JPH01151296A - Cooling apparatus for electronic parts - Google Patents

Abstract

PURPOSE:To improve a packaging density of higher heating electronic parts, by arranging a compact fan so as to be opposed to a higher heating electronic parts packaged on a board and cooling by driving the fan by an ultrasonic motor. CONSTITUTION:A micro fan 20 which is about the same as or smaller than electronic parts 2 is arranged corresponding to each of higher heating electronic parts 2 packaged on a board 1 and rotated by an ultrasonic motor. As a result, since each of the higher heating electronic parts 2 packaged on the board 1 is directly cooled by the fan 20 provided corresponding to it, it can be effectively cooled without reference to the arranged position of the parts 2 on the board 1 and since the fan 20 for cooling is about the same as or smaller than the parts 2 to be cooled, a packaging density can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling technology for electronic equipment having high heat generation components, and relates to cooling technology for electronic equipment having high heat generation components. This paper relates to effective technology that can be used in cooling devices for large-scale computers, switchboards, etc.

[Conventional technology] In systems such as calculators and large-scale computers in which many LSI packages are mounted on a single board, the increase in heat generated by the heat generation is a bottleneck as the amount of heat generated increases as the speed of the LSI increases. This causes the inconvenience that the calculation speed cannot be increased.

Therefore, as shown in Figure 7, lead terminals 3 are placed on the board 1.
A heat sink 4 having a plurality of mutually parallel fins 4a is attached to the top surface of the LSI package 2 that is fixed at a A forced air cooling system has been implemented, which is mounted on a board (printed circuit board, etc.) 1 and cooled by flowing air over the entire board using a fan (not shown) (r Nikkei Electronics October 26, 1981).
(See Japanese issue, pages 190 to 198).

[Problems to be solved by the invention] In the conventional forced air cooling method, in which cooling is performed by attaching radiation fins to an LSI package, the height of the radiation fins is considerably larger than the package, resulting in a reduction in packaging density and Since the fan cools the board by flowing air in parallel with the board, the LSI on the downstream side is cooled by the air warmed on the upstream side. Therefore, if LSI packages are arranged on the board at equal intervals as shown in FIG. 7, the cooling efficiency of the LSI on the downstream side will decrease. the result,
The operating speed of the SI is restricted by the cooling efficiency of the LSI on the downstream side, resulting in a drawback that the calculation speed cannot be sufficiently improved.

This invention was made by focusing on the above-mentioned problems.In electronic devices such as LSIs in which a plurality of high-heating electronic components are mounted on a single board, the mounting density of high-heating electronic components can be reduced. It is an object of the present invention to provide a cooling device that can improve the cooling efficiency of each high heat generation electronic component and thereby improve the operating speed of the system.

[Means for Solving the Problems] In order to achieve the above object, the present invention arranges a micro fan of the same size or smaller size as the electronic component, corresponding to each of the high heat generation electronic components mounted on the board. However, an ultrasonic motor is provided for each fan, or a plurality of fans are attached to a rotating shaft that is arranged parallel to the board and rotated by the ultrasonic motor.

[Operation] According to the above-mentioned means, each high heat generation electronic component mounted on the board is directly cooled by the corresponding fan, so efficiency is improved regardless of the arrangement position of the component on the board. In addition to providing good cooling, the cooling fan is of the same size or smaller than the components to be cooled, improving packaging density.

Additionally, since we use ultrasonic motors that can be miniaturized as the motors that drive each cooling fan, it is possible to reduce the size to the same size or smaller even when installed one-on-one with the parts being cooled. In addition, unlike electromagnetic motors, they do not generate high-frequency electrical noise, so there is no risk of malfunction even if they are placed near cooled components.

[Example] FIG.
An example will be shown in which the present invention is applied to a cooling device suitable for cooling a C (multi-chip carrier) board.

In the cooling device of this embodiment, the MCC board 11 is approximately the same size as the MCC board on which the LSI is mounted.
A plurality of fan storage sections 12 are provided in a matrix so as to correspond one-to-one with the LSIs on the board. A guide frame 13 that is larger than the cooling fan is formed in each fan storage part 12 so as to slightly protrude from the top surface of the board 11, and a through hole 14 is formed in the board 11 inside the guide frame 13. It is formed. Furthermore, four fan-shaped ventilation holes 13b are formed in the upper support wall 13a of the guide frame 13, and a screw 26 (see FIG. 2) is screwed into the center of the support wall 13a for mounting a cooling fan. Screw holes 13c are respectively formed therein, and a cooling micro fan 20 whose driving source is an ultrasonic motor as shown in FIG. 2 is housed and fixed in the fan housing 12.

That is, in the micro fan 20 shown in FIG. 2, a piezoelectric element 22 is held between an aluminum base 21 and a trapezoidal aluminum horn 23. And aluminum horn 2
A rotating body 25 is attached to the lower surface of the rotor 3 via a torsion coupler 24.

The vibration of the piezoelectric element 22 is transmitted to the torsion coupler 24 by the aluminum horn 23, and the torsion coupler 24 changes the direction of the vibration to rotate the rotating body 25. Further, the rotating body 25 is provided with a plurality of fans 25a (four in the figure), and the screws 26 are used to tighten and integrate these parts 21 to 25 into the screw holes 13c of the fan housing 12. The micro fan 20 is installed in the fan storage section 12 of the board 11 by being screwed into the micro fan 20 .
A micro fan array arranged in a matrix is configured.

In this example, an ultrasonic motor is used as the drive source, so
It is possible to configure a microfan that is as small as or smaller than the LSI package to be cooled.

FIG. 3 shows an example of the structure of an MCC board cooling device using the above-mentioned microfan array.

In this embodiment, an MCC board 1 and a substrate 11 are arranged parallel to each other with an appropriate interval, and a micro fan array is placed directly above LSI packages 2, 2°, etc. mounted on the board 1. It is positioned so that each of the ten micro fans 20 comes. The rotation direction of each microfan 20 is determined so as to send air from top to bottom in the figure.

As a result, each LSI package 2 on the MCC board 1 has a corresponding micro fan 2.
0, cooling air is blown independently from each other. Therefore, cooling can be performed efficiently even if no cooling fins are attached to the package. In addition, since there is no need to provide cooling fins for each package, the height of the package is reduced, and even when multiple MCC boards are stacked and mounted in a case, the spacing between each board can be narrowed. The packaging density of LSI can be improved.

Furthermore, since an ultrasonic motor that does not generate electrical noise is used as the drive source for each microfan 20, there is no risk of malfunction of the LSI due to noise even if the fan and LSI are placed quite close to each other. .

Note that the air that has cooled each LSI package 2 flows out along the upper surface of the board 1.

FIG. 4 shows another example of a cooling device for an MCC board using a microfan array.

In this embodiment, microfan arrays IOA and IOB are arranged above and below MCC boards 1, respectively, and ventilation holes 5 are formed between each LSI package 2 of the MCC board 1. And MCC board 1
The upper microfan array IOA is arranged such that each microfan 20 faces the LSI package 2, and M
The microfan array IOB below the CC board 1 is positioned such that each microfan 20 faces the ventilation hole 5. The wind direction of both fans is the same direction (
(from top to bottom).

Therefore, in this embodiment, the wind blown toward the LSI package 2 by the upper microfan array IOA cools the LSI, passes through the ventilation hole 5 of the board, and is accelerated by the lower microfan array IOH. It will be leaked.

However, each fan of the microfan array IOH does not necessarily have to face the ventilation hole 5.

In the cooling structure shown in FIG. 3, there is a risk that the air blown onto the LSI by the adjacent microfans 20 will collide with each other, resulting in an air stagnation area, but in the structure shown in the embodiment shown in FIG. After cooling, the air quickly flows out through the ventilation holes 5, so that air stagnation does not occur and the LSI package can be cooled more effectively.

Although only one MCC board is shown in the embodiment shown in FIG. 4, there is an additional
By forming a so-called side switch structure in which a CC board is provided and micro fan arrays are further provided above and below the CC board, it is possible to apply the present invention to an electronic device including a plurality of boards.

FIG. 5 shows a third embodiment of an MCC board cooling device using a microfan array.

In this embodiment, the holding substrate 11 of the microfan array is
The fan housing 12 provided in the microfan 20 is tilted, and all the microfans 20 are installed in the fan housing 12 while being tilted in the same direction with respect to the board 11. Further, the microfan array 1o is arranged slightly shifted from the MCC board 1 so that the center of the LSI package 2 is located on an extension of the center line of each microfan 20.

In the cooling device of this embodiment, a micro fan 2 corresponding to the LSI package 2 on the MCC board 1 is provided.
Cooling air will now be blown diagonally from zero. Therefore, the air after cooling can easily flow in one direction along the MCC board 1, and as in the embodiment shown in FIG. 4, air stagnation is eliminated and efficient cooling is performed.

Furthermore, FIG. 6 shows another embodiment of the cooling device for the MCC board.

In this embodiment, a pair of support pieces 6 are provided on both sides of the MCC board 1, corresponding to each row of LSI packages on the board.
are erected, and an ultrasonic motor 30 is fixed horizontally inside each support piece 6. A rotating shaft 31, one end of which is fixed to each rotating body, is horizontally mounted between a pair of opposing ultrasonic motors 3°, and a rotating shaft 31 has a radial shape corresponding to the LSI package 2 on the board. fan 32
are attached to each.

In the cooling device of this embodiment as well, cooling air is blown onto each LSI package 2 on the MCC board 1 independently from each other by the fans 32 provided correspondingly, so that cooling is performed efficiently. In addition, since there is no need to provide cooling fins for each package, the height of the package is reduced, and when multiple MCC boards are stacked and mounted in a case, the spacing between each board can be narrowed, and the LSI mounting Density can be improved.

Moreover, an ultrasonic motor that does not generate electrical noise is used as the drive source for the fan 32.

There is no risk of malfunction of the LSI due to noise.

Further, by rotating each rotating shaft 31 in the same direction by the ultrasonic motor 3o, the air that cools each LSI package 2 can be made to flow in one direction along the upper surface of the board 1.

In the above embodiments, as an example, a standing wave type ultrasonic motor using a torsional vibrating element with high energy conversion efficiency was used as the drive source of the fan.
The present invention is not limited thereto, and it is also possible to use a traveling wave type ultrasonic motor.

[Effects of the Invention] As explained above, in the present invention, a micro fan of the same size or smaller than the component is arranged corresponding to each of the high heat generation electronic components mounted on the board, and each fan is A sonic motor is provided, or multiple fans are installed on a rotating shaft placed parallel to the board and rotated by the ultrasonic motor, so each high-heating electronic component is powered by a corresponding fan. Since it is directly cooled, it can be efficiently cooled regardless of the arrangement position of the electronic components on the board, and the dimensions of the cooling fan are the same or smaller than the components being cooled, improving packaging density. .

In addition, since an ultrasonic motor is used as the motor to open each cooling fan, it is possible to reduce the size to the same size or smaller even if it is installed one-on-one with the component to be cooled. Since it does not generate electrical noise, it has the advantage that there is no risk of malfunction even if it is placed near the components to be cooled.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional perspective view showing an embodiment of a fan holding board constituting an electronic component cooling device according to the present invention; FIG. 2 is a sectional front view showing an example of an ultrasonic motor for driving a fan; Figure 3 shows an LS on a board using a microfan array.
FIG. 2 is a schematic diagram showing an embodiment of the cooling device of I. FIG. 4 is a schematic diagram showing a second embodiment of the LSI cooling device on the board, FIG. 5 is a schematic diagram showing the third embodiment of the LSI cooling device on the board, and FIG. 6 is a schematic diagram showing the third embodiment of the LSI cooling device on the board. A schematic diagram showing the fourth embodiment of the above LSI cooling device, Fig. 7 is a front view showing an example of a conventional LSI cooling system, and Fig. 8 is an example of an MCC board on which an LSI with heat dissipation fins is mounted. FIG. 1... Board (multi-chip carrier board), 2... LSI package, 4... Heat sink,
5... Ventilation hole, 1o... Micro fan array, 11... Holding board, 12... Fan storage section,
20...Micro fan, 25a...Fan,
3o...Ultrasonic motor. Figure 3 Figure 4 Figure 5 Figure 6 Figure La 2

Claims (6)

[Claims] (1) At least a small fan is arranged opposite to the electronic components that generate a relatively large amount of heat mounted on the board, and these fans are driven by an ultrasonic motor to perform cooling. Cooling equipment for electronic components. (2) The electronic component cooling device according to claim 1, wherein the ultrasonic motor is provided for each fan. (3) A fan storage area is formed in a holding board that is approximately the same size as the board on which the electronic components are mounted, corresponding to the mounting position of the component to be cooled, and the fan and its drive are installed in these storage areas. 3. The cooling device for electronic components according to claim 2, further comprising a holding board that accommodates a motor and is arranged in parallel with the board. (4) A ventilation hole is formed in the board on which electronic components are mounted, and holding boards each having a fan are arranged on both sides of the board at appropriate intervals. Cooling equipment for electronic components. (5) Among the above-mentioned holding boards, the fan held in the storage section on one side faces the electronic components on the board, and the fan held on the other holding board faces the ventilation hole formed in the board. Claim 4 characterized in that
Cooling device for electronic components as described in section. (6) An ultrasonic motor is placed on the side of the board, a rotating shaft rotated by the ultrasonic motor is placed parallel to the board, and a fan facing the electronic components is attached to the rotating shaft. A cooling device for electronic components according to claim 1, characterized in that: