JPS61105461A - 工具折損検出装置 - Google Patents

工具折損検出装置

Info

Publication number
JPS61105461A
JPS61105461A JP59227195A JP22719584A JPS61105461A JP S61105461 A JPS61105461 A JP S61105461A JP 59227195 A JP59227195 A JP 59227195A JP 22719584 A JP22719584 A JP 22719584A JP S61105461 A JPS61105461 A JP S61105461A
Authority
JP
Japan
Prior art keywords
signal
tool
pseudo
sensor
breakage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59227195A
Other languages
English (en)
Japanese (ja)
Other versions
JPH055619B2 (enExample
Inventor
Kiyokazu Yoshimura
吉村　喜代和
Ryoichi Miyake
三宅　亮一
Tetsuro Iwakiri
岩切　哲朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP59227195A priority Critical patent/JPS61105461A/ja
Publication of JPS61105461A publication Critical patent/JPS61105461A/ja
Publication of JPH055619B2 publication Critical patent/JPH055619B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP59227195A 1984-10-29 1984-10-29 工具折損検出装置 Granted JPS61105461A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59227195A JPS61105461A (ja) 1984-10-29 1984-10-29 工具折損検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59227195A JPS61105461A (ja) 1984-10-29 1984-10-29 工具折損検出装置

Publications (2)

Publication Number Publication Date
JPS61105461A true JPS61105461A (ja) 1986-05-23
JPH055619B2 JPH055619B2 (enExample) 1993-01-22

Family

ID=16856981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59227195A Granted JPS61105461A (ja) 1984-10-29 1984-10-29 工具折損検出装置

Country Status (1)

Country Link
JP (1) JPS61105461A (enExample)

Also Published As

Publication number Publication date
JPH055619B2 (enExample) 1993-01-22

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