JPS61102001A - Lead frame for electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a lead frame used for manufacturing single-in-line type electronic components such as resistor networks and hybrid ICs.

(Conventional structure and its problems) In recent years, lead frames for electronic components of this type are frequently used for electronic components in single in-line packages, and the material cost of lead frames has a large impact on manufacturing costs. It has become important in manufacturing.

The structure of this type of lead frame and its manufacturing process will be explained below with reference to FIGS. 1, 2, and 3.

FIG. 2 (,) shows a conventional lead frame for electronic components of this kind, which has a strip-like thickness of 0.5 mm as shown in FIG. 1.
It is made by punching out a 2-0.3 m cold rolled steel plate or phosphor bronze plate using a press. In FIG. 2(,), reference numeral 1 denotes a terminal portion for connecting an electric circuit formed on the surface of a wiring board to the outside, and the terminal portion is bifurcated at the tip and is formed continuously at an equal pitch. 21.22 is a support part that supports the above terminal part,
A first side support portion 2 that provides side support on both sides of the terminal portion 10
1 and a second side support part 22. Said side support part 21
Holes 3 are provided at equal pitches at 22° and are used for transporting and positioning the lead frame. FIG. 3(a) shows a conventional example in which the terminal portion is formed in two series.
As is clear from the figure, terminal portions 11.12 are continuously provided symmetrically at equal pitches on both sides of the first side support portion 210,
Holes 3 are supported by the second Sh support part 22 and the third side support part 23, which are side support parts on both sides, and are bored at equal pitches.
Transfer and positioning are performed by

The manufacturing process for the conventional lead frame configured as described above will be described below.

First, the lead frame shown in FIG. 2(a) is fed into a press die, fed through the hole 3 and positioned on the die. Next, as shown in FIG. 2(b), the connection part between the terminal part 1 whose tip is bifurcated and the second side support part 22 is cut by press, and the hole 3 is inserted into the next press molding die. It is fed and positioned over the mold. Then, the terminal section 1
The bifurcated tip is press-molded to form a chestnut pucom 5 as shown in FIG. 2(c). Next, the substrate 1O is inserted between the tips 4a and 4b of the terminal portions of the lip comb 5, as shown in FIG. 2(c). Afterwards, it is soldered and painted to become a single in-line type electronic component as shown in FIG. If the terminal section shown in Figure 3 (,) is double,
As shown in FIGS. 3(b) and 3(c), the side support portions 22.23 on both sides are cut, and the tips of the terminal portions 11.12 are press-molded to form the clip comb 7. Next, the substrate 10.20 is inserted between the press-molded terminal tips 41a and 41b and between 42a and 42b.

However, in the above configuration, the material of the strip-shaped thin plate material shown in FIG. 1 is compared to the material shown in FIG.
The yield of material for the lead frame shown in a) and FIG.

(Object of the Invention) In view of the above-mentioned drawbacks, the present invention provides a lead frame for electronic components of this type that is inexpensive and enables a significant reduction in manufacturing costs through efficient material collection of the lead frame material. It is.

(Structure of the Invention) In order to achieve this object, the lead frame for electronic components of the present invention has conventional terminal parts that are continuously provided at equal pitches between one side support part and the other side support part. Terminal portions with terminal portions in opposite directions are alternately formed in between.

With the above configuration, a new terminal section can be constructed between conventional terminal sections, improving the efficiency of material removal for the lead frame, and greatly reducing material costs.

(Explanation of Examples) Embodiments of the present invention will be described below with reference to FIGS. 5 and 6.

The structure of the lead frame and its manufacturing process will be explained with reference to FIG.

FIG. 5(,) shows the structure of a lead frame for two electronic parts in the first embodiment of the present invention.

The difference between this embodiment and the configuration shown in FIG. 2(a) is shown in FIG.
, ), the terminal parts 12 are arranged alternately with the terminal parts 11 at a distance m = m/2 from the terminal parts 11 between the terminal parts 110 provided at an equal pitch with a pitch interval of t = 2.54 or 2.5. By providing the pitch n = 2.54 or 2.5, the efficiency of material removal for the terminal portion is increased.

The manufacturing process for the electronic component lead frame configured as described above is shown in FIG. 5(b).

This will be explained with reference to (c).

First, the lead frame shown in FIG. 5(,) is fed to a press mold and positioned on the mold by the hole 3. Next, as shown in FIG. 5(b), the connection portion between the terminal portion 11 and the second side support portion 22 and the connection portion between the terminal portion 12 and the first side support portion 21 are press cut, and then It is transferred to the press molding die through the hole 3 and positioned on the die. Figure 5(c) shows the bifurcated ends of the terminal parts 11 and 12.
As shown in the figure, press molding is performed to obtain chestnut f combs 5 and 6.

As described above, according to the first embodiment, by providing the terminal parts alternately at equal pitches between the first side support part and the second side support part, a series of clip combs can be produced from one lead frame. Two items are obtained, and the efficiency of material removal can be improved.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 6(,) shows an example of a lead frame in which terminal portions are formed in two series, and the difference from the structure of FIG. 1 Toward the side support part 21, between the terminal parts 11, at a position of distance m=pitch t/2 from the terminal part 11, pitch%=
2.54 or 2.5 is used to form the terminal portion 12, and the terminal portion 14 is provided symmetrically from the second side support portion 22, and the side portion is supported by the fourth side support portion 24. It is a point.

The manufacturing process of the electronic component lead frame constructed as described above will be described below with reference to FIGS. 6(b) and 6(c).

First, the lead frame shown in FIG. 6(,) is fed to a press mold and positioned on the mold by the hole 3. Next, as shown in FIG. 6(b), the connection part between the terminal part 11 and the second side support part 22, the connection part between the terminal part 13 and the third side support part 2,
3, the connection portion between the terminal portion 12 and the first side support portion 21, and the connection portion between the terminal portion 14 and the fourth side support portion 24 are press cut, respectively, and transferred to the next press molding die. It is transferred through hole 3 and positioned on the mold. And the above terminal part 1tl
The bifurcated tip of atlb+1e is press-molded as shown in FIG. 5(c) to obtain a double chestnut f-com 7.8.

As described above, according to the second embodiment, two double clip combs can be obtained from one IJ-do frame, and the efficiency of material removal can be improved.

FIG. 7 shows a third embodiment of the present invention, 15.1
6 is formed, and the same press cutting is performed thereafter.

A series of clip combs 5 and 6 and a double series of clip combs 7 and 8 are obtained by press molding.

(Effects of the Invention) As described above, the present invention provides terminal portions whose tips are bifurcated or trifurcated between one side support portion and the other side support portion alternately in opposite directions at equal pitches. By providing the same area vertically and horizontally, compared to the conventional example, if the terminal part dispersion of the lead frame in FIG. In the example of figure (,), 1.5 times, 7th
In the example shown in the figure (,), the dispersion of the terminal part is improved by 2°3 times,
It is possible to improve the efficiency of material extraction for this type of electronic component, and the effect in reducing material costs is significant.

[Brief explanation of the drawing]

Figure 1 is a diagram showing the lead frame material, Figure 2 (,) is a configuration diagram of a series of conventional lead frames, Figure 2 (b)
, (c) is an explanatory diagram of the manufacturing process of a series of conventional lead frames, Figure 3 (,) is a configuration diagram of a conventional double lead frame, and Figures 3 (b) and (C) are conventional double lead frames. An explanatory diagram of the manufacturing process of the lead frame. FIG. 4 is an external view showing an example of a completed single in-line type electronic component. FIG. A configuration diagram of the frame, FIG. 5(b). (c) is an explanatory diagram of the manufacturing process of the lead frame in the first embodiment of the present invention, FIG. 6 (,) is a block diagram of the lead frame in the second embodiment of the present invention, and FIG. 6 (b)
y (c) is an explanatory diagram of the manufacturing process of the lead frame in the second embodiment of the present invention, and FIG.
Fig. 7 (b) is a diagram showing the configuration of the lead frame in the embodiment.
) and (c) are process explanatory diagrams of a lead frame in a third embodiment of the present invention. 3... Hole, 5, 6... Series of clip combs, 7, 8
...Double clip comb, 10,20...Wiring board, 11. 12, 13, 14, 15. 16... Lead terminal part, 21... First side support part, 22... Second side support part, 23... Third side support part, 24 ...4th
Side support part, 41, 42, 43, 44, 45, 46...
・Tip of lead terminal. Figure 2 (c) Figure 3 (a) (b) Figure 5 (a) (b) Figure 5 Figure 6 (a) (b) (c)

Claims (1)

[Claims] A lead for electronic components that has lead terminal parts with bifurcated or trifurcated tips arranged at equal pitches between one side support part and the other side support part so that the tips are alternately oriented in opposite directions. flame.