurality of stator coils 3 ... The field magnet 5 placed on the stator coil 3 through the air gap.
And a rotor R composed of a magnet case 6 which also functions as a yoke for holding the field magnet 5, is rotatably supported by the bearings 1 and 1 via a shaft 7, and further, an impala 8 is provided on the outer circumference of the magnet case 6. Is attached to the heat radiation fins of the heat sink H1 arranged on the outer periphery of the impala during rotation.
【００１６】このようにすると、小型冷却用ファンモー
タＭＦによって一層冷却効果がよくなる。この場合、冷
却用ファンモータは小型なものでよいし、図示するよう
に高さをヒートシンクの上面の放熱フィンより出ないよ
うにしているので、姿勢を悪化させるおそれがない。With this configuration, the cooling effect is further improved by the small cooling fan motor MF. In this case, the cooling fan motor may be small in size, and as shown in the drawing, the height is set so as not to extend beyond the heat radiation fins on the upper surface of the heat sink, so that there is no fear of deteriorating the posture.
【００１７】[0017]
【発明の効果】この発明は、上述のようにペルチェ効果
部材をヒートシンクと中央演算処理素子（マイクロプロ
セッサ）との間に介挿するという簡単な構成で、コンパ
クトで薄型な冷却効果の高い局部冷却装置が提供でき、
小型冷却用ファンモータＭＦを一体化したものでは、さ
らに一層冷却効果がよくなる効果を奏する。As described above, the present invention has a simple structure in which the Peltier effect member is inserted between the heat sink and the central processing unit (microprocessor) as described above, and is a compact and thin local cooling device having a high cooling effect. Equipment can be provided,
Incorporating the small cooling fan motor MF has the effect of further improving the cooling effect.
【図１】本発明の局部冷却装置の第１の実施例の要部断
面図である。FIG. 1 is a cross-sectional view of essential parts of a first embodiment of a local cooling device of the present invention.
【図２】同第２の実施例の要部断面図である。FIG. 2 is a cross-sectional view of a main part of the second embodiment.
Ｐ 印刷配線板 Ｃ ペルチェ効果部材 ＭＰ マイクロプロセッサ Ａ 粘着テープ Ｈ ヒートシンク Ｈ１ ヒートシンク ＭＦ 小型ファンモータ １ 軸受け ２ 軸受けホルダ ３ ステータコイル ４ フレキシブル基板 ５ 界磁マグネット ６ マグネットケース ７ シャフト ８ インパラ P printed wiring board C Peltier effect member MP microprocessor A adhesive tape H heat sink H1 heat sink MF Small fan motor 1 bearing 2 bearing holder 3 stator coil 4 flexible board 5 field magnet 6 magnet case 7 shaft 8 Impala
フロントページの続き (56)参考文献 特開 昭58−137239（ＪＰ，Ａ) 特開 平５−129666（ＪＰ，Ａ) 実開 平２−138438（ＪＰ，Ｕ) 実開 平４−2050（ＪＰ，Ｕ) 実開 昭58−193636（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 35/28 Continuation of the front page (56) Reference JP 58-137239 (JP, A) JP 5-129666 (JP, A) Actual flat 2-138438 (JP, U) Actual flat 4-2050 (JP , U) Actual development Sho 58-193636 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 35/28
Claims (2)
載置した中央演算処理素子（ＭＰ）と、この中央演算処
理素子の前記平坦な上面に配した板状のペルチェ効果部
材（Ｃ）と、このペルチェ効果部材の上面に配され上方
外周に多数の放熱フィンを一体に有するヒートシンク
（Ｈ１）と、このヒートシンクのほぼ中央上面に、イン
パラ（８）を有する小型冷却用ファンモータ（ＭＦ）が
前記外周の放熱フィンより上方に突き出ないように配さ
れ、前記インパラ（８）によって外周部の放熱フィンに
送風するようにしたペルチェ効果部材を備えた局部冷却
装置。1. A central processing element (MP) having a flat upper surface and mounted on a printed wiring board (P), and a plate-shaped Peltier effect member disposed on the flat upper surface of the central processing element. (C), a heat sink (H1) disposed on the upper surface of the Peltier effect member and integrally having a large number of heat radiation fins on the upper outer periphery, and a small cooling fan motor having an impala (8) on the substantially central upper surface of the heat sink. A local cooling device provided with a Peltier effect member, in which (MF) is arranged so as not to project above the heat radiation fins on the outer circumference and is blown to the heat radiation fins on the outer circumference by the impala (8).
ットケース（６）の中心に配されたシャフト（７）とこ
のマグネットケースの内部に配された界磁マグネット
（５）と前記マグネットケースの外周に配されたインパ
ラ（８）とを備えたロータ（Ｒ）と、前記ヒートシンク
（Ｈ１）から一体に軸受ホルダ（２）を立ち上げ、この
軸受ホルダに内蔵した軸受（１）と、この軸受ホルダの
周囲に配され、前記界磁マグネット（５）に空隙を介し
て臨ませたステータコイル（３）とを有する請求項１に
記載のペルチェ効果部材を備えた局部冷却装置。2. The small cooling fan motor comprises a shaft (7) arranged at the center of a magnet case (6), a field magnet (5) arranged inside the magnet case, and an outer periphery of the magnet case. A rotor (R) provided with an impala (8) arranged in the above, and a bearing holder (2) integrally launched from the heat sink (H1), and a bearing (1) built in this bearing holder, and this bearing holder The local cooling device having a Peltier effect member according to claim 1, further comprising a stator coil (3) which is arranged around the coil and faces the field magnet (5) through a gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20594494A JP3406394B2 (en) | 1994-08-08 | 1994-08-08 | Local cooling device with Peltier effect member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20594494A JP3406394B2 (en) | 1994-08-08 | 1994-08-08 | Local cooling device with Peltier effect member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0851236A JPH0851236A (en) | 1996-02-20 |
| JP3406394B2 true JP3406394B2 (en) | 2003-05-12 |
Family
ID=16515305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20594494A Expired - Fee Related JP3406394B2 (en) | 1994-08-08 | 1994-08-08 | Local cooling device with Peltier effect member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3406394B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100912195B1 (en) * | 2008-01-11 | 2009-08-14 | 주식회사 케이에스비 | Cooling and warming apparatus |
| CN104913363A (en) * | 2015-07-06 | 2015-09-16 | 苏州斯洛莱自动化设备有限公司 | Range hood with motor cavity capable of being cooled |
-
1994
- 1994-08-08 JP JP20594494A patent/JP3406394B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0851236A (en) | 1996-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6702000B2 (en) | Heat sink apparatus, blower for use therein and electronic equipment using the same apparatus | |
| JP3377182B2 (en) | Fan motor | |
| JP4524376B2 (en) | Ultra-thin fan motor with heat sink | |
| US6386276B1 (en) | Heat-dissipating device | |
| US5926367A (en) | Method and apparatus for the thermal management of electronic devices | |
| US20080101966A1 (en) | High efficient compact radial blower | |
| JP7022265B2 (en) | Vacuum pump | |
| US20030210992A1 (en) | Heat-dissipating device | |
| US6141218A (en) | Cooling device for electronic apparatus | |
| JP4045628B2 (en) | Electronic equipment cooling system | |
| JP2002186222A (en) | Motor with built-in controller and vehicle loading the same | |
| JP2834996B2 (en) | heatsink | |
| US11121606B2 (en) | Motor, circuit board, and engine cooling module including the motor | |
| JP3406394B2 (en) | Local cooling device with Peltier effect member | |
| JP2003318337A (en) | Electronic instrument | |
| JPH11214877A (en) | Cooling device of electronic equipment and its cooling fan | |
| JP2004324551A (en) | Built-in pump | |
| JPH09308180A (en) | Heat radiator (heat sink) for semiconductor device fitted with brushless electric fan motor | |
| JPH1098853A (en) | Molded motor incorporating circuit | |
| JP3289414B2 (en) | Brushless motor fan | |
| JP2588254Y2 (en) | DC motor | |
| JPH0937516A (en) | Cooling fan motor | |
| JP3327063B2 (en) | Brushless motor | |
| JP2002223553A (en) | Dc brushless motor, and fan motor using the same | |
| JPH1066305A (en) | Fan motor with heat sink function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090307 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100307 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |